Analog To Digital Converter, Proprietary Method Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC2297CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

40 MHz

2

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2269CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.1 V

20 MHz

1

CMOS

16

0.0035 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7623AST

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

2.5 V

1.33 MHz

1

16

0.0031 %

2.5 V

Binary, 2's Complement Binary

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2.5 V

Serial, Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Quad

560 µs

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

0.276 in (7 mm)

LTC2259IUJ-16#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

80 MHz

1

CMOS

16

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2296CUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

2

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD9066JR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

525 mV

60 MHz

2

CMOS

6

1.5625 %

5 V

Offset Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

475 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

LTC2295IUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

10 MHz

1

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2216IUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

80 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2366CTS8#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.7 V

3 MHz

1

12

0.0244 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

AD9625BBPZ-2.0

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.1 V

2048 MHz

1

12

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.1 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

MATV-0816

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

22

Rectangular

1

No

15 V

20 MHz

1

Hybrid

8

0.02 %

5 V

Binary

Microelectronic Assembly

70 °C (158 °F)

-15 V

Parallel, 8 Bits

0 °C (32 °F)

Gold

Sample

Dual

140 ns

R-XDMA-P22

No

e4

AD9058CHIPS

Analog Devices

Analog To Digital Converter, Proprietary Method

No Lead

42

DIE

Rectangular

1

Yes

1 V

50 MHz

2

8

5 V

Binary

-5 V

Uncased Chip

-1 V

Parallel, 8 Bits

Tin Lead

Upper

R-XUUC-N42

No

e0

LTC2236CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2259CUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

80 MHz

1

CMOS

14

0.0214 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2232IUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

10

0.0781 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

HMCAD1063LP9DE

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

500 MHz

1

14

0.0146 %

1.9 V

Offset Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Sample

Quad

2 ns

S-PQCC-N64

0.037 in (0.95 mm)

0.354 in (9 mm)

0.354 in (9 mm)

LTM9011IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

3

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.443 in (11.25 mm)

LTC2266CUJ-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

80 MHz

1

CMOS

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD13465AF

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Flat

68

QFF

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1 V

65 MHz

2

Bipolar

14

5 V

2's Complement Binary

±5,3.3 V

-5 V

Flatpack

TPAK68,2.0SQ

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Quad

S-CQFP-F68

0.175 in (4.45 mm)

0.95 in (24.13 mm)

No

e0

0.95 in (24.13 mm)

AD9228BCPZRL7-40

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

4

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

260 °C (500 °F)

0.276 in (7 mm)

LTC2239IUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2208CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

130 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD7623ASTZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

2.5 V

1.33 MHz

1

16

0.0031 %

2.5 V

Binary, 2's Complement Binary

2.5,2.5/3.3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2.5 V

Serial, Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Quad

560 µs

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD9432BSTZ-105

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

52

LQFP

Square

Plastic/Epoxy

1

Yes

2 V

105 MHz

1

BICMOS

12

0.0366 %

5 V

2's Complement Binary

3.3,5 V

Flatpack, Low Profile

QFP52,.47SQ

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

9.5 ns

S-PQFP-G52

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

0.394 in (10 mm)

LTC2242IUP-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

250 MHz

1

12

0.0659 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2153CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.32 V

310 MHz

1

CMOS

12

1.8 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.32 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD9234BCPZRL7-1000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

1.34 V

1024 MHz

1

12

0.0342 %

1.25 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.34 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.031 in (0.8 mm)

0.354 in (9 mm)

e3

260 °C (500 °F)

0.354 in (9 mm)

AD9237BCPZRL7-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

4 V

65 MHz

1

CMOS

12

0.0488 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N32

3

0.035 in (0.9 mm)

0.197 in (5 mm)

No

e3

260 °C (500 °F)

0.197 in (5 mm)

LTC2150IUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

170 MHz

1

CMOS

12

0.0293 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2282IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

2

CMOS

12

0.0366 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

5962-8965402XA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

100 mV

75 MHz

1

Bipolar

MIL-STD-883

8

0.3906 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

No

e0

AD9203ARURL7

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

40 MHz

1

CMOS

10

0.1367 %

3 V

Binary, 2's Complement Binary

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

0.382 in (9.7 mm)

LTC1854CG#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

10 V

100 kHz

1

12

0.0244 %

5 V

2's Complement Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-10 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

5 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

LTC2151CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

210 MHz

1

CMOS

12

0.0293 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

AD9430BSV-210

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

100

HTFQFP

Square

Plastic/Epoxy

1

Yes

2.9 V

210 MHz

1

BICMOS

12

0.061 %

3.3 V

Offset Binary, 2's Complement Binary

3.3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP100,.63SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

2.65 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

4.7 ns

S-PQFP-G100

3

0.047 in (1.2 mm)

0.551 in (14 mm)

No

e0

240 °C (464 °F)

0.551 in (14 mm)

AD9218BST-RL80

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

2

Yes

1 V

80 MHz

1

CMOS

10

0.2637 %

3 V

Offset Binary, 2's Complement Binary

3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e0

240 °C (464 °F)

0.276 in (7 mm)

AD9042SD/QMLR

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

1

No

2.9 V

41 MHz

1

12

5 V

Binary

In-Line

125 °C (257 °F)

1.9 V

Parallel, Word

-55 °C (-67 °F)

Track

Dual

200 ns

R-CDIP-T28

AD9204BCPZ-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Rectangular

2

Yes

2 V

65 MHz

1

CMOS

10

0.0586 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

15.3 ns

R-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2230IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

170 MHz

1

CMOS

10

0.0977 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2242CUP-10

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

250 MHz

1

CMOS

10

0.0977 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTM9008IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

AD7890BR-4REEL

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

8

Yes

4.096 V

117 kHz

1

CMOS

12

0.0122 %

5 V

Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

5.9 µs

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.606 in (15.4 mm)

LTC2221IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

135 MHz

1

CMOS

12

0.0244 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2229IUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

12

0.0269 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD9222BCPZRL7-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

8

Yes

2 V

65 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

260 °C (500 °F)

0.354 in (9 mm)

LTC2229CUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

12

0.0269 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-500 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2223CUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

12

0.0269 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC1403AIMSE#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

1

Yes

2.5 V

2.8 MHz

1

14

0.0244 %

3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.