18 Analog-to-Digital Converters 304

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD7575JRZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Matte Tin

Track

Dual

15 µs

R-PDSO-G18

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

0.455 in (11.55 mm)

5962-01-137-0285

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

8

0.195 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

PM7574HP

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

8

0.29 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T18

No

e0

PM7574BX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

20 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-20 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

17 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7574JN/+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-15 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

15 µs

R-PDIP-T18

0.176 in (4.48 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

ADC908FP

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

10 V

1

CMOS

8

2.5 mA

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

7 µs

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.885 in (22.48 mm)

AD7576JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

MIL-M-38510

8

0.3906 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

20 µs

R-PDIP-T18

0.18 in (4.58 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

AD7574AD/883B

Analog Devices

Analog To Digital Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

5962-8680201VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Bipolar

MIL-STD-883

8

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

PM7574FS

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

20 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary

5 V

Small Outline

SOP18,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-20 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

17 µs

R-PDSO-G18

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

AD571SCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

No Lead

18

DIE

1

Yes

5 V

1

Bipolar

10

0.098 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

Uncased Chip

DIE OR CHIP

Analog to Digital Converters

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Upper

40 µs

X-XUUC-N18

No

ADC908FS

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

18

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

8

2.5 mA

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

7 µs

R-PDSO-G18

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.455 in (11.55 mm)

AD7574AD

Analog Devices

Analog To Digital Converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

AD571KD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

10

15 mA

0.049 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

AD7576AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-M-38510

8

0.3906 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Sample

Dual

20 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

ADC908BIFX

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

2.5 mA

0.293 %

5 V

Binary, Offset Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

7 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8961602VA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

MIL-STD-883

8

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

6 µs

R-GDIP-T18

No

AD9688TQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3.3 V

200 MHz

1

Bipolar

4

85 mA

0.3906 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.7 V

Parallel, 4 Bits

-55 °C (-67 °F)

Tin Lead

Dual

5.7 ns

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7576AQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Sample

Dual

30 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-01-230-8392

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

15 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

AD7576BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-M-38510

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

20 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

5962-01-156-8895

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

15 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

PM7574AX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

20 V

1

CMOS

8

0.195 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-20 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

17 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7574KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

20 V

1

CMOS

8

0.195 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-20 V

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

15 µs

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.885 in (22.48 mm)

ADC908BXMDX

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.29 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

ADC908AX/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

2.5 mA

0.1953 %

5 V

Binary, Offset Binary, Complementary Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

7 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC908EX

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

10 V

1

CMOS

8

2.5 mA

0.1953 %

5 V

Binary, Offset Binary, Complementary Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

7 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

ADC908AXMDB

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

5962-8961602VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

CMOS

MIL-STD-883

8

0.293 %

5 V

Binary, Offset Binary

In-Line

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin/Lead

Dual

6 µs

R-GDIP-T18

No

e0

AD571KD/+

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Bipolar

10

0.049 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.14 in (3.55 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

5962-01-254-9515

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

15 V

1

CMOS

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-PDIP-T18

No

AD571SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

40 kHz

1

Bipolar

10

15 mA

0.098 %

5 V

Binary, Offset Binary

5,-12/-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.86 mm)

5962-01-174-7679

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

10

0.098 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

AD7576KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

MIL-M-38510

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Dual

20 µs

R-PDIP-T18

0.18 in (4.58 mm)

0.3 in (7.62 mm)

No

e0

0.9 in (22.865 mm)

AD7575TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Track

Dual

15 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

AD7574SD

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

15 V

1

CMOS

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

AD7574AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

20 V

1

CMOS

8

0.293 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-20 V

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

15 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

5962-8680201VA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Bipolar

MIL-STD-883

8

15 mA

0.195 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

40 µs

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

Yes

e0

ADC-908

Analog Devices

Analog To Digital Converter, Successive Approximation

No Lead

18

DIE

1

Yes

20 V

1

CMOS

8

0.29 %

5 V

Binary, Offset Binary

Uncased Chip

-20 V

Parallel, 8 Bits

Tin Lead

Upper

6 µs

X-XUUC-N18

No

e0

5962-01-201-1762

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

10

0.098 %

Offset Binary

5,-12/-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Dual

R-XDIP-T18

No

5962-01-204-0777

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

10 V

1

Bipolar

38535Q/M;38534H;883B

8

0.195 %

Offset Binary

5,-15 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

AD7576JN/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

30 µs

R-PDIP-T18

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.885 in (22.48 mm)

PM7574FX

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

20 V

1

CMOS

8

0.293 %

5 V

Binary, Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-20 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Dual

17 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7576TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-STD-883 Class B

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

20 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

AD7574TD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

15 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

ADC908BX/883C

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

1

No

10 V

1

CMOS

38535Q/M;38534H;883B

8

0.29 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T18

No

e0

AD7575BCHIPS

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

No Lead

18

DIE

1

Yes

2.46 V

1

CMOS

8

0.1953 %

5 V

Offset Binary

Uncased Chip

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Track

Upper

15 µs

X-XUUC-N18

No

TDE8715D-T

NXP Semiconductors

Analog To Digital Converter, Resistance Ladder

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

6.25 MHz

1

Bipolar

8

0.293 %

Binary

-5.2 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, 8 Bits

-55 °C (-67 °F)

Dual

R-CDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.