Xilinx - XQKU5P-1FFRB676M

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XQKU5P-1FFRB676M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQKU5P-1FFRB676M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQKU5P-1FFRB676M Datasheet
In Stock557
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: Plastic/Epoxy
Organization: 27120 CLBS
Maximum Time At Peak Reflow Temperature (s): 20 s
Maximum Seated Height: 3.67 mm
No. of Inputs: 304
Surface Mount: Yes
No. of Outputs: 304
Position Of Terminal: Bottom
No. of Terminals: 676
Package Style (Meter): Grid Array
Screening Level: MIL-PRF-38535
JESD-30 Code: S-PBGA-B676
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: .876 V
Nominal Supply Voltage (V): 0.85
No. of Logic Cells: 474600
No. of CLBs: 27120
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: Tin Lead
Length: 27 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
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