Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
170 MHz |
1 |
CMOS |
12 |
0.0513 % |
2.5 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
170 MHz |
1 |
CMOS |
12 |
0.0513 % |
2.5 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
12 |
0.0366 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
25 MHz |
1 |
CMOS |
14 |
0.0153 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
14 |
0.0153 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
150 MHz |
1 |
CMOS |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.016 in (0.4 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
150 MHz |
1 |
CMOS |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.016 in (0.4 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10.2525 V |
800 kHz |
1 |
CMOS |
18 |
9.1 mA |
0.001144409 % |
15 V |
Binary, 2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
QFP48,.28SQ,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10.2275 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
550 ns |
S-PQFP-G48 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Automotive |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
6 |
Yes |
1.25 V |
1.5 MHz |
1 |
12 |
0.0244 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
6 |
Yes |
1.25 V |
1.5 MHz |
1 |
12 |
0.0244 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
3.5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3.3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
285 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
4.104 V |
1 MHz |
1 |
CMOS |
18 |
0.001 % |
5 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-4.088 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
527 ns |
S-PQCC-N32 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
0.197 in (5 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.62 V |
1 |
24 |
0.0015 % |
3.3 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-120 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
163.44 ms |
S-PDSO-G10 |
1 |
0.046 in (1.17 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
6 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
1 |
CMOS |
16 |
0.0153 % |
3 V |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
42 ms |
S-PDSO-N6 |
1 |
0.031 in (0.8 mm) |
0.079 in (2 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.079 in (2 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.253 V |
1 |
CMOS |
16 |
0.0183 % |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
4.8 ms |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
1 |
CMOS |
16 |
0.001 % |
5 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
151 ms |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
1 |
CMOS |
16 |
0.001 % |
5 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
149.9 ms |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
Maxim Integrated |
Analog To Digital Converter |
Commercial |
No Lead |
28 |
HVQCCN |
Square |
16 |
Yes |
1.825 V |
300 kHz |
1 |
BICMOS |
10 |
0.0977 % |
2's Complement Binary |
3/3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-500 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter |
Commercial |
No Lead |
28 |
HVQCCN |
Square |
16 |
Yes |
1.825 V |
300 kHz |
1 |
BICMOS |
10 |
0.0977 % |
2's Complement Binary |
3/3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-500 mV |
Serial |
0 °C (32 °F) |
Matte Tin - annealed |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
80 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
840 mV |
800 MHz |
1 |
6 |
1.5625 % |
5 V |
2's Complement Binary |
3.3,5 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP80,.55SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
760 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
e0 |
0.472 in (12 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
80 |
HTFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
840 mV |
800 MHz |
1 |
6 |
1.5625 % |
5 V |
2's Complement Binary |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
760 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
S-PQFP-G80 |
3 |
0.047 in (1.2 mm) |
0.472 in (12 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
12 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.188 V |
1 |
18 |
0.0023 % |
5 V |
Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Dual |
1.5 µs |
S-PDSO-N12 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
3.6 V |
246 kHz |
1 |
BICMOS |
24 |
0.001 % |
3.3 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Dual |
S-PDSO-G10 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
0.118 in (3 mm) |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
3.6 V |
246 kHz |
1 |
BICMOS |
24 |
0.001 % |
3.3 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
3.6 V |
1 |
BICMOS |
18 |
0.001 % |
2's Complement Binary |
1.8,3.6 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
2.128 V |
94.4 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
7.5 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||
|
Analog Devices |
Digital To Analog Converter |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.128 V |
94.4 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-2.128 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
7.5 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
456 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
1.98 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
245 °C (473 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
456 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Offset Binary, 2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
