Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
105 MHz |
1 |
CMOS |
16 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
700 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
3.6 V |
8 MHz |
1 |
CMOS |
14 |
0.0458 % |
3.3 V |
Binary, 2's Complement Binary |
3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Other Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Sample |
Quad |
125 ns |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
1 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
3 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
660 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
6 |
Yes |
2.5 V |
600 kHz |
1 |
14 |
0.0183 % |
3 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
40 MHz |
1 |
CMOS |
16 |
0.0069 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.128 V |
51 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP16,.25 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
7.5 µs |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.89 mm) |
||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
3 MHz |
1 |
BICMOS |
12 |
0.061 % |
5 V |
Binary, Offset Binary |
5 V |
Chip Carrier |
LDCC28,.5SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
333 ns |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
512 mV |
100 MHz |
1 |
CMOS |
8 |
0.8789 % |
3 V |
Offset Binary |
3 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.283 in (7.2 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
3.56 V |
40 MHz |
1 |
16 |
0.013 % |
3.3 V |
Offset Binary, 2's Complement Binary |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.025 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
R-PQCC-N52 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
4 |
Yes |
2.128 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Gold Palladium |
Track |
Dual |
6.8 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
500 MHz |
1 |
12 |
270 mA |
0.1221 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA196,14X14,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
S-PBGA-B196 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
Peak-to-peak input voltage range: 1 V |
e1 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
3 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.25 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
660 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
1.25 V |
175 kHz |
1 |
12 |
0.0244 % |
2.7 V |
Binary, 2's Complement Binary |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-1.25 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3.7 µs |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.899 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.89 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
4 |
Yes |
2.128 V |
51 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Gold Palladium |
Track |
Dual |
7.5 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Microchip Technology |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
124 |
HLGA |
Square |
1 |
Yes |
200 MHz |
1 |
TS 16949 |
12 |
1.2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Bottom |
5 ns |
S-XBGA-N124 |
0.035 in (0.9 mm) |
0.354 in (9 mm) |
e4 |
0.354 in (9 mm) |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
454 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Flatpack |
QFP44,.57SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
105 °C (221 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Matte Tin |
Track |
Quad |
1.6 µs |
S-PQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
125 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
-1.25 V |
3.5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3.3 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1.25 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
285 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
128 |
HLFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
870 mV |
1500 MHz |
1 |
CMOS |
8 |
930 mA |
0.3516 % |
1.9 V |
Offset Binary |
1.9 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP128,.87SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-870 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
0.6 ns |
S-PQFP-G128 |
3 |
0.063 in (1.6 mm) |
0.787 in (20 mm) |
No |
Peak-to-peak input voltage range: 0.87 V |
e3 |
30 s |
260 °C (500 °F) |
0.787 in (20 mm) |
||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
1800 MHz |
1 |
12 |
2.481 A |
1.9 V |
Offset Binary, 2's Complement Binary |
1.9 V |
Grid Array, Heat Sink/Slug |
BGA292,20X20,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-800 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
S-PBGA-B292 |
3 |
0.102 in (2.58 mm) |
1.063 in (27 mm) |
No |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
220 °C (428 °F) |
1.063 in (27 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
160 MHz |
1 |
CMOS |
16 |
0.0084 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
14 |
0.0153 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
-1.25 V |
3.5 MHz |
1 |
CMOS |
12 |
0.0488 % |
3.3 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1.25 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
285 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
68 |
HVQCCN |
Square |
1 |
Yes |
2 V |
4000 MHz |
1 |
12 |
0.0732 % |
1.2 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-XQCC-N68 |
0.039 in (1 mm) |
0.394 in (10 mm) |
0.394 in (10 mm) |
|||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
800 mV |
3600 MHz |
1 |
12 |
2.481 A |
1.9 V |
Offset Binary, 2's Complement Binary |
1.9 V |
Grid Array, Heat Sink/Slug |
BGA292,20X20,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-800 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Silver |
Track |
Bottom |
S-PBGA-B292 |
3 |
0.102 in (2.58 mm) |
1.063 in (27 mm) |
No |
Peak-to-peak input voltage range: 0.8 V |
e2 |
30 s |
250 °C (482 °F) |
1.063 in (27 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
68 |
HVQCCN |
Square |
1 |
Yes |
950 mV |
4000 MHz |
1 |
12 |
0.0732 % |
1.2 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-950 mV |
Serial |
-40 °C (-40 °F) |
Quad |
S-XQCC-N68 |
3 |
0.039 in (1 mm) |
0.394 in (10 mm) |
0.394 in (10 mm) |
||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
5.5 V |
1 MHz |
1 |
12 |
10 mA |
0.0244 % |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
1.65 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
450 ns |
S-PQCC-N16 |
2 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
160 MHz |
1 |
CMOS |
16 |
0.0084 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
5 V |
455 kHz |
1 |
BICMOS |
14 |
0.0122 % |
5 V |
Offset Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
1.9 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
245 °C (473 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
5 V |
455 kHz |
1 |
BICMOS |
14 |
0.0122 % |
5 V |
Offset Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
1.9 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
5 V |
455 kHz |
1 |
BICMOS |
14 |
0.0122 % |
5 V |
Offset Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
1.9 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
5 V |
435 kHz |
1 |
BICMOS |
14 |
0.0122 % |
5 V |
Offset Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
1.9 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
1600 MHz |
1 |
CMOS |
12 |
2.31 A |
0.177 % |
1.9 V |
Binary, Offset Binary, 2's Complement Binary |
1.9 V |
Grid Array, Heat Sink/Slug |
BGA292,20X20,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-800 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
S-PBGA-B292 |
3 |
0.102 in (2.58 mm) |
1.063 in (27 mm) |
No |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
220 °C (428 °F) |
1.063 in (27 mm) |
||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
860 mV |
4000 MHz |
1 |
12 |
2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-860 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver |
Track |
Bottom |
S-PBGA-B292 |
3 |
0.102 in (2.58 mm) |
1.063 in (27 mm) |
e2 |
30 s |
250 °C (482 °F) |
1.063 in (27 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
5200 MHz |
1 |
12 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.825 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
5200 MHz |
1 |
12 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.825 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
80 |
HTFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
12 |
0.0488 % |
3.3 V |
Offset Binary |
3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP80,.55SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
8 |
70 mA |
0.3906 % |
5 V |
Offset Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP20,.25 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-2 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
100 µs |
R-PDSO-G20 |
2 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
Peak-to-peak input voltage range: 1, 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.341 in (8.65 mm) |
||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
1000 MHz |
1 |
CMOS |
8 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
1 ns |
S-PQCC-N48 |
2A |
0.041 in (1.05 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
250 MHz |
1 |
CMOS |
8 |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Track |
Quad |
4 ns |
S-PQCC-N48 |
3 |
0.041 in (1.05 mm) |
0.276 in (7 mm) |
No |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
825 mV |
5200 MHz |
1 |
12 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-825 mV |
Serial |
-40 °C (-40 °F) |
Track |
Bottom |
S-PBGA-B144 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
0.394 in (10 mm) |
|||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
454.5 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
1.6 µs |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e0 |
225 °C (437 °F) |
0.653 in (16.585 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
454.5 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
1.6 µs |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e0 |
225 °C (437 °F) |
0.653 in (16.585 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.