Xilinx - XQ7Z020-1CL400Q

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XQ7Z020-1CL400Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7Z020-1CL400Q
Description MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XQ7Z020-1CL400Q Datasheet
In Stock284
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Ultraviolet Erasable: N
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.6 mm
Sub-Category: Other uPs/uCs/Peripheral ICs
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 400
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B400
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: LFBGA
Width: 17 mm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA400,20X20,32
Length: 17 mm
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Temperature Grade: AUTOMOTIVE
Power Supplies (V): 1,1.8
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