1.98 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
456 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
1.98 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
456 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
2's Complement Binary |
3,5 V |
Flatpack, Low Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-10 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
1.98 µs |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
1 |
Yes |
1 |
15 |
5 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-XQCC-N56 |
3 |
0.031 in (0.8 mm) |
0.315 in (8 mm) |
No |
e0 |
245 °C (473 °F) |
0.315 in (8 mm) |
||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
1 |
Yes |
1 |
15 |
5 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-XQCC-N56 |
3 |
0.031 in (0.8 mm) |
0.315 in (8 mm) |
No |
e0 |
0.315 in (8 mm) |
|||||||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
56 |
HVQCCN |
Square |
1 |
Yes |
1 |
15 |
5 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin |
Track |
Quad |
S-XQCC-N56 |
3 |
0.031 in (0.8 mm) |
0.315 in (8 mm) |
No |
e3 |
0.315 in (8 mm) |
||||||||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
8 |
SOP |
Square |
Plastic/Epoxy |
2 |
Yes |
5.5 V |
100 kHz |
1 |
CMOS |
TS 16949 |
12 |
0.0488 % |
5.5 V |
Binary |
3/5 V |
0 V |
Small Outline |
SOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
6.66 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
8 |
SOP |
Square |
Plastic/Epoxy |
2 |
Yes |
5.5 V |
100 kHz |
1 |
CMOS |
TS 16949 |
12 |
0.0488 % |
5.5 V |
Binary |
3/5 V |
0 V |
Small Outline |
SOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
6.66 µs |
S-PDSO-G8 |
3 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
10 |
LSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.2 V |
500 kHz |
1 |
CMOS |
AEC-Q100 |
12 |
600 μA |
1.8 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-5 V |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
1.4 µs |
S-PDSO-G10 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
|||||||||||||||||
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
500 kHz |
1 |
AEC-Q100 |
14 |
900 μA |
0.0091 % |
1.8 V |
Binary |
Small Outline, Very Thin Profile |
SOLCC10,.12,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-100 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
750 ns |
S-PDSO-N10 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
||||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Delta-Sigma |
Automotive |
Gull Wing |
8 |
SOP |
Square |
Plastic/Epoxy |
2 |
Yes |
2.048 V |
2.4 kHz |
1 |
TS 16949 |
18 |
180 μA |
0.0035 % |
5 V |
2's Complement Binary |
3/5 V |
Small Outline |
SOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-2.048 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Microchip Technology |
Analog To Digital Converter, Delta-Sigma |
Automotive |
Gull Wing |
8 |
SOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
30.72 kHz |
1 |
TS 16949 |
22 |
185 μA |
0.0006 % |
5 V |
2's Complement Binary |
2.7/5 V |
Small Outline |
SOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
16.8367 ms |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||
|
Microchip Technology |
Analog To Digital Converter, Flash Method |
Industrial |
Butt |
124 |
HVBCC |
Square |
8 |
Yes |
1.26 V |
200 MHz |
1 |
16 |
226 mA |
1.2 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LGA124,18X18,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.14 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Bottom |
25 ns |
S-XBCC-B124 |
1 |
0.037 in (0.95 mm) |
0.354 in (9 mm) |
e4 |
0.354 in (9 mm) |
|||||||||||||||||
Nuvoton Technology |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
4 |
Yes |
96 kHz |
1 |
24 |
1.8 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.16SQ,16 |
0.016 in (0.4 mm) |
85 °C (185 °F) |
Serial |
-40 °C (-40 °F) |
Quad |
S-XQCC-N28 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
0.157 in (4 mm) |
||||||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Automotive |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
14.2 V |
768 kHz |
1 |
AEC-Q100 |
32 |
3.3 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
2 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
3 |
Yes |
2 V |
40 MHz |
2 |
Hybrid |
MIL-STD-883 |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
Flatpack |
QFP68,1.2SQ,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-2 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQFP-G68 |
0.95 in (24.13 mm) |
Yes |
e0 |
0.95 in (24.13 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Ball |
36 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2.6 V |
1 MHz |
1 |
16 |
0.003815 % |
5 V |
Binary, 2’s Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Bottom |
415 ns |
S-PBGA-B36 |
1 |
0.022 in (0.56 mm) |
0.117 in (2.96 mm) |
30 s |
260 °C (500 °F) |
0.117 in (2.96 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
3.3 V |
1 MHz |
2 |
14 |
0.0183 % |
5 V |
2's Complement Binary |
3/5,5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
105 °C (221 °F) |
700 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
560 ns |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
2 |
Yes |
3.755 V |
500 kHz |
2 |
14 |
0.0183 % |
5 V |
2's Complement Binary |
3/5,5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
105 °C (221 °F) |
1.255 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
530 ns |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
3.6 V |
3 MHz |
1 |
10 |
0.0977 % |
3 V |
Binary |
2.5/3.3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
291 ns |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.