Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
105 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
105 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.25 V |
105 MHz |
1 |
CMOS |
14 |
0.0092 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
10 |
0.0586 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
12 |
0.0366 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.0214 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
12 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0214 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.5 V |
105 MHz |
1 |
CMOS |
16 |
0.0069 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
1 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N40 |
1 |
0.031 in (0.8 mm) |
0.236 in (6 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1.9 V |
40 MHz |
2 |
CMOS |
12 |
0.0342 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
1 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
80 MHz |
1 |
CMOS |
14 |
0.0305 % |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
6 |
Yes |
1.25 V |
1.5 MHz |
1 |
14 |
0.0183 % |
3 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.25 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
3.5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3.3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
285 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
HTSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
3.5 MHz |
1 |
CMOS |
14 |
0.0244 % |
3.3 V |
Binary |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
285 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
5 V |
1 MHz |
1 |
CMOS |
16 |
0.0015 % |
5 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.5 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
527 ns |
S-PQCC-N32 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
0.197 in (5 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
1 |
24 |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
149.64 ms |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 |
20 |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Matte Tin |
Dual |
163.44 ms |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
2 |
Yes |
512 mV |
45 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
2 |
Yes |
512 mV |
45 MHz |
1 |
CMOS |
8 |
0.3906 % |
3 V |
Offset Binary |
1.8,3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
16 |
Yes |
2.65 V |
300 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
16 |
Yes |
2.65 V |
300 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
12 |
HVQCCN |
Square |
1 |
Yes |
4.106 V |
1.8 MHz |
1 |
BICMOS |
12 |
0.0305 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC12,.16SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Quad |
556 ns |
S-XQCC-N12 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e0 |
0.157 in (4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
12 |
HVQCCN |
Square |
1 |
Yes |
4.106 V |
1.8 MHz |
1 |
BICMOS |
12 |
0.0305 % |
5 V |
Binary |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC12,.16SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin - annealed |
Track |
Quad |
556 ns |
S-XQCC-N12 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
4 |
Yes |
2.0685 V |
133 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.0275 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
7.5 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
245 °C (473 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
4 |
Yes |
2.0685 V |
133 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.0275 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
7.5 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 |
CMOS |
9 V |
Binary |
9 V |
Flatpack |
QFP44,.5SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10.0075 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10.0075 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 |
CMOS |
9 V |
Binary |
9 V |
Flatpack |
QFP44,.5SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10.0075 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10.0075 mm) |
||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 |
CMOS |
9 V |
Binary |
9 V |
Flatpack |
QFP44,.5SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
0.096 in (2.45 mm) |
0.394 in (10.0075 mm) |
No |
0.394 in (10.0075 mm) |
||||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Dual-Slope |
Commercial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
1 |
Yes |
1 |
CMOS |
9 V |
Binary |
9 V |
Flatpack |
QFP44,.5SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Quad |
S-PQFP-G44 |
0.096 in (2.45 mm) |
0.394 in (10.0075 mm) |
No |
0.394 in (10.0075 mm) |
||||||||||||||||||||||||
Maxim Integrated |
Analog To Digital Converter |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
0.05 % |
9 V |
Binary |
9 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 V |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J44 |
1 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e0 |
0.653 in (16.585 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter |
Commercial |
J Bend |
44 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
10 V |
1 |
CMOS |
0.05 % |
9 V |
Binary |
9 V |
Chip Carrier |
LDCC44,.7SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 V |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-J44 |
