Xilinx - XQV1000E-6BGG560N

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XQV1000E-6BGG560N by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQV1000E-6BGG560N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XQV1000E-6BGG560N Datasheet
In Stock205
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 6144 CLBS, 1569178 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.47 ns
Maximum Seated Height: 1.7 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 560
No. of Equivalent Gates: 1569178
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B560
Maximum Clock Frequency: 357.2 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: LBGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 27648
No. of CLBs: 6144
JESD-609 Code: e1
Minimum Operating Temperature: -55 °C (-67 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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