Xilinx - XQV2000E-6FG1156N

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XQV2000E-6FG1156N by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQV2000E-6FG1156N
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQV2000E-6FG1156N Datasheet
In Stock186
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 9600 CLBS, 2541952 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 2.6 mm
No. of Inputs: 804
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 804
Position Of Terminal: Bottom
No. of Terminals: 1156
No. of Equivalent Gates: 2541952
Package Style (Meter): Grid Array
Screening Level: 38535Q/M;38534H;883B
JESD-30 Code: S-PBGA-B1156
Maximum Clock Frequency: 357.2 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 43200
No. of CLBs: 9600
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Qualification: No
Package Equivalence Code: BGA1156,34X34,40
Finishing Of Terminal Used: Tin Lead
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 1.2/3.6,1.8 V
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