Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.5 V |
1 MHz |
1 |
CMOS |
MIL-STD-883 |
8 |
25 mA |
0.3906 % |
5 V |
Binary |
5,GND/-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
975 ns |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
2.5 V |
1 MHz |
1 |
CMOS |
MIL-STD-883 |
8 |
25 mA |
0.3906 % |
5 V |
Binary |
5,GND/-5 V |
Chip Carrier |
LCC20,.35SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-2.5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Gold |
Track |
Quad |
975 ns |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
Yes |
e4 |
0.35 in (8.89 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
1 |
Yes |
2.5 V |
250 MHz |
1 |
BICMOS |
16 |
0.0145 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC72,.39SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Quad |
4 ns |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Flash Method |
Industrial |
Butt |
124 |
HVBCC |
Square |
8 |
Yes |
1.26 V |
200 MHz |
1 |
16 |
226 mA |
1.2 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LGA124,18X18,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.14 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Bottom |
25 ns |
S-XBCC-B124 |
1 |
0.037 in (0.95 mm) |
0.354 in (9 mm) |
e4 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Gull Wing |
44 |
QFP |
Square |
1 |
Yes |
5.25 V |
10 MHz |
1 |
CMOS |
14 |
5 V |
Binary |
5 V |
Flatpack |
QFP44,.5SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Matte Tin |
Sample |
Quad |
S-XQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Flash Method |
Industrial |
Butt |
124 |
HVBCC |
Square |
8 |
Yes |
200 MHz |
1 |
TS 16949 |
14 |
1.2 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
85 °C (185 °F) |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Bottom |
5 ns |
S-XBCC-B124 |
1 |
0.037 in (0.95 mm) |
0.354 in (9 mm) |
e4 |
0.354 in (9 mm) |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Gull Wing |
44 |
QFP |
Square |
1 |
Yes |
5.25 V |
10 MHz |
1 |
CMOS |
14 |
5 V |
Binary |
5 V |
Flatpack |
QFP44,.5SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Matte Tin |
Sample |
Quad |
S-XQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.7 V |
105 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.7 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
4 |
Yes |
2.8 V |
125 MHz |
1 |
16 |
0.0153 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.8 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
25 ns |
S-XQCC-N56 |
3 |
0.031 in (0.8 mm) |
0.315 in (8 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
1.5 V |
130 MHz |
1 |
CMOS |
8 |
0.1172 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
7 ns |
S-XQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
1.75 V |
170 MHz |
1 |
12 |
0.0122 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
5.8 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
2 V |
50 MHz |
1 |
CMOS |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
475 mV |
15 MHz |
1 |
CMOS |
6 |
0.7812 % |
5 V |
Binary |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP24,.24 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0.341 in (8.65 mm) |
||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
15 MHz |
1 |
6 |
0.7812 % |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G24 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.341 in (8.65 mm) |
||||||||||||||||||
Murata Manufacturing |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
500 kHz |
1 |
Hybrid |
14 |
12 V |
Offset Binary |
5,±15 V |
-12 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Gold Over Nickel |
Sample |
Dual |
500 ns |
R-CDIP-T24 |
0.235 in (5.969 mm) |
0.6 in (15.24 mm) |
No |
e4 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Ball |
144 |
LFBGA |
Square |
Plastic/Epoxy |
16 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
14 |
0.0183 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Grid Array, Low Profile, Fine Pitch |
BGA144,12X12,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
100 ns |
S-PBGA-B144 |
3 |
0.067 in (1.7 mm) |
0.394 in (10 mm) |
No |
e1 |
0.394 in (10 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
12 |
0.0391 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.7 V |
65 MHz |
1 |
CMOS |
16 |
0.0076 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.7 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.35SQ,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
1 |
Yes |
2 V |
125 MHz |
1 |
16 |
202 mA |
0.006866 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
100 ns |
S-XQCC-N48 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Flash Method |
Industrial |
Butt |
124 |
HVBCC |
Square |
8 |
Yes |
200 MHz |
1 |
TS 16949 |
14 |
1.2 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
85 °C (185 °F) |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Bottom |
5 ns |
S-XBCC-B124 |
1 |
0.037 in (0.95 mm) |
0.354 in (9 mm) |
e4 |
0.354 in (9 mm) |
|||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.1 V |
625 kHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-PDIP-T20 |
1 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.027 in (26.075 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
4.9 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
2 µs |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
1.03 in (26.16 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
8 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
2 |
Yes |
5 V |
166 kHz |
1 |
CMOS |
16 |
5 V |
2's Complement Binary |
-5 V |
Chip Carrier |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
5.3 µs |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.5862 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.653 in (16.5862 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
5 V |
166 kHz |
1 |
CMOS |
16 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5 V |
Parallel, Word |
-40 °C (-40 °F) |
Sample |
Dual |
5.3 µs |
R-GDIP-T40 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.7 V |
80 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.7 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
16 |
0.01248 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
1.5 V |
100 MHz |
1 |
CMOS |
10 |
0.0781 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
10 ns |
S-XQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.35SQ,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
1.5 V |
100 MHz |
1 |
CMOS |
8 |
0.1172 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8/3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
10 ns |
S-XQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
10 MHz |
1 |
CMOS |
12 |
0.0305 % |
5 V |
Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
1.75 V |
250 MHz |
1 |
12 |
0.0195 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
4 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
VQCCN |
Square |
1 |
Yes |
2.4 V |
130 MHz |
1 |
CMOS |
16 |
208 mA |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.4 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
7.7 ns |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2.4 V |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
250 MHz |
1 |
12 |
190 mA |
0.0977 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.7 V |
25 MHz |
1 |
CMOS |
16 |
0.0046 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.7 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.35SQ,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
9 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
68 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2.4 V |
160 MHz |
1 |
CMOS |
16 |
374 mA |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC68,.4SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.4 V |
Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Sample |
Quad |
6.25 ns |
S-PQCC-N68 |
4 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
No |
Peak-to-peak input voltage range: 2, 2.4 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2 V |
10 MHz |
1 |
10 |
0.1465 % |
5 V |
2's Complement Binary |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
100 ns |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
245 °C (473 °F) |
0.402 in (10.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
10 MHz |
1 |
10 |
0.1465 % |
5 V |
2's Complement Binary |
3.3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
100 ns |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
68 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2.4 V |
160 MHz |
1 |
CMOS |
16 |
374 mA |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC68,.4SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.4 V |
Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Sample |
Quad |
6.25 ns |
S-PQCC-N68 |
4 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
No |
Peak-to-peak input voltage range: 2, 2.4 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0427 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.35SQ,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
100 MHz |
1 |
CMOS |
8 |
0.3906 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G48 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0.276 in (7 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
100 MHz |
1 |
CMOS |
8 |
0.3906 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0427 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.35SQ,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.