Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
4 |
Yes |
10 V |
357 kHz |
1 |
BICMOS |
14 |
0.0122 % |
5 V |
2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
2.5 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
245 °C (473 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
4 |
Yes |
10 V |
357 kHz |
1 |
BICMOS |
14 |
0.0122 % |
5 V |
2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
QFP48,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
2.5 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.0159 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
125 MHz |
1 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
60 MHz |
1 |
BICMOS |
10 |
0.1465 % |
5 V |
Offset Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
1 |
Yes |
65 MHz |
2 |
CMOS |
14 |
0.0275 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
1 |
Yes |
2.04 V |
1300 MHz |
1 |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2.04 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
0.714 ns |
S-XQCC-N64 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
0.354 in (9 mm) |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
2.8 MHz |
1 |
12 |
0.0488 % |
3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.9 V |
40 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
40 MHz |
2 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Ball |
140 |
FBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
14 |
0.025 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
70 °C (158 °F) |
-2 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
R-PBGA-B140 |
0.113 in (2.87 mm) |
0.354 in (9 mm) |
e1 |
0.443 in (11.25 mm) |
|||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4.5 V |
1 MHz |
1 |
CMOS |
14 |
5 V |
Offset Binary, 2's Complement Binary, 1's Complement Binary |
3.3/5,5 V |
Flatpack |
QFP44,.5SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
-4.5 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
3.906 µs |
S-PQFP-G44 |
1 |
0.094 in (2.388 mm) |
0.394 in (10.0075 mm) |
No |
e0 |
245 °C (473 °F) |
0.394 in (10.0075 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
4.5 V |
1 MHz |
1 |
CMOS |
14 |
5 V |
Offset Binary, 2's Complement Binary, 1's Complement Binary |
3.3/5,5 V |
Flatpack |
QFP44,.5SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
-4.5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQFP-G44 |
3 |
0.094 in (2.388 mm) |
0.394 in (10.0075 mm) |
No |
e3 |
0.394 in (10.0075 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
10 |
0.1855 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
1.34 V |
1024 MHz |
1 |
12 |
0.0342 % |
1.25 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.34 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
2.8 MHz |
1 |
14 |
0.0244 % |
3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1.5 V |
210 MHz |
1 |
CMOS |
14 |
0.0323 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.9 V |
40 MHz |
1 |
CMOS |
14 |
0.0244 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
14 |
0.0153 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
140 |
FBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2 V |
80 MHz |
1 |
14 |
0.0168 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
105 °C (221 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
R-PBGA-B140 |
0.113 in (2.87 mm) |
0.354 in (9 mm) |
0.443 in (11.25 mm) |
|||||||||||||||||||||
Toshiba |
Analog To Digital Converter, Proprietary Method |
Industrial |
Through-Hole |
42 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5 V |
1 |
CMOS |
13 |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Dual |
41 ms |
R-PDIP-T42 |
0.189 in (4.8 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.094 in (53.2 mm) |
||||||||||||||||||||
|
Renesas Electronics |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.54 V |
125 MHz |
1 |
CMOS |
12 |
0.061 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.54 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
8 ns |
S-PQCC-N48 |
3 |
0.035 in (0.9 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
Renesas Electronics |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
500 mV |
60 MHz |
1 |
CMOS |
10 |
0.1953 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline |
SOP28,.4 |
70 °C (158 °F) |
-500 mV |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
16.66 ns |
R-PDSO-G28 |
|||||||||||||||||||||||
Toshiba |
Analog To Digital Converter, Proprietary Method |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
6 |
No |
5 V |
1 |
CMOS |
8 |
3 mA |
0.3906 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 4 Bits |
-40 °C (-40 °F) |
Tin Lead |
Dual |
2 ms |
R-PDIP-T28 |
0.209 in (5.3 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.457 in (37 mm) |
||||||||||||||||||
Toshiba |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
1 |
CMOS |
13 |
5 V |
Binary |
Flatpack |
0.031 in (0.8 mm) |
85 °C (185 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Quad |
41 ms |
S-PQFP-G44 |
0.12 in (3.05 mm) |
0.551 in (14 mm) |
No |
0.551 in (14 mm) |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Flat |
52 |
GQFF |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 V |
80 MHz |
2 |
Bipolar |
38535Q/M;38534H;883B |
12 |
2's Complement Binary |
3.3,5 V |
Flatpack |
