Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4 V |
40 MHz |
1 |
CMOS |
14 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.7 V |
25 MHz |
1 |
CMOS |
16 |
0.0046 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.7 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
16 |
0.0084 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
8 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
65 MHz |
1 |
10 |
0.0732 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0427 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
16 |
0.0069 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
12 |
0.0293 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
|||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
8 |
27 mA |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.3 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Dual |
25 ns |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.591 in (15 mm) |
||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Ball |
144 |
LFBGA |
Square |
Plastic/Epoxy |
16 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
14 |
0.0183 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Grid Array, Low Profile, Fine Pitch |
BGA144,12X12,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
100 ns |
S-PBGA-B144 |
3 |
0.067 in (1.7 mm) |
0.394 in (10 mm) |
No |
e1 |
0.394 in (10 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Gull Wing |
100 |
HQFP |
Rectangular |
Plastic/Epoxy |
3 |
Yes |
512 mV |
100 MHz |
1 |
BICMOS |
8 |
0.6836 % |
5 V |
Binary |
3.3/5 V |
Flatpack, Heat Sink/Slug |
QFP100,.7X.9 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
R-PQFP-G100 |
5 |
0.134 in (3.4 mm) |
0.551 in (14 mm) |
No |
e0 |
225 °C (437 °F) |
0.787 in (20 mm) |
|||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
128 |
HLFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
810 mV |
3000 MHz |
1 |
CMOS |
8 |
800 mA |
0.3516 % |
1.9 V |
Offset Binary |
1.9 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP128,.87SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-810 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
0.33 ns |
S-PQFP-G128 |
3 |
0.063 in (1.6 mm) |
0.787 in (20 mm) |
No |
Peak-to-peak input voltage range: 0.81 V |
e3 |
30 s |
260 °C (500 °F) |
0.787 in (20 mm) |
||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
125 MHz |
1 |
14 |
150 mA |
0.03 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Nickel/Palladium/Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
14 |
0.0314 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
16 |
0.0078 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
9.5 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
12 |
0.0391 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
9.5 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
1.75 V |
250 MHz |
1 |
CMOS |
14 |
0.0153 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.75 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
4 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
6.3 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.473 in (37.425 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
1.5 MHz |
1 |
CMOS |
12 |
0.0305 % |
5 V |
Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
160 MHz |
1 |
12 |
150 mA |
0.0854 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Nickel/Palladium/Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
2.4 µs |
R-PDIP-T24 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.165 in (29.59 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
50 kHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2.4 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
14 |
0.0079 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Ball |
144 |
LFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
310 MHz |
1 |
16 |
3.3 V |
Offset Binary, 2's Complement Binary, Gray Code |
Grid Array, Low Profile, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2.5 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
12.5 ns |
S-PBGA-B144 |
3 |
0.055 in (1.4 mm) |
0.394 in (10 mm) |
e1 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
1.5 V |
130 MHz |
1 |
CMOS |
10 |
0.0781 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
7.6 ns |
S-XQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial Extended |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
8 |
27 mA |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.3 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
75 °C (167 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.591 in (15 mm) |
|||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial Extended |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.3 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
75 °C (167 °F) |
0 mV |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.591 in (15 mm) |
|||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial Extended |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.3 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
75 °C (167 °F) |
0 mV |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Sample |
Dual |
R-PDSO-G24 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
0.591 in (15 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial Extended |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
8 |
27 mA |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.3 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
75 °C (167 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.591 in (15 mm) |
|||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial Extended |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.3 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
75 °C (167 °F) |
0 mV |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDSO-G24 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.591 in (15 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
VQCCN |
Square |
1 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
10 |
0.1172 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
2 V |
50 MHz |
1 |
CMOS |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
1 |
Yes |
2 V |
105 MHz |
1 |
16 |
176 mA |
0.00534 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
100 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
2 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
12 |
0.0269 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
100 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
2 |
Yes |
512 mV |
45 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
2 |
Yes |
512 mV |
45 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
Microchip Technology |
Analog To Digital Converter, Flash Method |
Automotive |
Ball |
121 |
TFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
4.46 V |
200 MHz |
1 |
AEC-Q100 |
16 |
300 mA |
1.2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Thin Profile, Fine Pitch |
BGA121,11X11,25 |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-4.46 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Sample |
Bottom |
25 ns |
S-PBGA-B121 |
0.043 in (1.08 mm) |
0.315 in (8 mm) |
0.315 in (8 mm) |
|||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial Extended |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
8 |
27 mA |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
75 °C (167 °F) |
-2 V |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDSO-G24 |
2 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
|||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
420 ns |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
420 ns |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
420 ns |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
40 MHz |
1 |
BICMOS |
8 |
0.7812 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.283 in (7.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
80 MHz |
1 |
BICMOS |
8 |
0.7812 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.283 in (7.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
1 |
Yes |
2.5 V |
200 MHz |
1 |
BICMOS |
16 |
0.0145 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC72,.39SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Quad |
5 ns |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
10 |
0.0439 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.014 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
9.52 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
14 |
0.0079 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
25 ns |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.7 V |
105 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.7 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.7 V |
80 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.7 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.