Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
2700 MHz |
1 |
12 |
950 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Ball |
100 |
LFBGA |
Square |
Plastic/Epoxy |
64 |
Yes |
1 |
20 |
0.00015 % |
5 V |
Offset Binary |
3,5 V |
Grid Array, Low Profile, Fine Pitch |
BGA100,10X10,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
S-PBGA-B100 |
3 |
0.059 in (1.5 mm) |
0.354 in (9 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Ball |
144 |
LFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
310 MHz |
1 |
16 |
3.3 V |
Offset Binary, 2's Complement Binary, Gray Code |
Grid Array, Low Profile, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2.5 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
12.5 ns |
S-PBGA-B144 |
3 |
0.055 in (1.4 mm) |
0.394 in (10 mm) |
e1 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
2700 MHz |
1 |
12 |
950 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
3200 MHz |
1 |
12 |
1.3 A |
1.1 V |
2's Complement Binary |
Grid Array |
BGA256,16X16,39 |
0.039 in (1 mm) |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
0.13 in (3.31 mm) |
0.669 in (17 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
220 °C (428 °F) |
0.669 in (17 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Ball |
140 |
FBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2 V |
25 MHz |
1 |
14 |
0.0168 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
70 °C (158 °F) |
-2 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
R-PBGA-B140 |
3 |
0.113 in (2.87 mm) |
0.354 in (9 mm) |
e1 |
260 °C (500 °F) |
0.443 in (11.25 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
2600 MHz |
1 |
14 |
0.0793 % |
975 mV |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B196 |
3 |
0.062 in (1.57 mm) |
0.472 in (12 mm) |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
|
Analog Devices |
Data Acquisition Device, Wireless |
Automotive |
Ball |
49 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
22.044 V |
2 MHz |
1 |
18 |
0.0008 % |
1.8 V |
2's Complement Binary |
Grid Array, Fine Pitch |
BGA49,7X7,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-5.28 V |
Serial |
-40 °C (-40 °F) |
Bottom |
320 ns |
S-PBGA-B49 |
3 |
0.096 in (2.432 mm) |
0.276 in (7 mm) |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
1600 MHz |
1 |
12 |
0.1172 % |
1.9 V |
Offset Binary, 2's Complement Binary |
1.9 V |
Grid Array, Heat Sink/Slug |
BGA292,20X20,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-800 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
S-PBGA-B292 |
3 |
0.102 in (2.58 mm) |
1.063 in (27 mm) |
No |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
220 °C (428 °F) |
1.063 in (27 mm) |
||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.04 V |
6400 MHz |
1 |
12 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-500 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin/Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.04 V |
6400 MHz |
1 |
12 |
1.1 V |
2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial |
-40 °C (-40 °F) |
Tin/Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
||||||||||||||||||
|
Maxim Integrated |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2.128 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Maxim Integrated |
Digital To Analog Converter |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.8 V |
94.4 kHz |
1 |
BICMOS |
10 |
0.0977 % |
2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
6.8 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
|||||||||||
Microchip Technology |
Analog To Digital Converter, Flash Method |
Automotive |
Ball |
121 |
TFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
4.46 V |
200 MHz |
1 |
AEC-Q100 |
16 |
300 mA |
1.2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Thin Profile, Fine Pitch |
BGA121,11X11,25 |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-4.46 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Sample |
Bottom |
25 ns |
S-PBGA-B121 |
0.043 in (1.08 mm) |
0.315 in (8 mm) |
0.315 in (8 mm) |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Ball |
192 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.4 V |
10250 MHz |
1 |
12 |
0.1807 % |
1 V |
Offset Binary, 2's Complement Binary, Gray Code |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
115 °C (239 °F) |
-1.4 V |
Parallel, Word |
-20 °C (-4 °F) |
Bottom |
0.4 ns |
S-PBGA-B192 |
0.067 in (1.71 mm) |
0.472 in (12 mm) |
0.472 in (12 mm) |
|||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
800 MHz |
1 |
CMOS |
12 |
0.177 % |
1.9 V |
Binary, Offset Binary, 2's Complement Binary |
1.9 V |
Grid Array, Heat Sink/Slug |
BGA292,20X20,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-800 mV |
Parallel, Word |
-40 °C (-40 °F) |
Tin Silver |
Track |
Bottom |
S-PBGA-B292 |
3 |
0.102 in (2.58 mm) |
1.063 in (27 mm) |
No |
Peak-to-peak input voltage range: 0.8 V |
e2 |
30 s |
250 °C (482 °F) |
1.063 in (27 mm) |
||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
825 mV |
5200 MHz |
1 |
