Ball Analog-to-Digital Converters 351

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

ADC12DJ2700AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

2700 MHz

1

12

950 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

DDC264CZAWR

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Commercial

Ball

100

LFBGA

Square

Plastic/Epoxy

64

Yes

1

20

0.00015 %

5 V

Offset Binary

3,5 V

Grid Array, Low Profile, Fine Pitch

BGA100,10X10,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B100

3

0.059 in (1.5 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9652BBCZ-310

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2

Yes

2.5 V

310 MHz

1

16

3.3 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

12.5 ns

S-PBGA-B144

3

0.055 in (1.4 mm)

0.394 in (10 mm)

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ2700AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

2700 MHz

1

12

950 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DL3200ALJ

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

2

Yes

800 mV

3200 MHz

1

12

1.3 A

1.1 V

2's Complement Binary

Grid Array

BGA256,16X16,39

0.039 in (1 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

0.13 in (3.31 mm)

0.669 in (17 mm)

Peak-to-peak input voltage range: 0.8 V

e0

20 s

220 °C (428 °F)

0.669 in (17 mm)

LTM9006CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

25 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

3

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

260 °C (500 °F)

0.443 in (11.25 mm)

AD9689BBPZ-2600

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

2

Yes

2 V

2600 MHz

1

14

0.0793 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.062 in (1.57 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

ADAQ4003BBCZ

Analog Devices

Data Acquisition Device, Wireless

Automotive

Ball

49

FBGA

Square

Plastic/Epoxy

1

Yes

22.044 V

2 MHz

1

18

0.0008 %

1.8 V

2's Complement Binary

Grid Array, Fine Pitch

BGA49,7X7,32

0.031 in (0.8 mm)

125 °C (257 °F)

-5.28 V

Serial

-40 °C (-40 °F)

Bottom

320 ns

S-PBGA-B49

3

0.096 in (2.432 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

ADC12D1600CIUT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1600 MHz

1

12

0.1172 %

1.9 V

Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e0

20 s

220 °C (428 °F)

1.063 in (27 mm)

ADC12DJ3200ZEG

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

1.04 V

6400 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-500 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin/Lead

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e0

20 s

235 °C (455 °F)

0.394 in (10 mm)

ADC12DJ3200ZEGT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

1.04 V

6400 MHz

1

12

1.1 V

2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial

-40 °C (-40 °F)

Tin/Lead

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e0

20 s

235 °C (455 °F)

0.394 in (10 mm)

MAX11607EWC+

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

4

Yes

2.128 V

94.4 kHz

1

BICMOS

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

6.8 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11607EWC+T

Maxim Integrated

Digital To Analog Converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

4

Yes

1.8 V

94.4 kHz

1

BICMOS

10

0.0977 %

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

6.8 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MCP37D31-200E/TE

Microchip Technology

Analog To Digital Converter, Flash Method

Automotive

Ball

121

TFBGA

Square

Plastic/Epoxy

8

Yes

4.46 V

200 MHz

1

AEC-Q100

16

300 mA

1.2 V

Offset Binary, 2's Complement Binary

Grid Array, Thin Profile, Fine Pitch

BGA121,11X11,25

0.026 in (0.65 mm)

125 °C (257 °F)

-4.46 V

Serial, Parallel, Word

-40 °C (-40 °F)

Sample

Bottom

25 ns

S-PBGA-B121

0.043 in (1.08 mm)

0.315 in (8 mm)

0.315 in (8 mm)

AD9213BBPZ-6G

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

192

HBGA

Square

Plastic/Epoxy

1

Yes

1.4 V

10250 MHz

1

12

0.1807 %

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

115 °C (239 °F)

-1.4 V

Parallel, Word

-20 °C (-4 °F)

Bottom

0.4 ns

S-PBGA-B192

0.067 in (1.71 mm)

0.472 in (12 mm)

0.472 in (12 mm)

