Xilinx - XCZU9CG-2LFFVB1156E

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XCZU9CG-2LFFVB1156E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU9CG-2LFFVB1156E
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCZU9CG-2LFFVB1156E Datasheet
In Stock1,607
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.42 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 1156
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B1156
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
External Data Bus Width: 0
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA1156,34X34,40
Length: 35 mm
Peak Reflow Temperature (C): 245
Bus Compatibility: CAN, I2C, SPI, UART
Terminal Pitch: 1 mm
Temperature Grade: OTHER
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