Analog To Digital Converter, Proprietary Method Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC1407AHMSE#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

2.5 V

3 MHz

1

CMOS

14

0.0244 %

3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

22.6666 µs

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2288IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

65 MHz

2

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2145IUP-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

125 MHz

1

CMOS

14

0.0159 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC1407IMSE-1#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

1.25 V

3 MHz

1

12

0.0488 %

3 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Tin/Lead

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

LTC2190CUKG#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2 V

25 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.315 in (8 mm)

LTC2250IUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2296CUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

2

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

5962-9092702M3X

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

1

Yes

35 MHz

1

MIL-STD-883

8

0.3906 %

5 V

Binary

-5.2 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

LTC2164CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.25 V

105 MHz

1

CMOS

16

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

700 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N48

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

5962-9961003HXX

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

2

Yes

5 V

105 MHz

1

MIL-PRF-38534 Class H

12

0.0732 %

5 V

Binary

Flatpack

0.05 in (1.27 mm)

125 °C (257 °F)

400 mV

Parallel, Word

-55 °C (-67 °F)

Quad

9.5 µs

S-CQFP-G68

0.31 in (7.87 mm)

0.95 in (24.13 mm)

Yes

0.95 in (24.13 mm)

AD7778AS

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

8

Yes

3 V

1

CMOS

10

0.0977 %

5 V

2's Complement Binary

5 V

Flatpack

QFP44,.57SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0.394 in (10 mm)

AD9216BCPZRL7-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

65 MHz

1

CMOS

10

0.1367 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC1744IFW#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.6 V

50 MHz

1

CMOS

14

0.0244 %

5 V

Offset Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1.6 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G48

1

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e0

0.492 in (12.5 mm)

AD9625BBP-2.6

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.1 V

2.6 MHz

1

12

0.0562 %

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.1 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

20 s

240 °C (464 °F)

0.472 in (12 mm)

AD9225ARZRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

25 MHz

1

CMOS

12

0.061 %

5 V

Binary

3/5,5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

AD7890AN-4

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

4.096 V

117 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

5.9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

LTC2141IUP-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

40 MHz

1

CMOS

14

0.0146 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9202JRSRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5.5 V

32 MHz

1

CMOS

10

0.2832 %

3 V

Binary

3/5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

LTC2223CUK

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

12

0.0269 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

AD876JR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

20 MHz

1

CMOS

10

5 V

Binary

3.3,5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

50 ns

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

AD9003A

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

40

Rectangular

1

No

2.5 V

1 MHz

1

12

0.0366 %

15 V

Complementary Binary, Complementary Offset Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

560 ns

R-XDMA-X40

No

e0

LTC2255IUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2252IUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

12

0.0366 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD9260ASRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

4.5 V

20 MHz

1

CMOS

16

5 V

2's Complement Binary

3/5,5 V

Flatpack

QFP44,.5SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

500 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Quad

S-PQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0.394 in (10 mm)

AD12400JWS

Analog Devices

Analog To Digital Converter, Proprietary Method

1

400 MHz

1

12

3.8 V

2's Complement Binary

Parallel, Word

No

AD9625BBPZ-2.6

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.1 V

2.6 MHz

1

12

0.0562 %

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.1 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

LTC1406CGN

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5 V

20 MHz

1

8

40 mA

0.3906 %

5 V

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

R-PDSO-G24

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e0

0.341 in (8.65 mm)

LTC2215CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

65 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2270IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

2.1 V

20 MHz

1

CMOS

16

0.0035 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9625BBP-2.5

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.2 V

2.5 MHz

1

12

0.0513 %

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

20 s

240 °C (464 °F)

0.472 in (12 mm)

CAV-1040

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

36

1

No

4 V

40 MHz

1

10

0.5 %

15 V

Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-4 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

X-XXMA-X36

No

e0

LTC2190CUKG#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2 V

25 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.315 in (8 mm)

LTC2233CUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.0781 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2141IUP-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.25 V

40 MHz

1

CMOS

12

0.022 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

700 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD7891BS-2

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

8

Yes

2.5 V

500 kHz

1

CMOS

12

0.0183 %

5 V

Binary, 2's Complement Binary

5 V

Flatpack

QFP44,.57SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

1.6 µs

S-PQFP-G44

3

0.096 in (2.45 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0.394 in (10 mm)

LTC2207CUK

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

105 MHz

1

CMOS

16

0.0061 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

AD9230BCPZ-210

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

56

HVQCCN

Square

1

Yes

1.25 V

210 MHz

1

CMOS

12

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

4.76 ns

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

260 °C (500 °F)

0.315 in (8 mm)

LTC1863LCGN

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

175 kHz

1

12

0.0244 %

2.7 V

Binary, 2's Complement Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Tin/Lead

Dual

3.7 µs

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.89 mm)

LTC2175CUKG-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

125 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC1747CFW#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.6 V

80 MHz

1

CMOS

12

0.0366 %

5 V

Offset Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G48

1

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

30 s

260 °C (500 °F)

0.492 in (12.5 mm)

LTC1741IFW

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.6 V

65 MHz

1

CMOS

12

0.0244 %

5 V

Offset Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G48

1

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e0

20 s

235 °C (455 °F)

0.492 in (12.5 mm)

AD9228BCPZRL-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

4

Yes

2 V

65 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N48

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

LTC2365ITS8#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.7 V

1 MHz

1

CMOS

12

0.0244 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

AD9222ABCPZRL7-40

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

8

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2255CUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2255IUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD9213-6G

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

192

HBGA

Square

Plastic/Epoxy

1

Yes

1.4 V

10250 MHz

1

12

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

115 °C (239 °F)

-1.4 V

Serial

-10 °C (14 °F)

Bottom

0.975 ns

S-PBGA-B192

0.067 in (1.71 mm)

0.472 in (12 mm)

0.472 in (12 mm)

LTC1867LACGN

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

175 kHz

1

16

0.0046 %

2.7 V

Binary, 2's Complement Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Tin/Lead

Dual

3.7 µs

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.89 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.