Analog To Digital Converter, Proprietary Method Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7890BN-4

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

4.096 V

117 kHz

1

CMOS

12

0.0122 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

5.9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

AD9214BRSZ-105

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

105 MHz

1

CMOS

10

0.2441 %

3 V

Offset Binary, 2's Complement Binary

3 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

0.402 in (10.2 mm)

AD9058JD

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

48

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

50 MHz

2

CMOS

8

154 mA

0.5469 %

5 V

Binary

±5 V

-5 V

In-Line

DIP48,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-1 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T48

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

2.4 in (60.96 mm)

LTC2291IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

2

CMOS

12

0.0317 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD7623ACPZRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

QCCN

Square

1

Yes

2.5 V

1.33 MHz

1

16

0.0031 %

2.5 V

Binary, 2's Complement Binary

2.5,2.5/3.3 V

Chip Carrier

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2.5 V

Serial, Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Quad

560 µs

S-XQCC-N48

3

0.071 in (1.8 mm)

0.276 in (7 mm)

No

e3

260 °C (500 °F)

0.276 in (7 mm)

LTC1407HMSE#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Automotive

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

2.5 V

3 MHz

1

CMOS

12

0.0488 %

3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

22.6666 µs

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2150IUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

170 MHz

1

CMOS

14

0.0311 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

5.8 ns

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2287CUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

40 MHz

2

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2194IUKG#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

1.25 V

105 MHz

1

CMOS

16

0.0114 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

700 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

1 µs

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2293IUP#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

65 MHz

2

CMOS

12

0.0342 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2170IUKG-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

25 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2143IUP-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

80 MHz

1

CMOS

14

0.0159 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2220IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

170 MHz

1

CMOS

12

0.0366 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2151CUJ-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

210 MHz

1

CMOS

12

0.0293 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2158CUP-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.32 V

310 MHz

1

CMOS

14

0.0458 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.32 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTM9012CY-AB#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

221

FBGA

Rectangular

Plastic/Epoxy

4

Yes

200 mV

125 MHz

1

14

0.0305 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-200 mV

Serial

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B221

0.117 in (2.97 mm)

0.443 in (11.25 mm)

e1

0.591 in (15 mm)

LTC2233IUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.0781 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD9058TD/883

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

48

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

50 MHz

2

MIL-STD-883

8

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T48

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

2.4 in (60.96 mm)

AD9289BBC

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

64

LFBGA

Square

Plastic/Epoxy

4

Yes

2 V

65 MHz

1

CMOS

8

0.2344 %

3 V

Binary, 2's Complement Binary

3 V

Grid Array, Low Profile, Fine Pitch

BGA64,8X8,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

1 V

Serial

-40 °C (-40 °F)

Tin Lead Silver

Sample

Bottom

S-PBGA-B64

3

0.067 in (1.7 mm)

0.315 in (8 mm)

No

e0

240 °C (464 °F)

0.315 in (8 mm)

ADAS1127

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

BGA

Square

Plastic/Epoxy

64

Yes

1

24

Binary

Grid Array

Serial

Sample

Bottom

S-PBGA-B

AD9222BCPZ-40

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

8

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

260 °C (500 °F)

0.354 in (9 mm)

LTC2245IUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

10 MHz

1

CMOS

14

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

AD7777ANZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

4

No

3 V

1

CMOS

10

0.0977 %

5 V

2's Complement Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

AD9005BTM

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

46

DIP

Rectangular

Metal

1

No

1.024 V

10 MHz

1

Bipolar

12

0.0549 %

5 V

Offset Binary

5,-5.2 V

-5.2 V

In-Line

DIP46,1.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1.024 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

100 ns

R-MDIP-T46

0.31 in (7.874 mm)

1.3 in (33.02 mm)

No

e0

LTC2258CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

65 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC1856CG#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

8

Yes

10 V

100 kHz

1

14

0.0183 %

5 V

2's Complement Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-10 V

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

5 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

LTC2206IUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

80 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD9042SF/QMLV

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Flat

28

DFP

Rectangular

Ceramic, Metal-Sealed Cofired

1

Yes

2.9 V

41 MHz

1

12

5 V

Binary

Flatpack

125 °C (257 °F)

1.9 V

Parallel, Word

-55 °C (-67 °F)

Track

Dual

200 ns

R-CDFP-F28

AD9229BCPZ-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

4

Yes

65 MHz

1

CMOS

12

0.024 %

3 V

Offset Binary

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

260 °C (500 °F)

0.276 in (7 mm)

LTC2254CUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

14

0.0336 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2286IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

25 MHz

2

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2175CUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

125 MHz

1

CMOS

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2240IUP-10#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

170 MHz

1

10

0.0977 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

3

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD7890ARZ-10

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

8

Yes

10 V

117 kHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

5.9 µs

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.606 in (15.4 mm)

LTC2351CUH-12

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

6

Yes

1.5 MHz

1

12

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC1746CFW#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.6 V

25 MHz

1

CMOS

14

0.0183 %

5 V

Offset Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-1.6 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G48

1

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e3

30 s

260 °C (500 °F)

0.492 in (12.5 mm)

LTC2366IS6#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

6

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.65 V

3 MHz

1

CMOS

12

0.0244 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.037 in (0.95 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G6

1

0.039 in (1 mm)

0.064 in (1.625 mm)

No

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

LTC2206CUK-14

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

80 MHz

1

CMOS

14

0.0092 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC1403IMSE-1

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

1

Yes

1.25 V

2.8 MHz

1

12

0.0488 %

3 V

Binary, 2's Complement Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Tin/Lead

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

AD7891BS-2REEL

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

44

QFP

Square

Plastic/Epoxy

8

Yes

2.5 V

500 kHz

1

CMOS

12

0.0183 %

5 V

Binary, 2's Complement Binary

Flatpack

0.031 in (0.8 mm)

85 °C (185 °F)

-2.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Track

Quad

1.6 µs

S-PQFP-G44

0.096 in (2.45 mm)

0.394 in (10 mm)

0.394 in (10 mm)

AD9625BBPZRL-2.5

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.1 V

2560 MHz

1

12

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.1 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

LTC1740CG#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

6 MHz

1

CMOS

14

0.0153 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

135 ns

R-PDSO-G36

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.504 in (12.8 mm)

LTC2206IUK-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

80 MHz

1

CMOS

14

0.0092 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7878LN

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

8.3 kHz

1

CMOS

12

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

7.125 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.445 in (36.705 mm)

LTC2183IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.25 V

80 MHz

1

CMOS

16

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

700 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

LTC1743IFW#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.6 V

50 MHz

1

CMOS

12

0.0244 %

5 V

Offset Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1.6 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G48

1

0.047 in (1.2 mm)

0.24 in (6.1 mm)

e3

30 s

260 °C (500 °F)

0.492 in (12.5 mm)

AD10677BWS

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

120

Rectangular

1

No

2.15 V

65 MHz

1

16

3.3 V

Binary

Microelectronic Assembly

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

R-XXMA-X120

No

AD9200JRSRL

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

5.5 V

20 MHz

1

CMOS

10

0.1953 %

3 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

R-PDSO-G28

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

0.402 in (10.2 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.