Xilinx - XCZU9CG-1SFVC784I

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XCZU9CG-1SFVC784I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU9CG-1SFVC784I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;
Datasheet XCZU9CG-1SFVC784I Datasheet
In Stock253
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.32 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 784
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B784
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: FBGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: .876 V
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA78428X28,32
Length: 23 mm
Peak Reflow Temperature (C): 250
Bus Compatibility: I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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