Ball Analog-to-Digital Converters 351

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD4630-24BBCZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

64

FBGA

Square

Plastic/Epoxy

2

Yes

5.07 V

2 MHz

1

24

0.00009 %

1.8 V

Binary

Grid Array, Fine Pitch

BGA64,8X8,32

0.031 in (0.8 mm)

125 °C (257 °F)

-5.07 V

Serial

-40 °C (-40 °F)

Track

Bottom

300 ns

S-PBGA-B64

4

0.076 in (1.92 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD4630-24BBCZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

64

FBGA

Square

Plastic/Epoxy

2

Yes

5.07 V

2 MHz

1

24

0.00009 %

1.8 V

Binary

Grid Array, Fine Pitch

BGA64,8X8,32

0.031 in (0.8 mm)

125 °C (257 °F)

-5.07 V

Serial

-40 °C (-40 °F)

Track

Bottom

300 ns

S-PBGA-B64

4

0.076 in (1.92 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

ADS52J90ZZE

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

198

LFBGA

Rectangular

Plastic/Epoxy

16

Yes

2 V

65 MHz

1

14

0.0183 %

1.8 V

2's Complement Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

15 ns

R-PBGA-B198

3

0.055 in (1.4 mm)

0.354 in (9 mm)

Peak-to-peak input voltage range: 2 V

e1

30 s

260 °C (500 °F)

0.591 in (15 mm)

AD9689BBPZ-2000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

2

Yes

2 V

2000 MHz

1

14

0.0494 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.062 in (1.57 mm)

0.472 in (12 mm)

0.472 in (12 mm)

AD9684BBPZ-500

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

2

Yes

2.06 V

1250 MHz

1

14

0.0305 %

1.25 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2.06 V

Serial, Parallel, Word

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.059 in (1.49 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD7689BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

20

VFBGA

Square

Plastic/Epoxy

8

Yes

2.9 V

250 kHz

1

CMOS

16

0.0023 %

2.5 V

2's Complement Binary

2.5/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,5X9,17/10

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

250 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

2.2 µs

S-PBGA-B20

1

0.022 in (0.56 mm)

0.094 in (2.39 mm)

No

e1

0.094 in (2.39 mm)

ADC12D1600RFIUT/NOPB

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1600 MHz

1

CMOS

12

2.31 A

0.177 %

1.9 V

Binary, Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

AD9249BBCZ-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

16

Yes

2 V

65 MHz

1

CMOS

14

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

100 ns

S-PBGA-B144

3

0.067 in (1.7 mm)

0.394 in (10 mm)

No

e1

0.394 in (10 mm)

MCP37D11-80E/TE

Microchip Technology

Analog To Digital Converter, Proprietary Method

Automotive

Ball

121

TFBGA

Square

Plastic/Epoxy

8

Yes

2.975 V

80 MHz

1

AEC-Q100

12

173 mA

1.2 V

2’s Complement, Offset Binary

Grid Array, Thin Profile, Fine Pitch

BGA121,11X11,25

0.026 in (0.65 mm)

125 °C (257 °F)

-2.975 V

Serial

-40 °C (-40 °F)

Bottom

4 ns

S-PBGA-B121

0.043 in (1.08 mm)

0.315 in (8 mm)

0.315 in (8 mm)

AD7682BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

20

VFBGA

Square

Plastic/Epoxy

8

Yes

2.5 V

250 kHz

1

16

0.0023 %

5 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

2.2 ms

S-PBGA-B20

1

0.022 in (0.56 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0.094 in (2.39 mm)

ADC12D1800CIUT/NOPB

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1800 MHz

1

12

2.481 A

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

AD9207BBPZ-6G

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

324

BGA

Square

Plastic/Epoxy

2

Yes

1.475 V

6000 MHz

1

12

350 mA

0.033691 %

1 V

Binary

Grid Array

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-1.475 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B324

3

0.068 in (1.72 mm)

0.591 in (15 mm)

260 °C (500 °F)

0.591 in (15 mm)

AD9207BBPZRL-6G

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

324

BGA

Square

Plastic/Epoxy

2

Yes

1.475 V

6000 MHz

1

12

350 mA

0.033691 %

1 V

Binary

Grid Array

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-1.475 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B324

3

0.068 in (1.72 mm)

0.591 in (15 mm)

260 °C (500 °F)

0.591 in (15 mm)