ADC12D800RFIUT/NOPB

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

CMOS

12

0.177 %

1.9 V

Binary, Offset Binary, 2's Complement Binary

1.9 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-800 mV

Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

No

Peak-to-peak input voltage range: 0.8 V

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

ADC12DJ5200RFZEG

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

Rectangular

Plastic/Epoxy

2

Yes

825 mV

5200 MHz

1

12

950 μA

0.048828125 %

1.1 V

Offset Binary, 2's Complement Binary

85 °C (185 °F)

-825 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Bottom

R-PBGA-B144

3

Peak-to-peak input voltage range: 0.825 V

e0

235 °C (455 °F)

ADC12DJ5200RFZEGT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

Rectangular

Plastic/Epoxy

2

Yes

825 mV

5200 MHz

1

12

950 μA

0.048828125 %

1.1 V

Offset Binary, 2's Complement Binary

85 °C (185 °F)

-825 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Bottom

R-PBGA-B144

3

Peak-to-peak input voltage range: 0.825 V

e0

235 °C (455 °F)

ADC12QJ1600AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.075 in (1.91 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ1600AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

AEC-Q100

12

100 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADS5403IZAY

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

1

Yes

1 V

500 MHz

1

12

170 mA

0.1221 %

1.8 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

Peak-to-peak input voltage range: 1 V

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

MAX11613EWC+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

4

Yes

1.064 V

51 kHz

1

BICMOS

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

7.5 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11613EWC+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

4

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

7.5 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

AD4698BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

36

VFBGA

Square

Plastic/Epoxy

8

Yes

2.6 V

1 MHz

1

16

0.003815 %

5 V

Binary, 2’s Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-2.4 V

Serial, Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

1

0.022 in (0.56 mm)

0.117 in (2.96 mm)

30 s

260 °C (500 °F)

0.117 in (2.96 mm)

ADS7066IYBHT

Texas Instruments

Analog To Digital Converter, Successive Approximation

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

8

Yes

5.5 V

250 kHz

1

16

1.56 mA

0.006103515625 %

3.3 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

1.65 V

0.016 in (0.4 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

3.2 µs

S-PBGA-B16

1

0.016 in (0.4 mm)

0.064 in (1.6205 mm)

e1

30 s

260 °C (500 °F)

0.064 in (1.6205 mm)

DDC264CKZAW

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Commercial

Ball

100

LFBGA

Square

Plastic/Epoxy

64

Yes

1

20

0.00015 %

5 V

Offset Binary

3,5 V

Grid Array, Low Profile, Fine Pitch

BGA100,10X10,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B100

3

0.059 in (1.5 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.354 in (9 mm)

DDC264CKZAWR

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Commercial

Ball

100

LFBGA

Square

Plastic/Epoxy

64

Yes

1

20

0.00015 %

5 V

Offset Binary

3,5 V

Grid Array, Low Profile, Fine Pitch

BGA100,10X10,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B100

3

0.059 in (1.5 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.354 in (9 mm)

DDC264CZAW

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Commercial

Ball

100

LFBGA

Square

Plastic/Epoxy

64

Yes

1

20

0.00015 %

5 V

Offset Binary

3,5 V

Grid Array, Low Profile, Fine Pitch

BGA100,10X10,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B100

3

0.059 in (1.5 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.354 in (9 mm)

TLV320ADC3001IYZHR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

2

Yes

3.6 V

96 kHz

1

16

3.3 V

2's Complement Binary

1.8,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

No

e1

30 s

260 °C (500 °F)

MAX108CHC-D

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Ball

192

LBGA

Square

Plastic/Epoxy

1

Yes

525 mV

1500 MHz

1

Bipolar

8

0.1953 %

5 V

Offset Binary

3.3/5,±5 V

-5 V

Grid Array, Low Profile

BGA192,16X16,50

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

475 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B192

3

0.066 in (1.67 mm)

0.984 in (25 mm)

No

0.984 in (25 mm)

