Xilinx - XQ7Z030-2RF676I

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XQ7Z030-2RF676I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7Z030-2RF676I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ7Z030-2RF676I Datasheet
In Stock274
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Ultraviolet Erasable: N
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.37 mm
Sub-Category: Other uPs/uCs/Peripheral ICs
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 676
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B676
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA676,26X26,40
Length: 27 mm
Peak Reflow Temperature (C): 225
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1,1.8
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