Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
8.1 V |
625 kHz |
1 |
CMOS |
8 |
15 mA |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
4.5 V |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-100 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Nickel/Palladium/Gold |
Track |
Dual |
2.5 µs |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e4 |
260 °C (500 °F) |
0.504 in (12.8 mm) |
|||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10.2 V |
625 kHz |
1 |
CMOS |
8 |
13 mA |
0.195 % |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-200 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Track |
Dual |
2.5 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
0.953 in (24.195 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
5.6 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-100 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Track |
Dual |
0.9 ns |
R-PDSO-G20 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
0.504 in (12.8015 mm) |
|||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10.2 V |
625 kHz |
1 |
CMOS |
8 |
13 mA |
0.195 % |
5 V |
Binary |
5 V |
Small Outline |
SOP20,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-200 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Track |
Dual |
2.5 µs |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
0.504 in (12.8 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
160 MHz |
1 |
14 |
150 mA |
0.03 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Nickel/Palladium/Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
10.2 V |
625 kHz |
1 |
CMOS |
8 |
13 mA |
0.195 % |
5 V |
Binary |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-200 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Track |
Quad |
2.5 µs |
S-PQCC-J20 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
0.353 in (8.9662 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Flash Method |
Other |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3.3 V |
10 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Binary |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-35 °C (-31 °F) |
Dual |
R-PDSO-G24 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
0.307 in (7.8 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
500 mV |
325 MHz |
1 |
Bipolar |
8 |
495 mA |
0.39 % |
Offset Binary, 2's Complement Binary |
-5.2 V |
Flatpack |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-6 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Quad |
3.3 ns |
S-CQFP-G68 |
0.118 in (2.997 mm) |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
7 V |
1 |
10 |
0.098 % |
5 V |
Offset Binary |
-5 V |
Chip Carrier |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-7 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
25 ns |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1.024 V |
31 MHz |
1 |
Bipolar |
12 |
260 mA |
0.0732 % |
5 V |
Offset Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
250 ns |
R-CDIP-T28 |
0.284 in (7.21 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.4 in (35.56 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
1.75 V |
170 MHz |
1 |
CMOS |
14 |
0.0079 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.75 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
5.8 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
9 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
1 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0073 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
8 ns |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
VQCCN |
Square |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
10 |
0.1172 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e0 |
240 °C (464 °F) |
0.197 in (5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
65 MHz |
1 |
CMOS |
12 |
0.0391 % |
5 V |
Binary, 2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
500 mV |
150 MHz |
1 |
Bipolar |
8 |
175 mA |
0.39 % |
Binary |
-5.2 V |
-5.2 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-6 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Quad |
8 ns |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
0.453 in (11.5062 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
5 V |
128 kHz |
1 |
BICMOS |
14 |
34 mA |
0.0122 % |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
Chip Carrier |
LCC44,.65SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Quad |
6.3 µs |
S-CQCC-J44 |
0.135 in (3.42 mm) |
0.65 in (16.51 mm) |
No |
e0 |
0.65 in (16.51 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
500 mV |
325 MHz |
1 |
Bipolar |
8 |
475 mA |
0.39 % |
Offset Binary, 2's Complement Binary |
-5.2 V |
-5.2 V |
Flatpack |
QFP68,1.1SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-6 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Quad |
3.3 ns |
S-CQFP-G68 |
0.118 in (2.997 mm) |
0.95 in (24.13 mm) |
No |
e0 |
0.95 in (24.13 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
1 |
Yes |
2 V |
150 MHz |
1 |
CMOS |
12 |
0.0317 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
6.6 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
4 |
No |
5 V |
100 kHz |
1 |
CMOS |
8 |
0.1953 % |
5 V |
Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
2.4 µs |
R-PDIP-T24 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.165 in (29.59 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.39 % |
5 V |
Binary, Offset Binary |
5,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