TPAK52,1.5SQ,40 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-1 V |
Serial |
-40 °C (-40 °F) |
Gold |
Track |
Quad |
8 ns |
S-XQFP-F52 |
0.235 in (5.97 mm) |
0.95 in (24.13 mm) |
Yes |
e4 |
0.95 in (24.13 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Automotive |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
2.048 V |
105 MHz |
2 |
MIL-PRF-38534 Class H |
12 |
0.0732 % |
5 V |
2's Complement Binary |
Flatpack |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-2.048 V |
Parallel, Word |
-50 °C (-58 °F) |
Track |
Quad |
10 ns |
S-CQFP-G68 |
0.29 in (7.37 mm) |
0.95 in (24.13 mm) |
Yes |
0.95 in (24.13 mm) |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
3 |
Yes |
2 V |
65 MHz |
2 |
Bipolar |
14 |
5 V |
2's Complement Binary |
3.3,5 V |
-5 V |
Flatpack |
LDCC68,1.0SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Track |
Quad |
S-CQFP-G68 |
0.175 in (4.45 mm) |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
52 |
HLQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.2 V |
105 MHz |
1 |
Bipolar |
14 |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Heat Sink/Slug, Low Profile |
QFP52,.47SQ |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-10 °C (14 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G52 |
3 |
0.063 in (1.6 mm) |
0.472 in (12 mm) |
No |
e3 |
260 °C (500 °F) |
0.472 in (12 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.024 V |
40 MHz |
1 |
BICMOS |
10 |
0.1709 % |
5 V |
Offset Binary |
5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
25 ns |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.705 in (17.9 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
20 MHz |
1 |
CMOS |
10 |
0.1953 % |
3 V |
Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
50 ns |
R-PDSO-G28 |
1 |
0.078 in (1.98 mm) |
0.208 in (5.29 mm) |
e3 |
260 °C (500 °F) |
0.402 in (10.21 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
40 MHz |
1 |
CMOS |
12 |
0.061 % |
5 V |
Binary, 2's Complement Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
1 |
Yes |
1.25 V |
250 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC56,.31SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
4 ns |
S-XQCC-N56 |
3 |
0.039 in (1 mm) |
0.315 in (8 mm) |
No |
e3 |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
1.63 V |
500 MHz |
1 |
12 |
0.0269 % |
1.25 V |
Offset Binary, Complementary Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.63 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
12 |
0.0195 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
12 |
0.022 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Chip Carrier |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
20 MHz |
1 |
CMOS |
12 |
0.0195 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
4 V |
40 MHz |
1 |
CMOS |
12 |
0.033 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N32 |
3 |
0.035 in (0.9 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
4 |
Yes |
1.5 V |
250 MHz |
1 |
CMOS |
12 |
0.0317 % |
1.8 V |
Binary, Offset Binary |
1.8 V |
Chip Carrier |
LCC72,.39SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N72 |
3 |
0.039 in (1 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
16 |
0.00992 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Quad |
333.3 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
52 |
LQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
80 MHz |
1 |
BICMOS |
12 |
0.0366 % |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Low Profile |
QFP52,.47SQ |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
12.5 ns |
S-PQFP-G52 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
100 |
HTFQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
3.5 V |
80 MHz |
1 |
BICMOS |
14 |
0.0079 % |
3 V |
Binary, 2's Complement Binary |
3.3,5 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
TQFP100,.63SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G100 |
3 |
0.047 in (1.2 mm) |
0.551 in (14 mm) |
No |
e3 |
260 °C (500 °F) |
0.551 in (14 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.1 V |
2560 MHz |
1 |
12 |
1.3 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.1 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
0.067 in (1.7 mm) |
0.472 in (12 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
1 |
Yes |
1.5 V |
250 MHz |
1 |
CMOS |
12 |
0.0415 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC56,.31SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
980 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N56 |
3 |
0.039 in (1 mm) |
0.315 in (8 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
1 |
Yes |
2.06 V |
500 MHz |
1 |
14 |
0.0305 % |
1.25 V |
Offset Binary, 2's Complement Binary |
1.25,2.5,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.06 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
2 ns |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
4 |
Yes |
2.16 V |
500 MHz |
1 |
14 |
0.0311 % |
975 mV |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2.16 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
0.416 ns |
S-XQCC-N72 |
3 |
0.039 in (1 mm) |
0.394 in (10 mm) |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.04 V |
1300 MHz |
1 |
14 |
0.0305 % |
950 mV |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.04 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.