12 |
950 μA |
0.048828125 % |
1.1 V |
Offset Binary, 2's Complement Binary |
85 °C (185 °F) |
-825 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
R-PBGA-B144 |
3 |
Peak-to-peak input voltage range: 0.825 V |
e0 |
235 °C (455 °F) |
|||||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
825 mV |
5200 MHz |
1 |
12 |
950 μA |
0.048828125 % |
1.1 V |
Offset Binary, 2's Complement Binary |
85 °C (185 °F) |
-825 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Bottom |
R-PBGA-B144 |
3 |
Peak-to-peak input voltage range: 0.825 V |
e0 |
235 °C (455 °F) |
|||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
800 mV |
1600 MHz |
1 |
12 |
0.046386 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.075 in (1.91 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
800 mV |
1600 MHz |
1 |
AEC-Q100 |
12 |
100 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
500 MHz |
1 |
12 |
170 mA |
0.1221 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA196,14X14,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
S-PBGA-B196 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
Peak-to-peak input voltage range: 1 V |
e1 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.064 V |
51 kHz |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
Binary, 2's Complement Binary |
3/3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA12,3X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
7.5 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
12 |
VFBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
1.8 V |
1 |
BICMOS |
12 |
0.0244 % |
3 V |
2's Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
7.5 µs |
R-PBGA-B12 |
1 |
0.027 in (0.69 mm) |
0.074 in (1.885 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.087 in (2.215 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Ball |
36 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2.6 V |
1 MHz |
1 |
16 |
0.003815 % |
5 V |
Binary, 2’s Complement Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Bottom |
415 ns |
S-PBGA-B36 |
1 |
0.022 in (0.56 mm) |
0.117 in (2.96 mm) |
30 s |
260 °C (500 °F) |
0.117 in (2.96 mm) |
||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
250 kHz |
1 |
16 |
1.56 mA |
0.006103515625 % |
3.3 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,16 |
1.65 V |
0.016 in (0.4 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
3.2 µs |
S-PBGA-B16 |
1 |
0.016 in (0.4 mm) |
0.064 in (1.6205 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.064 in (1.6205 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Ball |
100 |
LFBGA |
Square |
Plastic/Epoxy |
64 |
Yes |
1 |
20 |
0.00015 % |
5 V |
Offset Binary |
3,5 V |
Grid Array, Low Profile, Fine Pitch |
BGA100,10X10,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
S-PBGA-B100 |
3 |
0.059 in (1.5 mm) |
0.354 in (9 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Ball |
100 |
LFBGA |
Square |
Plastic/Epoxy |
64 |
Yes |
1 |
20 |
0.00015 % |
5 V |
Offset Binary |
3,5 V |
Grid Array, Low Profile, Fine Pitch |
BGA100,10X10,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
S-PBGA-B100 |
3 |
0.059 in (1.5 mm) |
0.354 in (9 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Ball |
100 |
LFBGA |
Square |
Plastic/Epoxy |
64 |
Yes |
1 |
20 |
0.00015 % |
5 V |
Offset Binary |
3,5 V |
Grid Array, Low Profile, Fine Pitch |
BGA100,10X10,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
S-PBGA-B100 |
3 |
0.059 in (1.5 mm) |
0.354 in (9 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
3.6 V |
96 kHz |
1 |
16 |
3.3 V |
2's Complement Binary |
1.8,3.3 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
|||||||||||||||||
Maxim Integrated |
Analog To Digital Converter, Flash Method |
Commercial |
Ball |
192 |
LBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
525 mV |
1500 MHz |
1 |
Bipolar |
8 |
0.1953 % |
5 V |
Offset Binary |
3.3/5,±5 V |
-5 V |
Grid Array, Low Profile |
BGA192,16X16,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
475 mV |
Parallel, 8 Bits |
0 °C (32 °F) |
Track |
Bottom |
S-PBGA-B192 |
3 |
0.066 in (1.67 mm) |
0.984 in (25 mm) |
No |
0.984 in (25 mm) |
|||||||||||||||
|
Analog Devices |
Data Acquisition Device, Wireless |
Ball |
100 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
11 V |
15 MHz |
1 |
18 |
52 mA |
0.00078 % |
5 V |
2's Complement Binary |
Grid Array, Fine Pitch |
BGA100,10X10,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-11 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
63 ns |
S-PBGA-B100 |
0.093 in (2.368 mm) |
0.354 in (9 mm) |
0.354 in (9 mm) |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Ball |
140 |
FBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2 V |
65 MHz |
1 |
14 |
0.025 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
70 °C (158 °F) |
-2 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
R-PBGA-B140 |
0.113 in (2.87 mm) |
0.354 in (9 mm) |
e1 |
0.443 in (11.25 mm) |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
140 |
FBGA |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