660 ns |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
150 MHz |
1 |
CMOS |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
7 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 V |
10 MHz |
1 |
BICMOS |
12 |
147 mA |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LCC44,.65SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
100 ns |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.545 mm) |
No |
e0 |
0.651 in (16.545 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
1.1 MHz |
1 |
BICMOS |
12 |
35 mA |
0.048 % |
5 V |
Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
100 ns |
S-PQCC-J28 |
5 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
225 °C (437 °F) |
0.453 in (11.5062 mm) |
||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
7.3 V |
1 |
CMOS |
16 |
30 mA |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-7.3 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
5.3 µs |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
0.453 in (11.5062 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0085 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
8 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
40 MHz |
1 |
BICMOS |
8 |
0.7812 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.283 in (7.2 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
7.3 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.992 in (25.2 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
10 |
0.0391 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Gull Wing |
68 |
QFP |
Square |
1 |
Yes |
1.75 V |
60 MHz |
1 |
Bipolar |
MIL-STD-883 |
10 |
0.2441 % |
5 V |
Offset Binary, 2's Complement Binary |
±5 V |
-5 V |
Flatpack |
QFP68,1.1SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-1.75 V |
Parallel, Word |
-55 °C (-67 °F) |
Gold |
Quad |
S-XQFP-G68 |
0.95 in (24.13 mm) |
No |
e4 |
0.95 in (24.13 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
8 |
Yes |
5 V |
50 kHz |
1 |
BICMOS |
8 |
20 mA |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
2 µs |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
1 |
Yes |
2 V |
80 MHz |
1 |
16 |
131 mA |
0.003814 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
100 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
12 |
0.0391 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
8 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
500 mV |
38 MHz |
1 |
Bipolar |
8 |
110 mA |
0.195 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-7 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
29 ns |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
2 MHz |
1 |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.382 in (9.7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.014 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
9.52 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G24 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
2 MHz |
1 |
CMOS |
8 |
0.293 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
420 ns |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.382 in (9.7 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
46 |
DIP |
Rectangular |
Metal |
1 |
No |
1.024 V |
10 MHz |
1 |
Bipolar |
38535Q/M;38534H;883B |
12 |
250 mA |
0.0549 % |
15 V |
Binary |
5,-5.2,±15 V |
-15 V |
In-Line |
DIP46,1.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-MDIP-T46 |
0.231 in (5.87 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1 MHz |
1 |
CMOS |
8 |
0.1953 % |
3 V |
Binary |
3/5 V |
Small Outline |
SOP8,.25 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
105 °C (221 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
420 ns |
R-PDSO-G8 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
260 °C (500 °F) |
0.193 in (4.9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N48 |
3 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
1.1 MHz |
1 |
BICMOS |
12 |
35 mA |
0.048 % |
5 V |
Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
100 ns |
S-PQCC-J28 |
5 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
225 °C (437 °F) |
0.453 in (11.5062 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
100 MHz |
1 |
8 |
0.2539 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Pin/Peg |
37 |
Rectangular |
1 |
No |
4 V |
10 MHz |
1 |
Hybrid |
14 |
0.009 % |
15 V |
Binary |
5,-5.2,±15 V |
-15 V |
Microelectronic Assembly |
DIE OR CHIP |
Analog to Digital Converters |
70 °C (158 °F) |
-4 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
R-XQMA-P37 |
No |
e0 |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Gull Wing |
48 |
LQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
1 |
CMOS |
10 |
34 mA |
0.2441 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Flatpack, Low Profile |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
67 ns |
S-PQFP-G48 |
0.067 in (1.7 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
10 |
0.0977 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
20 |
DIE |
1 |
Yes |
5 V |
1 |
CMOS |
8 |
0.3906 % |
5 V |
Binary |
5 V |
Uncased Chip |
DIE OR CHIP |
Analog to Digital Converters |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Track |
Upper |
1.36 µs |
X-XUUC-N20 |
No |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
5 MHz |
1 |
BICMOS |
12 |
5 V |
Offset Binary, 2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin/Lead (Sn63Pb37) |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.