Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
10 |
0.1562 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
1 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
12 |
194 mA |
0.0293 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0317 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
2700 MHz |
1 |
12 |
950 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
3200 MHz |
1 |
12 |
1.3 A |
1.1 V |
2's Complement Binary |
Grid Array |
BGA256,16X16,39 |
0.039 in (1 mm) |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
0.13 in (3.31 mm) |
0.669 in (17 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
220 °C (428 °F) |
0.669 in (17 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
80 |
HTFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
10 |
0.0977 % |
3.3 V |
Offset Binary |
3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP80,.55SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
80 |
HTFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
2.03 V |
65 MHz |
1 |
CMOS |
10 |
0.0977 % |
3.3 V |
Offset Binary |
3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP80,.55SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
2 |
Yes |
1.9 V |
1000 MHz |
1 |
14 |
510 mA |
1.9 V |
Offset Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.9 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 1.9 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
VQCCN |
Square |
2 |
Yes |
1.9 V |
1000 MHz |
1 |
14 |
Offset Binary |
Chip Carrier, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.9 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-XQCC-N72 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
0.394 in (10 mm) |
|||||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
VQCCN |
Square |
2 |
Yes |
1.9 V |
1000 MHz |
1 |
14 |
510 mA |
Offset Binary |
Chip Carrier, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.9 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 1.9 V |
e4 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
5.5 V |
1 MHz |
1 |
14 |
10 mA |
0.0122 % |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
1.65 V |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-2.4 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Dual |
450 ns |
R-PDSO-G16 |
2 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
5.5 V |
700 kHz |
1 |
16 |
10 mA |
0.0038 % |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
1.65 V |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-2.4 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Dual |
640 ns |
R-PDSO-G16 |
2 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.75 V |
30 MHz |
1 |
CMOS |
8 |
0.9766 % |
3 V |
Offset Binary |
3/5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
1.25 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
100 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
125 MHz |
1 |
CMOS |
16 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
700 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N48 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
0.276 in (7 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
52 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
125 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
R-PQCC-N52 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
160 MHz |
1 |
CMOS |
16 |
0.0084 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
10 MHz |
1 |
CMOS |
12 |
0.0269 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
10 MHz |
1 |
CMOS |
12 |
0.0269 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
10 MHz |
1 |
CMOS |
12 |
0.0269 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
10 MHz |
1 |
CMOS |
12 |
0.0269 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.1 V |
20 MHz |
1 |
CMOS |
16 |
0.0035 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
-1.25 V |
3.5 MHz |
1 |
14 |
0.0244 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1.25 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Ball |
140 |
FBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2 V |
25 MHz |
1 |
14 |
0.0168 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
70 °C (158 °F) |
-2 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
R-PBGA-B140 |
3 |
0.113 in (2.87 mm) |
0.354 in (9 mm) |
e1 |
260 °C (500 °F) |
0.443 in (11.25 mm) |
|||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
250 kHz |
1 |
BICMOS |
14 |
0.0122 % |
5 V |
2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
3.7 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
244 kHz |
1 |
BICMOS |
14 |
0.0122 % |
5 V |
2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
3.7 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||
|
STMicroelectronics |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
48 |
HSSOP |
Rectangular |
300k Rad(Si) |
Ceramic |
1 |
Yes |
2 V |
50 MHz |
1 |
CMOS |
12 |
2.5 V |
Binary |
2.5 V |
Small Outline, Heat Sink/Slug, Shrink Pitch |
SSOP48,.48 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Dual |
R-CDSO-G48 |
0.107 in (2.72 mm) |
0.38 in (9.65 mm) |
No |
40 s |
250 °C (482 °F) |
0.613 in (15.57 mm) |
||||||||||||||
|
STMicroelectronics |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