ADC12D1600CIUT/NOPB

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1600 MHz

1

12

0.1172 %

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

TLV320ADC3001IYZHT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

2

Yes

3.6 V

96 kHz

1

16

3.3 V

2's Complement Binary

1.8,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

No

e1

30 s

260 °C (500 °F)

ADS5407IZAYR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

2

Yes

1 V

500 MHz

1

12

270 mA

0.1221 %

1.8 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

Peak-to-peak input voltage range: 1 V

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

ADC12D1800CIUT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1800 MHz

1

12

2.481 A

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e0

20 s

220 °C (428 °F)

1.063 in (27 mm)

ADC12D1800RFIUT/NOPB

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

1

Yes

800 mV

3600 MHz

1

12

2.481 A

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

ADC12D1600RFIUT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1600 MHz

1

CMOS

12

2.31 A

0.177 %

1.9 V

Binary, Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e0

20 s

220 °C (428 °F)

1.063 in (27 mm)

ADC12D2000RFIUT/NOPB

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

860 mV

4000 MHz

1

12

2 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.05 in (1.27 mm)

85 °C (185 °F)

-860 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

ADC12DJ5200RFAAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

5200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.825 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ5200RFAAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

5200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.825 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

PADC12DJ5200RFAAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

825 mV

5200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-825 mV

Serial

-40 °C (-40 °F)

Track

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

0.394 in (10 mm)

ADC12D2000RFIUT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

860 mV

4000 MHz

1

12

2 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.05 in (1.27 mm)

85 °C (185 °F)

-860 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

20 s

220 °C (428 °F)

1.063 in (27 mm)

ADC12D500RFIUT/NOPB

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

500 MHz

1

12

0.177 %

1.9 V

Binary, Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

DDC232CZXGT

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Commercial

Ball

64

LFBGA

Square

Plastic/Epoxy

32

Yes

5.25 V

3.125 kHz

1

20

0.05 %

5 V

Binary, Offset Binary

3,5 V

Grid Array, Low Profile, Fine Pitch

BGA64,8X8,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B64

3

0.057 in (1.45 mm)

0.315 in (8 mm)

No

e1

260 °C (500 °F)

0.315 in (8 mm)

AD7699BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

20

VFBGA

Square

Plastic/Epoxy

8

Yes

2.9 V

500 kHz

1

Bipolar

16

0.0038 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

85 °C (185 °F)

-250 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

1.675 µs

S-PBGA-B20

1

0.022 in (0.56 mm)

0.094 in (2.39 mm)

e1

0.094 in (2.39 mm)

ADS7066IYBHR

Texas Instruments

Analog To Digital Converter, Successive Approximation

Automotive

Ball

16

BGA

Square

Plastic/Epoxy

8

Yes

5.5 V

250 kHz

1

16

1.6 mA

0.0061 %

3.3 V

Binary

Grid Array

1.65 V

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

e1

30 s

260 °C (500 °F)

MAX11261ENX+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Ball

36

VFBGA

Square

Plastic/Epoxy

6

Yes

3.6 V

16 kHz

1

24

5.65 mA

0.0015 %

3.465 V

Offset Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,16

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin/Silver/Copper/Nickel

Bottom

S-PBGA-B36

1

0.02 in (0.5 mm)

0.112 in (2.838 mm)

e2

30 s

260 °C (500 °F)

0.112 in (2.838 mm)

AD9213BBPZ-10G

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

192

HBGA

Square

Plastic/Epoxy

1

Yes

1.4 V

10250 MHz

1

12

0.1514 %

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

115 °C (239 °F)

-1.4 V

Parallel, Word

-20 °C (-4 °F)

Bottom

0.4 ns

S-PBGA-B192

0.067 in (1.71 mm)

0.472 in (12 mm)

0.472 in (12 mm)

ADS5407IZAY

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

2

Yes

1 V

500 MHz

1

12

270 mA

0.1221 %

1.8 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

Peak-to-peak input voltage range: 1 V

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

ADC12DJ3200AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

3200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ3200AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

3200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD4030-24BBCZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

64

FBGA

Square

Plastic/Epoxy

1

Yes

5.07 V

2 MHz

1

24

11.2 mA

0.00009 %

1.8 V

Binary

Grid Array, Fine Pitch

BGA64,8X8,32

0.031 in (0.8 mm)

125 °C (257 °F)

-5.07 V

Serial

-40 °C (-40 °F)

