Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
8 V |
658 kHz |
1 |
CMOS |
8 |
15 mA |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
4.5 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
2.5 µs |
R-PDSO-G20 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
VQCCN |
Square |
1 |
Yes |
2.4 V |
130 MHz |
1 |
CMOS |
16 |
208 mA |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.4 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
7.7 ns |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2.4 V |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
VQCCN |
Square |
1 |
Yes |
2.4 V |
130 MHz |
1 |
CMOS |
16 |
208 mA |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3 V |
Chip Carrier, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.4 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
7.7 ns |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2.4 V |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
80 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
840 mV |
800 MHz |
1 |
6 |
1.5625 % |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP80,.55SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
760 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
e0 |
0.472 in (12 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
80 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
840 mV |
800 MHz |
1 |
6 |
1.5625 % |
5 V |
2's Complement Binary |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
760 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.25 V |
1 MHz |
1 |
BICMOS |
8 |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-5.25 V |
Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Track |
Dual |
865 ns |
R-PDSO-G24 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0.323 in (8.2 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5 V |
1 MHz |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Dual |
875 ns |
R-PDSO-G24 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.323 in (8.2 mm) |
|||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Flash Method |
Industrial |
Butt |
124 |
HVBCC |
Square |
8 |
Yes |
1.26 V |
200 MHz |
1 |
16 |
226 mA |
1.2 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LGA124,18X18,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.14 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Bottom |
25 ns |
S-XBCC-B124 |
1 |
0.037 in (0.95 mm) |
0.354 in (9 mm) |
e4 |
0.354 in (9 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial Extended |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
75 °C (167 °F) |
0 mV |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDSO-G24 |
2 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
10 |
0.1172 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
3 MHz |
1 |
CMOS |
12 |
0.0305 % |
5 V |
Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
65 MHz |
1 |
CMOS |
12 |
0.0391 % |
5 V |
Binary, 2's Complement Binary |
3,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
14 |
0.0339 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
12 |
0.0085 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
13 ns |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
150 MHz |
1 |
CMOS |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
7 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
|||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
68 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2.4 V |
160 MHz |
1 |
CMOS |
16 |
374 mA |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC68,.4SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.4 V |
Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Sample |
Quad |
6.25 ns |
S-PQCC-N68 |
4 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
No |
Peak-to-peak input voltage range: 2, 2.4 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
10 |
0.166 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G48 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
10 |
0.166 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
2 |
Yes |
512 mV |
45 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
2 |
Yes |
512 mV |
45 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
8 V |
400 kHz |
1 |
CMOS |
8 |
15 mA |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
4.5 V |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Nickel Palladium Gold |
Track |
Dual |
2.5 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
8 V |
400 kHz |
1 |
CMOS |
8 |
15 mA |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
4.5 V |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
2.5 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
10 MHz |
1 |
CMOS |
12 |
0.0305 % |
5 V |
Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0427 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
14 |
0.0189 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
25 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Renesas Electronics |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.8 V |
20 MHz |
1 |
CMOS |
8 |
0.5078 % |
5 V |
Binary |
Small Outline |
SOP24,.3 |
85 °C (185 °F) |
-2.8 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Sample |
Dual |
50 ns |
R-PDSO-G24 |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
14 |
0.0079 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
15 ns |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
1 |
Yes |
1.6 V |
500 MHz |
1 |
BICMOS |
12 |
0.032 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC56,.31SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.6 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
2 ns |
S-XQCC-N56 |
3 |
0.039 in (1 mm) |
0.315 in (8 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
14 |
0.0208 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4 V |
65 MHz |
1 |
CMOS |
14 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Renesas Electronics |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
18 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
30 MHz |
1 |
CMOS |
6 |
3.125 % |
5 V |
Binary |
Small Outline |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
33.3 ns |
R-PDSO-G18 |
||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
10 |
0.1172 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
1 |
Yes |
1.6 V |
370 MHz |
1 |
BICMOS |
12 |
0.0225 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC56,.31SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.6 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
2.73 ns |
S-XQCC-N56 |
3 |
0.039 in (1 mm) |
0.315 in (8 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.315 in (8 mm) |
|||||||||||
Renesas Electronics |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
5 MHz |
1 |
BICMOS |
1 |
100 % |
5 V |
Offset Binary |
Small Outline |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Sample |
Dual |
200 ns |
R-PDSO-G28 |
||||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Ball |
192 |
LBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
525 mV |
1500 MHz |
1 |
Bipolar |
8 |
0.1953 % |
5 V |
Offset Binary |
3.3/5,±5 V |
-5 V |
Grid Array, Low Profile |
BGA192,16X16,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
475 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Track |
Bottom |
S-PBGA-B192 |
3 |
0.066 in (1.67 mm) |
0.984 in (25 mm) |
No |
0.984 in (25 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
12 |
0.0098 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
25 ns |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
1.75 V |
250 MHz |
1 |
14 |
0.0214 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
4 ns |
S-XQCC-N64 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
14 |
0.0189 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.25 V |
1 MHz |
1 |
BICMOS |
8 |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-5.25 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin/Lead |
Track |
Dual |
865 ns |
R-PDSO-G24 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0.323 in (8.2 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
SSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5 V |
1 MHz |
1 |
CMOS |
8 |
20 mA |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
875 ns |
R-PDSO-G24 |
1 |
0.078 in (1.99 mm) |
0.208 in (5.29 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.323 in (8.2 mm) |
|||||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.6 V |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Track |
Dual |
0.9 ns |
R-PDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
1.027 in (26.075 mm) |
|||||||||||||||||
National Semiconductor |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
6.1 V |
1.5 MHz |
1 |
CMOS |
8 |
20 mA |
0.4 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
560 ns |
R-PDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.027 in (26.075 mm) |
|||||||||||||
Intersil |
Analog To Digital Converter, Flash Method |
Commercial Extended |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
20 MHz |
1 |
CMOS |
8 |
0.5078 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.4 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
75 °C (167 °F) |
500 mV |
Parallel, 8 Bits |
-20 °C (-4 °F) |
Tin Lead |
Sample |
Dual |
50 ns |
R-PDIP-T24 |
0.161 in (4.1 mm) |
0.4 in (10.16 mm) |
No |
e0 |
1.195 in (30.35 mm) |
||||||||||||||
Renesas Electronics |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
500 mV |
40 MHz |
1 |
CMOS |
10 |
0.1953 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline |
SOP28,.4 |
70 °C (158 °F) |
-500 mV |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
25 ns |
R-PDSO-G28 |
|||||||||||||||||||||||
Raytheon Semiconductor |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
0 mV |
20 MHz |
1 |
Bipolar |
8 |
260 mA |
0.2 % |
5 V |
Binary, 2's Complement Binary, Complementary Binary, Complementary 2's Complement |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-2 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
Yes |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary, Offset Binary |
5,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-2.5 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
660 ns |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.4 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.