| Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
2.8 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
357 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
40 MHz |
1 |
13 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
25 ns |
S-PQCC-N64 |
2A |
0.037 in (0.95 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
3 V |
8.3 kHz |
1 |
CMOS |
12 |
5 V |
Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-3 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Track |
Quad |
7.125 µs |
S-PQCC-J28 |
3 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e3 |
260 °C (500 °F) |
0.453 in (11.5062 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Rectangular |
1 |
No |
10 V |
1 |
8 |
0.3906 % |
Binary, Offset Binary, 2's Complement Binary |
Microelectronic Assembly |
-10 V |
Parallel, Word |
1 ms |
R-XXMA-X |
No |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 V |
80 MHz |
2 |
Bipolar |
MIL-STD-883 |
12 |
5 V |
2's Complement Binary |
-5 V |
Flatpack |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
8 ns |
S-CQFP-G68 |
0.235 in (5.97 mm) |
0.95 in (24.13 mm) |
No |
e0 |
0.95 in (24.13 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
10 V |
100 kHz |
1 |
14 |
0.0183 % |
5 V |
2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Tin/Lead |
Sample |
Dual |
5 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.402 in (10.2 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0317 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 V |
10 MHz |
1 |
BICMOS |
12 |
5 V |
Offset Binary, 2's Complement Binary |
±5 V |
-5 V |
Chip Carrier |
LCC44,.65SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.545 mm) |
No |
e0 |
0.651 in (16.545 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
105 MHz |
2 |
12 |
3.3 V |
2's Complement Binary |
Flatpack |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Quad |
S-CQFP-G68 |
0.143 in (3.622 mm) |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
125 MHz |
1 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
135 MHz |
1 |
CMOS |
12 |
0.0244 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
3.5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3.3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
285 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
10 MHz |
1 |
CMOS |
12 |
0.0269 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
R-PQCC-N52 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
0.315 in (8 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
3 MHz |
1 |
12 |
0.0488 % |
3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
10 |
0.1855 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
64 |
1 |
No |
4 V |
2 MHz |
1 |
12 |
0.0122 % |
15 V |
Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-4 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
X-XXMA-X64 |
No |
e0 |
|||||||||||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
80 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
R-PQCC-N52 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
170 MHz |
1 |
CMOS |
10 |
0.0977 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
210 MHz |
1 |
12 |
0.0562 % |
2.5 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
65 MHz |
2 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-500 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
80 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
25 MHz |
1 |
CMOS |
12 |
0.022 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
700 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
65 MHz |
1 |
CMOS |
16 |
0.0069 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
3.5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3.3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
285 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
210 MHz |
1 |
CMOS |
14 |
0.0311 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
4.7 ns |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
75 MHz |
1 |
Bipolar |
8 |
0.3906 % |
5 V |
Binary |
-5.2 V |
In-Line |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Dual |
R-GDIP-T28 |
No |
||||||||||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
125 MHz |
1 |
CMOS |
12 |
0.0366 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.9 V |
10 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Pin/Peg |
32 |
Rectangular |
1 |
No |
2.048 V |
5 MHz |
1 |
12 |
15 V |
Offset Binary, 2's Complement Binary |
-15 V |
Microelectronic Assembly |
70 °C (158 °F) |
-2.048 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Dual |
R-XDMA-P32 |
No |
e0 |
|||||||||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
1 |
CMOS |
10 |
0.0488 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 V |
80 MHz |
2 |
Bipolar |
12 |
5 V |
2's Complement Binary |
-5 V |
Flatpack |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Track |
Quad |
S-CQFP-G68 |
0.235 in (5.969 mm) |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
|||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
512 mV |
40 MHz |
2 |
CMOS |
8 |
0.4883 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
4.096 V |
117 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
5.9 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.25 in (31.75 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
80 MHz |
1 |
CMOS |
16 |
0.0053 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
44 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 V |
10 MHz |
1 |
BICMOS |
MIL-STD-883 Class B |
12 |
5 V |
2's Complement Binary |
-5 V |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Quad |
S-CQCC-N44 |
0.1 in (2.54 mm) |
0.651 in (16.545 mm) |
No |
0.651 in (16.545 mm) |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
1 |
BICMOS |
38535Q/M;38534H;883B |
10 |
140 mA |
5 V |
Binary |
5,5,5,-5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
65 MHz |
2 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
14 |
0.0168 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
R-PQCC-N52 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
1.7 V |
3000 MHz |
1 |
14 |
0.1282 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.7 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
3 |
0.06 in (1.53 mm) |
0.472 in (12 mm) |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
65 MHz |
2 |
CMOS |
14 |
0.0085 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.35SQ,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQFP-G64 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
80 MHz |
1 |
CMOS |
16 |
0.0114 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
700 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
125 µs |
R-PQCC-N52 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
|||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
125 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
R-PQCC-N52 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
40 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
700 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.9 V |
65 MHz |
1 |
CMOS |
12 |
0.0269 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.