Xilinx - XQZU15EG-1FFRB1156M

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XQZU15EG-1FFRB1156M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQZU15EG-1FFRB1156M
Description PROGRAMMABLE SoC; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: .808 V;
Datasheet XQZU15EG-1FFRB1156M Datasheet
In Stock209
NAME DESCRIPTION
Minimum Supply Voltage: .808 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 3.62 mm
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 1156
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B1156
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: PROGRAMMABLE SoC
Maximum Supply Voltage: .892 V
JESD-609 Code: e0
Minimum Operating Temperature: -55 Cel
Package Equivalence Code: BGA1156,34X34,40
Length: 35 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
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