Xilinx - XQ7A50T-L1CS325I

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XQ7A50T-L1CS325I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7A50T-L1CS325I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA324,18X18,32;
Datasheet XQ7A50T-L1CS325I Datasheet
In Stock54
NAME DESCRIPTION
Minimum Supply Voltage: .92 V
Package Body Material: Plastic
Maximum Combinatorial Delay of a CLB: 1.27 ns
No. of Inputs: 150
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 150
Position Of Terminal: Bottom
No. of Terminals: 324
Package Style (Meter): Grid Array, Fine Pitch
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 1098 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: FBGA
Width: 15 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: .98 V
Nominal Supply Voltage (V): .95
Technology Used: HKMG
No. of Logic Cells: 52160
No. of CLBs: 4075
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA324,18X18,32
Finishing Of Terminal Used: Tin/Lead
Length: 15 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Power Supplies (V): 0.95 V
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