Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.1 V |
20 MHz |
1 |
CMOS |
16 |
0.0035 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1.33 MHz |
1 |
16 |
0.0031 % |
2.5 V |
Binary, 2's Complement Binary |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.5 V |
Serial, Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
560 µs |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
240 °C (464 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
16 |
0.0183 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
25 MHz |
2 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
525 mV |
60 MHz |
2 |
CMOS |
6 |
1.5625 % |
5 V |
Offset Binary |
5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
475 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.705 in (17.9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
10 MHz |
1 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
80 MHz |
1 |
CMOS |
16 |
0.0053 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3.7 V |
3 MHz |
1 |
12 |
0.0244 % |
3 V |
Binary |
Small Outline, Very Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.1 V |
2048 MHz |
1 |
12 |
1.3 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.1 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
0.067 in (1.7 mm) |
0.472 in (12 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
22 |
Rectangular |
1 |
No |
15 V |
20 MHz |
1 |
Hybrid |
8 |
0.02 % |
5 V |
Binary |
Microelectronic Assembly |
70 °C (158 °F) |
-15 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Gold |
Sample |
Dual |
140 ns |
R-XDMA-P22 |
No |
e4 |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
No Lead |
42 |
DIE |
Rectangular |
1 |
Yes |
1 V |
50 MHz |
2 |
8 |
5 V |
Binary |
-5 V |
Uncased Chip |
-1 V |
Parallel, 8 Bits |
Tin Lead |
Upper |
R-XUUC-N42 |
No |
e0 |
||||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
25 MHz |
1 |
CMOS |
10 |
0.0488 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
80 MHz |
1 |
CMOS |
14 |
0.0214 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
10 |
0.0781 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
500 MHz |
1 |
14 |
0.0146 % |
1.9 V |
Offset Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Sample |
Quad |
2 ns |
S-PQCC-N64 |
0.037 in (0.95 mm) |
0.354 in (9 mm) |
0.354 in (9 mm) |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
140 |
FBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2 V |
125 MHz |
1 |
14 |
0.025 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
R-PBGA-B140 |
3 |
0.113 in (2.87 mm) |
0.354 in (9 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.443 in (11.25 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
14 |
0.0168 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2 V |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Flat |
68 |
QFF |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 V |
65 MHz |
2 |
Bipolar |
14 |
5 V |
2's Complement Binary |
±5,3.3 V |
-5 V |
Flatpack |
TPAK68,2.0SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Quad |
S-CQFP-F68 |
0.175 in (4.45 mm) |
0.95 in (24.13 mm) |
No |
e0 |
0.95 in (24.13 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
4 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
10 |
0.0488 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
130 MHz |
1 |
CMOS |
16 |
0.0069 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
1.33 MHz |
1 |
16 |
0.0031 % |
2.5 V |
Binary, 2's Complement Binary |
2.5,2.5/3.3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.5 V |
Serial, Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
560 µs |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
52 |
LQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
105 MHz |
1 |
BICMOS |
12 |
0.0366 % |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Low Profile |
QFP52,.47SQ |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
9.5 ns |
S-PQFP-G52 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
250 MHz |
1 |
12 |
0.0659 % |
2.5 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.32 V |
310 MHz |
1 |
CMOS |
12 |
1.8 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.32 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
1.34 V |
1024 MHz |
1 |
12 |
0.0342 % |
1.25 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.34 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
4 V |
65 MHz |
1 |
CMOS |
12 |
0.0488 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.035 in (0.9 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
170 MHz |
1 |
CMOS |
12 |
0.0293 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
2 |
CMOS |
12 |
0.0366 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
100 mV |
75 MHz |
1 |
Bipolar |
MIL-STD-883 |
8 |
0.3906 % |
5 V |
Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T28 |
No |
e0 |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
10 |
0.1367 % |
3 V |
Binary, 2's Complement Binary |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.382 in (9.7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
10 V |
100 kHz |
1 |
12 |
0.0244 % |
5 V |
2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-10 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
5 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
210 MHz |
1 |
CMOS |
12 |
0.0293 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
100 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.9 V |
210 MHz |
1 |
BICMOS |
12 |
0.061 % |
3.3 V |
Offset Binary, 2's Complement Binary |
3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
2.65 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
4.7 ns |
S-PQFP-G100 |
3 |
0.047 in (1.2 mm) |
0.551 in (14 mm) |
No |
e0 |
240 °C (464 °F) |
0.551 in (14 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
10 |
0.2637 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
240 °C (464 °F) |
0.276 in (7 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
100k Rad(Si) |
Ceramic, Metal-Sealed Cofired |
1 |
No |
2.9 V |
41 MHz |
1 |
12 |
5 V |
Binary |
In-Line |
125 °C (257 °F) |
1.9 V |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Dual |
200 ns |
R-CDIP-T28 |
|||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Rectangular |
2 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
10 |
0.0586 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
15.3 ns |
R-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
170 MHz |
1 |
CMOS |
10 |
0.0977 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
250 MHz |
1 |
CMOS |
10 |
0.0977 % |
2.5 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
140 |
FBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
14 |
0.025 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
R-PBGA-B140 |
0.113 in (2.87 mm) |
0.354 in (9 mm) |
e1 |
0.443 in (11.25 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
4.096 V |
117 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
5.9 µs |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.606 in (15.4 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
135 MHz |
1 |
CMOS |
12 |
0.0244 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
12 |
0.0269 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
12 |
0.0269 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-500 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
12 |
0.0269 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
2.8 MHz |
1 |
14 |
0.0244 % |
3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.