18 Analog-to-Digital Converters 304

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

5962-8961604VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

8

0.293 %

5 V

Binary

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

15 µs

R-GDIP-T18

No

AD7574BD/+

Analog Devices

Analog To Digital Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

e0

5962-8776202VB

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

BICMOS

8

7 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8961601VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

CMOS

MIL-STD-883

8

0.1172 %

5 V

Binary, Offset Binary

In-Line

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead

Dual

6 µs

R-GDIP-T18

No

e0

AD7574JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

20 V

1

CMOS

8

0.293 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-20 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

15 µs

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.885 in (22.48 mm)

AD570JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

8

15 mA

0.2 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7575BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

5962-8776202VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-STD-883

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

Yes

e0

5962-01-153-2681

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

15 V

1

CMOS

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

MAX160EWN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Dual

6 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7574SD/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MX7576JEWN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

Small Outline

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

30 µs

R-PDSO-G18

1

No

e0

MX7574KCWN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7574KCWN+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7576KEWN

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

Small Outline

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

30 µs

R-PDSO-G18

1

No

e0

MAX165BCWN+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.39 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MAX160CWN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Dual

6 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7574JCWN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7574TD/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MX7575KEWN+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

MX7575JEWN+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

MAX166DCWN

Analog Devices

Analog To Digital Converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.4 %

5 V

Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G18

No

e0

MAX160MJN/883

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MX7575JCWN+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7574TQ/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MAX165BCWN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.39 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7575KEWN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MAX165BEWN+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.39 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

MAX165BEWN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.39 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MAX160EWN+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin - annealed

Dual

6 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7574JCWN+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

MX7574SQ/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

MAX160CWN+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Dual

6 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

MX7575JCWN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin - annealed

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

PM7574FP

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

20 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-20 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

17 µs

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.885 in (22.48 mm)

5962-8776201VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

BICMOS

38535Q/M;38534H;883B

8

7 mA

0.2 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-01-252-1496

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

0.098 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

ADC908AXMDX

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

5962-8680203VVX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

10

5 V

Binary

-15 V

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

Yes

e0

AD570JN

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

Bipolar

8

Offset Binary

5,-12/-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T18

No

e0

PM7574EX

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

20 V

1

CMOS

8

0.195 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-20 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

17 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8776201VB

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

BICMOS

8

7 mA

5 V

Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7575KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

15 µs

R-PDIP-T18

0.18 in (4.58 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

AD570SCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

18

DIE

Rectangular

1

Yes

5 V

1

Bipolar

8

0.2 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Upper

40 µs

R-XUUC-N18

No

AD7574ACHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

18

DIE

1

Yes

15 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

85 °C (185 °F)

-15 V

Parallel, 8 Bits

-25 °C (-13 °F)

Upper

15 µs

X-XUUC-N18

No

ADC908BXMDB

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.29 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

AD7576SCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

18

DIE

1

Yes

2.46 V

1

CMOS

8

5 V

Binary

Uncased Chip

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Upper

20 µs

X-XUUC-N18

No

e0

AD7574BD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.