18 Analog-to-Digital Converters 304

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX160CC/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

18

DIE

Rectangular

1

Yes

10 V

1

CMOS

8

0.1953 %

5 V

Binary

5 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Upper

4 µs

R-XUUC-N18

1

No

AD7575JEWN

Maxim Integrated

Analog To Digital Converter

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.4 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G18

No

e0

MX7575JN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

15 µs

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.9 in (22.86 mm)

MAX160MJN/HR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

6 µs

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7576JN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

30 µs

R-PDIP-T18

1

No

e0

MX7575TQ/883B

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

2.583 V

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Track

Dual

15 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

0.96 in (24.38 mm)

MAX165BEPN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.58 V

200 kHz

1

CMOS

8

6 mA

0.39 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

15 µs

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.9 in (22.86 mm)

MAX165BCWN-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.39 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.455 in (11.55 mm)

MX7575AQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial Extended

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

85 °C (185 °F)

0 mV

Serial

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-CDIP-T18

1

No

e0

MX7574AD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

1

No

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIE OR CHIP

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-XDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e4

MX7576KN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

In-Line

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

30 µs

R-PDIP-T18

1

No

e0

MX7576JN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

30 µs

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.9 in (22.86 mm)

MX7575KCWN-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

MX7576TQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

In-Line

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead

Track

Dual

30 µs

R-CDIP-T18

1

No

e0

MAX165AEWN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.195 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7574KN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

MX7575TQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

In-Line

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead

Track

Dual

15 µs

R-CDIP-T18

1

No

e0

MX7575JCWN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

Small Outline

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin/Lead

Track

Dual

15 µs

R-PDSO-G18

1

No

e0

MX7575JEWN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

Small Outline

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

15 µs

R-PDSO-G18

1

No

e0

245 °C (473 °F)

MAX165ACWN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.195 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.455 in (11.55 mm)

MAX160EWN-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

6 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

MAX165BCWN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.39 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.455 in (11.55 mm)

MAX160MJN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

6 µs

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

MAX160CPN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Dual

6 µs

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.9 in (22.86 mm)

MX7574BD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

1

No

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-XDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e4

MX7575JCWN-T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

15 µs

R-PDSO-G18

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

MAX165AEWN+T

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.195 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.455 in (11.55 mm)

MAX160EPN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Matte Tin

Dual

6 µs

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.9 in (22.86 mm)

AD7576JEWN

Maxim Integrated

Analog To Digital Converter

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.4 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G18

No

e0

MX7576SQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead

Track

Dual

30 µs

R-CDIP-T18

1

No

e0

MX7576KCWN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

30 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

AD7575KEWN

Maxim Integrated

Analog To Digital Converter

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.2 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G18

No

e0

MX7574J/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

18

DIE

Rectangular

1

Yes

10 V

1

CMOS

8

5 V

Binary, Offset Binary, Complementary Offset Binary

Uncased Chip

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

No

e0

MAX165ACWN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.58 V

200 kHz

1

CMOS

8

6 mA

0.195 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

15 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MAX165ACPN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.58 V

200 kHz

1

CMOS

8

6 mA

0.195 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

15 µs

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.9 in (22.86 mm)

MX7576KN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

30 µs

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

0.9 in (22.86 mm)

MX7574TD

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

1

No

10 V

1

CMOS

8

0.2 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e0

MX7576JCWN+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

30 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.455 in (11.55 mm)

MX7575SQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin/Lead

Track

Dual

15 µs

R-CDIP-T18

1

No

e0

MX7575KN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

In-Line

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

15 µs

R-PDIP-T18

1

No

e0

245 °C (473 °F)

MX7574SQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7574AQ

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MX7574TQ/HR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

MAX160C/D

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

18

DIE

Rectangular

1

Yes

10 V

1

CMOS

8

5 V

Binary, Offset Binary, Complementary Offset Binary

Uncased Chip

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Upper

R-XUUC-N18

1

No

e0

MAX160CWN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

0.3 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

6 µs

R-PDSO-G18

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

245 °C (473 °F)

0.455 in (11.55 mm)

AD7575KCWN

Maxim Integrated

Analog To Digital Converter

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.2 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G18

No

e0

MX7576JCWN

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

Small Outline

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin/Lead

Track

Dual

30 µs

R-PDSO-G18

1

No

e0

AD7574TQ/HR

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

MIL-STD-883 Class B (Modified)

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.