2 V |
80 MHz |
1 |
14 |
0.0168 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
105 °C (221 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
R-PBGA-B140 |
0.113 in (2.87 mm) |
0.354 in (9 mm) |
0.443 in (11.25 mm) |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.1 V |
2560 MHz |
1 |
12 |
1.3 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.1 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
0.067 in (1.7 mm) |
0.472 in (12 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Ball |
144 |
LFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
125 MHz |
1 |
14 |
0.0244 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Low Profile, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
100 ns |
S-PBGA-B144 |
3 |
0.067 in (1.7 mm) |
0.394 in (10 mm) |
e1 |
0.394 in (10 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
Ball |
144 |
LFBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
250 MHz |
1 |
14 |
0.032 % |
1.9 V |
2's Complement Binary |
1.8,1.9,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA144,12X12,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
S-PBGA-B144 |
3 |
0.059 in (1.5 mm) |
0.394 in (10 mm) |
No |
Peak-to-peak input voltage range: 2 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Ball |
140 |
FBGA |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2 V |
125 MHz |
1 |
14 |
0.025 % |
1.8 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
70 °C (158 °F) |
-2 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Silver Copper |
Sample |
Bottom |
R-PBGA-B140 |
0.113 in (2.87 mm) |
0.354 in (9 mm) |
No |
e1 |
0.443 in (11.25 mm) |
||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
Ball |
48 |
VFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
5.25 V |
50 kHz |
1 |
CMOS |
12 |
0.0977 % |
2.7 V |
Binary |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Bottom |
S-PBGA-B48 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
0.157 in (4 mm) |
||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
257 |
LFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
1.42 V |
65 MHz |
1 |
CMOS |
10 |
0.2441 % |
1.8 V |
Offset Binary |
1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA257,19X19,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
760 mV |
Parallel, Word |
-40 °C (-40 °F) |
Track |
Bottom |
S-PBGA-B257 |
0.055 in (1.4 mm) |
0.63 in (16 mm) |
No |
0.63 in (16 mm) |
|||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
800 MHz |
1 |
12 |
350 mA |
0.1221 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA196,14X14,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
S-PBGA-B196 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
Peak-to-peak input voltage range: 1 V |
e1 |
30 s |
260 °C (500 °F) |
0.472 in (12 mm) |
||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
1300 MHz |
1 |
AEC-Q100 |
9 |
0.06445 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
800 mV |
800 MHz |
1 |
AEC-Q100 |
12 |
0.046386 % |
1.1 V |
2’s Complement, Offset Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Flash Method |
Industrial |
Ball |
144 |
LFBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
2 V |
250 MHz |
1 |
14 |
0.032 % |
1.9 V |
2's Complement Binary |
1.8,1.9,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA144,12X12,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Sample |
Bottom |
S-PBGA-B144 |
3 |
0.059 in (1.5 mm) |
0.394 in (10 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
930 mV |
5000 MHz |
1 |
BICMOS |
8 |
0.39 % |
1.2 V |
Offset Binary |
1.2,2.5 V |
Grid Array, Heat Sink/Slug |
BGA292,20X20,50 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-930 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver |
Sample |
Bottom |
0.8 ns |
S-PBGA-B292 |
3 |
0.094 in (2.4 mm) |
1.063 in (27 mm) |
No |
e2 |
30 s |
250 °C (482 °F) |
1.063 in (27 mm) |
||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
292 |
HBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
870 mV |
1600 MHz |
1 |
12 |
0.177 % |
1.9 V |
Offset Binary, 2's Complement Binary |
Grid Array, Heat Sink/Slug |
BGA292,20X20,50 |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-870 mV |
Parallel, Word, Serial |
-40 °C (-40 °F) |
Track |
Bottom |
S-PBGA-B292 |
0.094 in (2.4 mm) |
1.063 in (27 mm) |
1.063 in (27 mm) |
|||||||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Automotive |
Ball |
16 |
BGA |
Square |
Plastic/Epoxy |
8 |
Yes |
11 V |
250 kHz |
1 |
16 |
1.6 mA |
0.0061 % |
3.3 V |
Binary |
Grid Array |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B16 |
||||||||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
800 MHz |
1 |
9 |
0.09765 % |
1.1 V |
2’s Complement, Offset Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
825 mV |
10400 MHz |
1 |
12 |
1.65 mA |
0.048828 % |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-825 mV |
Serial |
-55 °C (-67 °F) |
Bottom |
S-PBGA-B144 |
0.075 in (1.91 mm) |
0.394 in (10 mm) |
0.394 in (10 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.