Xilinx - XQR2V1000-4FGG456R

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XQR2V1000-4FGG456R by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQR2V1000-4FGG456R
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQR2V1000-4FGG456R Datasheet
In Stock1,615
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 1280 CLBS, 1000000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.44 ns
Maximum Seated Height: 2.6 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 456
No. of Equivalent Gates: 1000000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B456
Maximum Clock Frequency: 650 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of CLBs: 1280
JESD-609 Code: e1
Minimum Operating Temperature: -55 °C (-67 °F)
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 23 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
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