Analog To Digital Converter, Proprietary Method Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD9627BCPZ-105

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

1

Yes

2 V

105 MHz

2

CMOS

12

0.022 %

1.8 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

9 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

260 °C (500 °F)

0.354 in (9 mm)

LTC2237IUH#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

40 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD9430BST-210

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

100

LFQFP

Rectangular

Plastic/Epoxy

1

Yes

210 MHz

1

BICMOS

12

3.3 V

Offset Binary, 2's Complement Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

R-PQFP-G100

0.063 in (1.6 mm)

0.551 in (14 mm)

No

e0

0.551 in (14 mm)

LTC2280IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

2

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2221IUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

135 MHz

1

CMOS

12

0.0244 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD9235BRU-20

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

20 MHz

1

CMOS

12

0.0195 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

500 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

0.382 in (9.7 mm)

AD9204BCPZ-80

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Rectangular

2

Yes

2 V

80 MHz

1

CMOS

10

0.0586 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

12.5 ns

R-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

AD9022AZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

28

SOP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

1.024 V

20 MHz

1

Bipolar

12

0.0732 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

Small Outline

SOP28,.76

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-CDSO-G28

0.165 in (4.191 mm)

0.5 in (12.7 mm)

No

e0

0.72 in (18.29 mm)

AD9058KD

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

48

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

50 MHz

2

CMOS

8

154 mA

0.4883 %

5 V

Binary

±5 V

-5 V

In-Line

DIP48,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

20 ns

R-CDIP-T48

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

2.4 in (60.96 mm)

LTC1408CUH-12#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

6

Yes

2.5 V

600 kHz

1

12

0.0244 %

3 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD9058ATD/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

48

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

1 V

50 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.49 %

5 V

Binary

±5 V

-5 V

In-Line

DIP48,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T48

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

2.4 in (60.96 mm)

LTC2251IUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD9288BSTZRL-40

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

512 mV

40 MHz

2

CMOS

8

0.4883 %

3 V

Offset Binary, 2's Complement Binary

3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-512 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2207CUK-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

105 MHz

1

CMOS

14

0.0092 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2224CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

135 MHz

1

CMOS

12

0.0244 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2153CUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.32 V

310 MHz

1

CMOS

14

0.0458 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.32 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

3 ns

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC1405CGN#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

5 MHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

70 °C (158 °F)

-2.048 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

180 ns

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

e0

0.389 in (9.893 mm)

LTC2216CUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

80 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9480ASUZ-250

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

44

TQFP

Square

Plastic/Epoxy

1

Yes

2.1 V

250 MHz

1

BICMOS

8

0.3516 %

3.3 V

Binary, 2's Complement Binary

3.3 V

Flatpack, Thin Profile

TQFP44,.47SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

1.7 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-PQFP-G44

3

0.047 in (1.2 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

0.394 in (10 mm)

LTC2298IUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

60 MHz

2

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2155IUP-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.5 V

170 MHz

1

CMOS

14

0.0311 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9283BRSZ-80

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

1

Yes

512 mV

80 MHz

1

CMOS

8

0.5859 %

3 V

Offset Binary

3 V

Small Outline, Shrink Pitch

SSOP20,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-512 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

0.283 in (7.2 mm)

AD9011JM

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Pin/Peg

24

DIP

Rectangular

Metal

1

No

1 V

100 MHz

1

Bipolar

8

303 mA

0.4688 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

R-MDIP-P24

0.6 in (15.24 mm)

No

e0

1.272 in (32.3205 mm)

LTC2282CUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

2

CMOS

12

0.0366 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2280CUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

2

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

ADC-8QM/BIN

Analog Devices

Analog To Digital Converter, Proprietary Method

72

Rectangular

1

No

2.5 V

1

8

0.1953 %

Binary, Offset Binary, 2's Complement Binary

Microelectronic Assembly

-2.5 V

Parallel, 8 Bits

Sample

Dual

R-XDMA-X72

No

LTC1748IFW#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.6 V

80 MHz

1

CMOS

14

0.0183 %

5 V

Offset Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1.6 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G48

1

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

30 s

260 °C (500 °F)

0.492 in (12.5 mm)

LTC2237IUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

40 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

HAS-1409AKM

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

125 kHz

1

Hybrid

14

0.009 %

15 V

Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

R-PDIP-T40

0.19 in (4.83 mm)

0.9 in (22.86 mm)

No

e0

LTC2283IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

VQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

2

CMOS

12

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2246CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

25 MHz

1

CMOS

14

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Tin/Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2365CS6#TRMPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.65 V

1 MHz

1

CMOS

12

0.0244 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.037 in (0.95 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

LTC2284IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

105 MHz

1

CMOS

14

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

CAV-1220

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

40

1

No

2 V

20 MHz

1

12

0.0125 %

15 V

Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

70 °C (158 °F)

-2 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

X-XXMA-X40

No

e0

AD12401-400JWS

Analog Devices

Analog To Digital Converter, Proprietary Method

Rectangular

1

No

1.6 V

400 MHz

1

12

3.3 V

2's Complement Binary

1.5,3.3 V

Microelectronic Assembly

MODULE(UNSPEC)

Analog to Digital Converters

0 mV

Parallel, Word

R-XXMA-X

1

No

AD6645ASQ-105

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Gull Wing

52

HLQFP

Square

Plastic/Epoxy

1

Yes

2.2 V

105 MHz

1

Bipolar

14

5 V

2's Complement Binary

3.3,5 V

Flatpack, Heat Sink/Slug, Low Profile

QFP52,.47SQ

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-10 °C (14 °F)

Tin Lead

Track

Quad

S-PQFP-G52

0.063 in (1.6 mm)

0.472 in (12 mm)

No

e0

0.472 in (12 mm)

LTC2251CUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2236CUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

1

CMOS

10

0.0488 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD9058TJ/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

1

Yes

1 V

50 MHz

2

CMOS

MIL-STD-883

8

0.4883 %

5 V

Binary

±5 V

-5 V

Chip Carrier

LCC44,.65SQ

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-J44

0.135 in (3.43 mm)

0.65 in (16.51 mm)

No

e0

0.65 in (16.51 mm)

LTC2215IUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

65 MHz

1

CMOS

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD9222BCPZRL7-40

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

8

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

260 °C (500 °F)

0.354 in (9 mm)

LTC2227IUH#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

40 MHz

1

CMOS

12

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2232CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

10

0.0781 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2258CUJ-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

65 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC1407ACMSE-1#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

1.25 V

3 MHz

1

14

0.0244 %

3 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-1.25 V

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

AD9430BSV-170

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

100

HTFQFP

Square

Plastic/Epoxy

1

Yes

2.9 V

170 MHz

1

BICMOS

12

0.0549 %

3.3 V

Offset Binary, 2's Complement Binary

3.3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP100,.63SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

2.65 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

5.8 ns

S-PQFP-G100

3

0.047 in (1.2 mm)

0.551 in (14 mm)

No

e0

240 °C (464 °F)

0.551 in (14 mm)

LTC2217CUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.75 V

105 MHz

1

16

0.0053 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2284IUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

105 MHz

1

CMOS

14

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.