3 |
0.18 in (4.57 mm) |
0.653 in (16.585 mm) |
No |
e3 |
245 °C (473 °F) |
0.653 in (16.585 mm) |
||||||||||||||||
|
Maxim Integrated |
Digital To Analog Converter |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
1.825 V |
416 kHz |
1 |
BICMOS |
8 |
0.0781 % |
1.6 V |
2's Complement Binary |
1.8/3.3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-300 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
Maxim Integrated |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
3.6 V |
416 kHz |
1 |
BICMOS |
8 |
0.0781 % |
1.6 V |
Binary, 2's Complement Binary |
1.8/3.3 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
1.8 µs |
S-PDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e0 |
245 °C (473 °F) |
0.118 in (3 mm) |
||||||||||||
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
AEC-Q100; TS 16949 |
12 |
2.4 mA |
1.8 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-5.1 V |
Serial |
-40 °C (-40 °F) |
Dual |
750 ns |
S-PDSO-G10 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
||||||||||||||||||||
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
500 kHz |
1 |
AEC-Q100; TS 16949 |
16 |
2 mA |
0.0091 % |
1.8 V |
Offset Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-5 V |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
1.3 µs |
S-PDSO-N10 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
||||||||||||||||||
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
10 |
TSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5 V |
500 kHz |
1 |
AEC-Q100; TS 16949 |
16 |
2 mA |
0.0091 % |
1.8 V |
Offset Binary |
Small Outline, Thin Profile |
TSSOP10,.19,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-5 V |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
1.3 µs |
S-PDSO-G10 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
||||||||||||||||||
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
AEC-Q100 |
12 |
900 μA |
1.8 V |
Binary |
Small Outline, Very Thin Profile |
SOLCC10,.12,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-100 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
750 ns |
S-PDSO-N10 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
|||||||||||||||||||
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
500 kHz |
1 |
AEC-Q100 |
14 |
900 μA |
0.0091 % |
1.8 V |
Binary |
Small Outline, Very Thin Profile |
SOLCC10,.12,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-100 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
750 ns |
S-PDSO-N10 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
||||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Delta-Sigma |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
2 |
Yes |
2.048 V |
2.4 kHz |
1 |
TS 16949 |
18 |
180 μA |
0.0035 % |
5 V |
2's Complement Binary |
3/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.048 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-N10 |
1 |
0.039 in (1 mm) |
0.118 in (3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Microchip Technology |
Analog To Digital Converter, Delta-Sigma |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
2.048 V |
2.4 kHz |
1 |
TS 16949 |
18 |
180 μA |
0.0035 % |
5 V |
2's Complement Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.048 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
0.118 in (3 mm) |
|||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
124 |
HLGA |
Square |
8 |
Yes |
200 MHz |
1 |
TS 16949 |
12 |
1.2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Bottom |
25 ns |
S-XBGA-N124 |
0.035 in (0.9 mm) |
0.354 in (9 mm) |
e4 |
0.354 in (9 mm) |
|||||||||||||||||||||
Microchip Technology |
Analog To Digital Converter, Flash Method |
Automotive |
Ball |
121 |
TFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
4.46 V |
200 MHz |
1 |
AEC-Q100 |
16 |
300 mA |
1.2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Thin Profile, Fine Pitch |
BGA121,11X11,25 |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-4.46 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Sample |
Bottom |
25 ns |
S-PBGA-B121 |
0.043 in (1.08 mm) |
0.315 in (8 mm) |
0.315 in (8 mm) |
|||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
3.2 V |
25 MHz |
1 |
16 |
0.007629395 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,16 |
0.016 in (0.4 mm) |
105 °C (221 °F) |
-3.2 V |
Serial |
-40 °C (-40 °F) |
Quad |
S-PQCC-N40 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
Peak-to-peak input voltage range: 3.2 V |
0.197 in (5 mm) |
||||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2 V |
250 MHz |
1 |
14 |
113 mA |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Sample |
Quad |
S-PQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
0.276 in (7 mm) |
||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
48 |
TFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
5.6 V |
216 kHz |
1 |
24 |
3.3 V |
2's Complement Binary |
3.3,4 V |
Flatpack, Thin Profile, Fine Pitch |
TQFP48,.35SQ |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
250 kHz |
1 |
CMOS |
16 |
1 μA |
5 V |
2's Complement Binary |
3/5,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
2.7 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
17 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.