48 |
HSSOP |
Rectangular |
300k Rad(Si) |
Ceramic |
1 |
Yes |
2 V |
50 MHz |
1 |
CMOS |
12 |
0.0415 % |
2.5 V |
Binary |
2.5 V |
Small Outline, Heat Sink/Slug, Shrink Pitch |
SSOP48,.48 |
Analog to Digital Converters |
0.025 in (0.635 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Track |
Dual |
R-CDSO-G48 |
0.107 in (2.72 mm) |
0.38 in (9.65 mm) |
No |
40 s |
250 °C (482 °F) |
0.62 in (15.75 mm) |
|||||||||||||
|
Semtech |
Analog To Digital Converter, Proprietary Method |
Automotive |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
4 |
Yes |
2.42 V |
1.88 kHz |
1 |
CMOS |
16 |
3 V |
2's Complement Binary |
2.5/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC12,.16,20 |
Other Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.42 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Dual |
S-PDSO-N12 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
0.157 in (4 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
10 MHz |
1 |
BICMOS |
MIL-STD-883 |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
52 |
HTQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
105 MHz |
1 |
Bipolar |
14 |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Heat Sink/Slug, Thin Profile |
TQFP52,.47SQ,25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-10 °C (14 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G52 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
10 V |
117 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
2's Complement Binary |
5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
5.9 µs |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.606 in (15.4 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
8 |
Yes |
2.5 V |
500 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Flatpack |
QFP44,.57SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
105 °C (221 °F) |
-2.5 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Matte Tin |
Track |
Quad |
1.6 µs |
S-PQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
10 |
5 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
50 ns |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
J Bend |
44 |
QCCJ |
Square |
Ceramic, Metal-Sealed Cofired |
2 |
Yes |
2 V |
50 MHz |
1 |
MIL-STD-883 Class B |
8 |
0.49 % |
5 V |
Binary |
±5 V |
-5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-J44 |
0.135 in (3.43 mm) |
0.645 in (16.385 mm) |
No |
e0 |
0.645 in (16.385 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
20 MHz |
1 |
CMOS |
10 |
0.1953 % |
3 V |
Binary |
3/5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
10 |
0.1367 % |
3 V |
Binary, 2's Complement Binary |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
0.0317 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
65 MHz |
2 |
CMOS |
14 |
0.0275 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Flatpack, Low Profile, Fine Pitch |
QFP64,.35SQ,16 |
Analog to Digital Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
2600 MHz |
1 |
14 |
0.0793 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
3 |
0.062 in (1.57 mm) |
0.472 in (12 mm) |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
128 |
HLFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
870 mV |
1500 MHz |
1 |
CMOS |
7 |
930 mA |
0.7031 % |
1.9 V |
Offset Binary |
1.9 V |
Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch |
QFP128,.87SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-870 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
0.66 ns |
S-PQFP-G128 |
3 |
0.063 in (1.6 mm) |
0.787 in (20 mm) |
No |
Peak-to-peak input voltage range: 0.87 V |
e3 |
30 s |
260 °C (500 °F) |
0.787 in (20 mm) |
||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1.6 V |
200 MHz |
1 |
AEC-Q100 |
8 |
88.3 mA |
0.5078 % |
3.3 V |
Binary |
3.3 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-1.6 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
Peak-to-peak input voltage range: 1.6 V |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
AEC-Q100 |
10 |
25 mA |
0.0977 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
25 ns |
R-PDSO-G28 |
3 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
|||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
1600 MHz |
1 |
12 |
0.1172 % |
1.9 V |
Offset Binary, 2's Complement Binary |
1.9 V |
Grid Array, Heat Sink/Slug |
BGA292,20X20,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-800 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
S-PBGA-B292 |
3 |
0.102 in (2.58 mm) |
1.063 in (27 mm) |
No |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
220 °C (428 °F) |
1.063 in (27 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
196 |
CGA |
Square |
300k Rad(Si) |
Ceramic |
2 |
No |
800 mV |
3200 MHz |
1 |
12 |
1 A |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array |
0.039 in (1 mm) |
-800 mV |
Serial |
Track |
Bottom |
S-CCGA-X196 |
0.244 in (6.194 mm) |
0.591 in (15 mm) |
Peak-to-peak input voltage range: 0.8 V |
0.591 in (15 mm) |
|||||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.04 V |
6400 MHz |
1 |
12 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-500 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin/Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.