Xilinx - XQ6VSX475T-1FFG1156M

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XQ6VSX475T-1FFG1156M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ6VSX475T-1FFG1156M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ6VSX475T-1FFG1156M Datasheet
In Stock849
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Organization: 37200 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.79 ns
Maximum Seated Height: 3.5 mm
No. of Inputs: 600
Surface Mount: Yes
No. of Outputs: 600
Position Of Terminal: Bottom
No. of Terminals: 1156
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1156
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
Technology Used: CMOS
No. of Logic Cells: 476160
No. of CLBs: 37200
JESD-609 Code: e1
Minimum Operating Temperature: -55 °C (-67 °F)
Package Equivalence Code: BGA1156,34X34,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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