ADAQ23878BBCZ

Analog Devices

Data Acquisition Device, Wireless

Ball

100

FBGA

Square

Plastic/Epoxy

1

Yes

11 V

15 MHz

1

18

52 mA

0.00078 %

5 V

2's Complement Binary

Grid Array, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

85 °C (185 °F)

-11 V

Serial

-40 °C (-40 °F)

Sample

Bottom

63 ns

S-PBGA-B100

0.093 in (2.368 mm)

0.354 in (9 mm)

0.354 in (9 mm)

LTM9008CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

LTM2173HY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

4

Yes

2 V

80 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

105 °C (221 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

0.443 in (11.25 mm)

AD9625BBPZ-2.5

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.1 V

2560 MHz

1

12

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.1 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD9681BBCZ-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

14

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

100 ns

S-PBGA-B144

3

0.067 in (1.7 mm)

0.394 in (10 mm)

e1

0.394 in (10 mm)

ADS4449IZCR

Texas Instruments

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

4

Yes

2 V

250 MHz

1

14

0.032 %

1.9 V

2's Complement Binary

1.8,1.9,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B144

3

0.059 in (1.5 mm)

0.394 in (10 mm)

No

Peak-to-peak input voltage range: 2 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

LTM9011CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

0.443 in (11.25 mm)

TSC2003IZQCT

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Ball

48

VFBGA

Square

Plastic/Epoxy

2

Yes

5.25 V

50 kHz

1

CMOS

12

0.0977 %

2.7 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B48

0.039 in (1 mm)

0.157 in (4 mm)

No

0.157 in (4 mm)

ADS5122IGHK

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

257

LFBGA

Square

Plastic/Epoxy

8

Yes

1.42 V

65 MHz

1

CMOS

10

0.2441 %

1.8 V

Offset Binary

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA257,19X19,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

760 mV

Parallel, Word

-40 °C (-40 °F)

Track

Bottom

S-PBGA-B257

0.055 in (1.4 mm)

0.63 in (16 mm)

No

0.63 in (16 mm)

ADS5402IZAYR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

2

Yes

1 V

800 MHz

1

12

350 mA

0.1221 %

1.8 V

Offset Binary, 2's Complement Binary

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

Peak-to-peak input voltage range: 1 V

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

ADC09DJ1300AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.06445 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADS4449IZCRT

Texas Instruments

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

4

Yes

2 V

250 MHz

1

14

0.032 %

1.9 V

2's Complement Binary

1.8,1.9,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B144

3

0.059 in (1.5 mm)

0.394 in (10 mm)

No

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

LM97600CIUT/NOPB

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

4

Yes

930 mV

5000 MHz

1

BICMOS

8

0.39 %

1.2 V

Offset Binary

1.2,2.5 V

Grid Array, Heat Sink/Slug

BGA292,20X20,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-930 mV

Serial

-40 °C (-40 °F)

Tin Silver

Sample

Bottom

0.8 ns

S-PBGA-B292

3

0.094 in (2.4 mm)

1.063 in (27 mm)

No

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

ADC12D800/500RFIUT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

870 mV

1600 MHz

1

12

0.177 %

1.9 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

BGA292,20X20,50

0.05 in (1.27 mm)

85 °C (185 °F)

-870 mV

Parallel, Word, Serial

-40 °C (-40 °F)

Track

Bottom

S-PBGA-B292

0.094 in (2.4 mm)

1.063 in (27 mm)

1.063 in (27 mm)

XDS7066IYBHR

Texas Instruments

Analog To Digital Converter, Successive Approximation

Automotive

Ball

16

BGA

Square

Plastic/Epoxy

8

Yes

11 V

250 kHz

1

16

1.6 mA

0.0061 %

3.3 V

Binary

Grid Array

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B16

ADC09DJ800AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

PADC12DJ5200ALREP

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

825 mV

10400 MHz

1

12

1.65 mA

0.048828 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-825 mV

Serial

-55 °C (-67 °F)

Bottom

S-PBGA-B144

0.075 in (1.91 mm)

0.394 in (10 mm)

0.394 in (10 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.