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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XQKU5P-1SFRB784M |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | XQKU5P-1SFRB784M Datasheet |
| In Stock | 559 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .825 V |
| Package Body Material: | Plastic/Epoxy |
| Organization: | 27120 CLBS |
| Maximum Time At Peak Reflow Temperature (s): | 20 s |
| Maximum Seated Height: | 3.52 mm |
| No. of Inputs: | 304 |
| Surface Mount: | Yes |
| No. of Outputs: | 304 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 784 |
| Package Style (Meter): | Grid Array, Fine Pitch |
| Screening Level: | MIL-PRF-38535 |
| JESD-30 Code: | S-PBGA-B784 |
| Package Shape: | Square |
| Maximum Operating Temperature: | 125 °C (257 °F) |
| Package Code: | FBGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Grading Of Temperature: | Military |
| Programmable IC Type: | FPGA |
| Maximum Supply Voltage: | .876 V |
| Nominal Supply Voltage (V): | 0.85 |
| No. of Logic Cells: | 474600 |
| No. of CLBs: | 27120 |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -55 °C (-67 °F) |
| Package Equivalence Code: | BGA784,28X28,32 |
| Finishing Of Terminal Used: | Tin Lead |
| Length: | 23 mm |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | .8 mm |
| Peak Reflow Temperature (C): | 225 °C (437 °F) |









