Xilinx - XCZU9CG-1FBVB900I

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XCZU9CG-1FBVB900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU9CG-1FBVB900I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCZU9CG-1FBVB900I Datasheet
In Stock345
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .85 V
Maximum Supply Voltage: .876 V
Maximum Seated Height: 2.88 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 900
Package Equivalence Code: BGA900,30X30,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 31 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Bus Compatibility: I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
Width: 31 mm
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
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