Track

Bottom

300 ns

S-PBGA-B64

0.076 in (1.92 mm)

0.276 in (7 mm)

0.276 in (7 mm)

AD4030-24BBCZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

64

FBGA

Square

Plastic/Epoxy

1

Yes

5.07 V

2 MHz

1

24

11.2 mA

0.00009 %

1.8 V

Binary

Grid Array, Fine Pitch

BGA64,8X8,32

0.031 in (0.8 mm)

125 °C (257 °F)

-5.07 V

Serial

-40 °C (-40 °F)

Track

Bottom

300 ns

S-PBGA-B64

0.076 in (1.92 mm)

0.276 in (7 mm)

0.276 in (7 mm)

AD9684BBPZRL7-500

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

2

Yes

2.06 V

1250 MHz

1

14

0.0305 %

1.25 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2.06 V

Serial, Parallel, Word

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.059 in (1.49 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

ADC12D1000CIUT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1000 MHz

1

12

0.1172 %

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e0

20 s

220 °C (428 °F)

1.063 in (27 mm)

ADC12D1600CCMLS

Texas Instruments

Analog To Digital Converter, Proprietary Method

Military

Ball

376

HBGA

Square

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

2

Yes

800 mV

3200 MHz

1

CMOS

MIL-STD-883

12

1.29 A

0.1831 %

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

PGA376(UNSPEC)

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-800 mV

Serial

-55 °C (-67 °F)

Track

Bottom

S-CBGA-B376

1

0.138 in (3.5 mm)

1.1 in (27.94 mm)

No

Peak-to-peak input voltage range: 0.8 V

1.1 in (27.94 mm)

ADC12D1600CCMPR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Military

Ball

376

HBGA

Square

300k Rad(Si)

Ceramic, Metal-Sealed Cofired

2

Yes

800 mV

3200 MHz

1

CMOS

MIL-STD-883

12

1.29 A

0.1831 %

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

PGA376(UNSPEC)

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-800 mV

Serial

-55 °C (-67 °F)

Track

Bottom

S-CBGA-B376

1

0.138 in (3.5 mm)

1.1 in (27.94 mm)

No

Peak-to-peak input voltage range: 0.8 V

1.1 in (27.94 mm)

MCP37D21-80E/TE

Microchip Technology

Analog To Digital Converter, Pipelined

Automotive

Ball

121

TFBGA

Square

Plastic/Epoxy

8

Yes

4.46 V

80 MHz

1

AEC-Q100

14

173 mA

1.2 V

Offset Binary, 2's Complement Binary

Grid Array, Thin Profile, Fine Pitch

BGA121,11X11,25

0.026 in (0.65 mm)

125 °C (257 °F)

-4.46 V

Parallel, Word

-40 °C (-40 °F)

Sample

Bottom

12.5 ns

S-PBGA-B121

0.043 in (1.08 mm)

0.315 in (8 mm)

0.315 in (8 mm)

AD9249BBCZRL7-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

16

Yes

2 V

65 MHz

1

CMOS

14

0.0183 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

100 ns

S-PBGA-B144

3

0.067 in (1.7 mm)

0.394 in (10 mm)

No

e1

0.394 in (10 mm)

ADC12DL3200ACF

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

2

Yes

1.04 V

3200 MHz

1

12

1.3 A

1.1 V

Offset Binary, 2's Complement Binary

Grid Array

BGA256,16X16,39

0.039 in (1 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

0.13 in (3.31 mm)

0.669 in (17 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.669 in (17 mm)

PADC12DL3200ACF

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

2

Yes

1.04 V

3200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array

0.039 in (1 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Bottom

S-PBGA-B256

0.13 in (3.31 mm)

0.669 in (17 mm)

0.669 in (17 mm)

ADC08DJ3200AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

3200 MHz

1

8

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial, Parallel, 8 Bits

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12D1000CIUT/NOPB

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1000 MHz

1

12

0.1172 %

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

AD9208BBPZ-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

4

Yes

1.7 V

3000 MHz

1

14

0.1282 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.7 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.06 in (1.53 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

ADC12D1000RFIUT/NOPB

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1000 MHz

1

CMOS

12

2.105 A

0.177 %

1.9 V

Binary, Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

ADC12D1800RFIUT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

1

Yes

800 mV

3600 MHz

1

12

2.481 A

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e0

20 s

220 °C (428 °F)

1.063 in (27 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.