Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.04 V |
6400 MHz |
1 |
12 |
1.1 V |
2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial |
-40 °C (-40 °F) |
Tin/Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Military |
196 |
CGA |
Rectangular |
300k Rad(Si) |
2 |
Yes |
800 mV |
6400 MHz |
1 |
12 |
Binary |
Grid Array |
125 °C (257 °F) |
-800 mV |
-55 °C (-67 °F) |
Lateral |
R-XLGA-X196 |
0.591 in (15 mm) |
Peak-to-peak input voltage range: 0.8 V |
0.591 in (15 mm) |
|||||||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.7 V |
500 MHz |
1 |
16 |
1.2 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.7 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
Peak-to-peak input voltage range: 1.7 V |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
25 MHz |
1 |
16 |
42 mA |
0.007629 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
25 MHz |
1 |
16 |
42 mA |
0.007629 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
65 MHz |
1 |
16 |
82 mA |
0.007629 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
250 MHz |
1 |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Sample |
Quad |
S-PQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
12 |
145 mA |
0.0366 % |
3.3 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
10 |
47 mA |
0.1953 % |
5 V |
Offset Binary, 2's Complement Binary |
5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
100 µs |
R-PDSO-G28 |
2 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.705 in (17.9 mm) |
||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
3.5 V |
10 MHz |
1 |
14 |
0.0305 % |
5 V |
Offset Binary, 2's Complement Binary |
3/5,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Nickel/Palladium/Gold |
Track |
Quad |
100 µs |
S-PQFP-G48 |
2 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
Peak-to-peak input voltage range: 2, 4 V |
e4 |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
3 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.25 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
660 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
3 MHz |
1 |
12 |
0.0488 % |
3 V |
Binary |
Small Outline |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
3 MHz |
1 |
12 |
0.0488 % |
3 V |
Binary |
Small Outline |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0159 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1.25 V |
125 MHz |
1 |
CMOS |
16 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
700 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N64 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
105 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
105 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
105 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
12 |
0.0366 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.0214 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0214 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
105 MHz |
1 |
CMOS |
16 |
0.0069 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.9 V |
40 MHz |
2 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
6 |
Yes |
1.25 V |
1.5 MHz |
1 |
14 |
0.0183 % |
3 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.25 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
3.5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3.3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
285 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
3.5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3.3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
285 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
8 |
VSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3.7 V |
3 MHz |
1 |
CMOS |
12 |
0.0244 % |
3 V |
Binary |
Small Outline, Very Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G8 |
1 |
0.039 in (1 mm) |
0.064 in (1.625 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2.128 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
4 |
Yes |
2.0685 V |
133 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.0275 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
7.5 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
245 °C (473 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
4 |
Yes |
2.0685 V |
133 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.0275 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
7.5 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Microchip Technology |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
124 |
HLGA |
Square |
8 |
Yes |
200 MHz |
1 |
TS 16949 |
12 |
1.2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Bottom |
25 ns |
S-XBGA-N124 |
0.035 in (0.9 mm) |
0.354 in (9 mm) |
e4 |
0.354 in (9 mm) |
|||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
25 MHz |
1 |
16 |
0.007629395 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Quad |
S-PQCC-N40 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
0.197 in (5 mm) |
||||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
250 MHz |
1 |
14 |
113 mA |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Sample |
Quad |
S-PQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
0.276 in (7 mm) |
||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Gull Wing |
30 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
48 kHz |
1 |
24 |
3.3 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
125 °C (257 °F) |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Dual |
R-PDSO-G30 |
2 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.307 in (7.8 mm) |
|||||||||||||||||||
|
NXP Semiconductors |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
144 |
LFQFP |
Square |
Plastic/Epoxy |
3 |
Yes |
1 V |
110 MHz |
1 |
8 |
0.5078 % |
3.3 V |
Binary |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
500 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Silver |
Track |
Quad |
S-PQFP-G144 |
2 |
0.063 in (1.6 mm) |
0.787 in (20 mm) |
No |
e4 |
0.787 in (20 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Flat |
48 |
QFF |
Square |
100k Rad(Si) |
Plastic/Epoxy |
1 |
Yes |
125 MHz |
1 |
MIL-PRF-38535 Class V |
14 |
0.0488 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
Flatpack |
0.04 in (1.016 mm) |
125 °C (257 °F) |
Serial |
-55 °C (-67 °F) |
Sample |
Quad |
8 ns |
S-PQFP-F48 |
0.105 in (2.66 mm) |
0.563 in (14.305 mm) |
Yes |
0.563 in (14.305 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
3 |
Yes |
2 V |
40 MHz |
2 |
Hybrid |
MIL-STD-883 Class B |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Flatpack |
QFP68,1.2SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-G68 |
0.95 in (24.13 mm) |
No |
e0 |
0.95 in (24.13 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
128 kHz |
1 |
24 |
0.0015 % |
2.5 V |
2's Complement Binary |
2.5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
105 °C (221 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G16 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
10 V |
117 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
2's Complement Binary |
5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
5.9 µs |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.606 in (15.4 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
454.5 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
1.6 µs |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.653 in (16.585 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
454 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
105 °C (221 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Matte Tin |
Track |
Quad |
1.6 µs |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.653 in (16.585 mm) |
||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
10 MHz |
1 |
BICMOS |
MIL-STD-883 Class B |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Ball |
192 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.4 V |
10250 MHz |
1 |
12 |
0.1807 % |
1 V |
Offset Binary, 2's Complement Binary, Gray Code |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
115 °C (239 °F) |
-1.4 V |
Parallel, Word |
-20 °C (-4 °F) |
Bottom |
0.4 ns |
S-PBGA-B192 |
0.067 in (1.71 mm) |
0.472 in (12 mm) |
0.472 in (12 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.