Ball Analog-to-Digital Converters 351

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTM2893HY-1#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Ball

36

BGA

Rectangular

Plastic/Epoxy

8

Yes

100 MHz

1

5 V

Binary

Grid Array

0.039 in (1 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Bottom

R-PBGA-B36

3

0.089 in (2.26 mm)

0.246 in (6.25 mm)

30 s

260 °C (500 °F)

0.591 in (15 mm)

AD9689BBPZRL-2000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

2

Yes

2 V

2000 MHz

1

14

0.0494 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.062 in (1.57 mm)

0.472 in (12 mm)

0.472 in (12 mm)

ADAQ23875BBC

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

100

FBGA

Square

Plastic/Epoxy

1

Yes

2.048 V

15 MHz

1

16

52 mA

0.000915 %

5 V

Offset Binary

Grid Array, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

85 °C (185 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Sample

Bottom

63 ns

S-PBGA-B100

0.093 in (2.368 mm)

0.354 in (9 mm)

0.354 in (9 mm)

AD9209BBPZRL-4G

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

324

HFBGA

Square

Plastic/Epoxy

4

Yes

1.4 V

4000 MHz

1

12

0.12207 %

2 V

Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-1.4 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B324

0.068 in (1.72 mm)

0.591 in (15 mm)

0.591 in (15 mm)

LTM9007CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

40 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

ADAQ4001BBCZ-RL13

Analog Devices

Data Acquisition Device

Ball

49

FBGA

Square

Plastic/Epoxy

1

Yes

12.705 V

2 MHz

1

16

0.00119 %

1.8 V

2’s Complement Hexadecimal

Grid Array, Fine Pitch

BGA49,7X7,20

0.02 in (0.5 mm)

125 °C (257 °F)

-5.28 V

Serial

-40 °C (-40 °F)

Bottom

320 ns

S-PBGA-B49

3

0.096 in (2.432 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD15452BBC

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

81

LBGA

Square

1

Yes

296 mV

65 MHz

4

12

3.3 V

Offset Binary

3.3 V

Grid Array, Low Profile

BGA81,9X9,40

Analog to Digital Converters

0.039 in (1 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Sample

Bottom

S-XBGA-B81

0.067 in (1.7 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

AD10201AB

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

385

BGA

Square

Plastic/Epoxy

1

Yes

1.75 V

105 MHz

2

12

0.0366 %

5 V

2's Complement Binary

3.3,5 V

Grid Array

BGA385,25X25,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Track

Bottom

S-PBGA-B385

3

0.075 in (1.9 mm)

1.378 in (35 mm)

No

225 °C (437 °F)

1.378 in (35 mm)

AD9681BBCPZRL7-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

CMOS

14

0.0244 %

1.8 V

Offset Binary

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

8 µs

S-PBGA-B144

0.067 in (1.7 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

AD9681BBCPZ-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

CMOS

14

0.0244 %

1.8 V

Offset Binary

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

8 µs

S-PBGA-B144

0.067 in (1.7 mm)

0.394 in (10 mm)

No

0.394 in (10 mm)

LTM9012CY-AB#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

221

FBGA

Rectangular

Plastic/Epoxy

4

Yes

200 mV

125 MHz

1

14

0.0305 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-200 mV

Serial

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B221

0.117 in (2.97 mm)

0.443 in (11.25 mm)

e1

0.591 in (15 mm)

AD9289BBC

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

64

LFBGA

Square

Plastic/Epoxy

4

Yes

2 V

65 MHz

1

CMOS

8

0.2344 %

3 V

Binary, 2's Complement Binary

3 V

Grid Array, Low Profile, Fine Pitch

BGA64,8X8,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

1 V

Serial

-40 °C (-40 °F)

Tin Lead Silver

Sample

Bottom

S-PBGA-B64

3

0.067 in (1.7 mm)

0.315 in (8 mm)

No

e0

240 °C (464 °F)

0.315 in (8 mm)

ADAS1127

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

BGA

Square

Plastic/Epoxy

64

Yes

1

24

Binary

Grid Array

Serial

Sample

Bottom

S-PBGA-B

AD9625BBPZRL-2.5

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.1 V

2560 MHz

1

12

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.1 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD9681BBCZRL7-125

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

14

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

100 ns

S-PBGA-B144

3

0.067 in (1.7 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD9699WBBPZRL-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

196

HLFBGA

Square

Plastic/Epoxy

1

Yes

1.54 V

3000 MHz

1

AEC-Q100

14

408.5 mA

0.11047 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug, Low Profile, Fine Pitch

BGA196,14X14,32

0.031 in (0.8 mm)

105 °C (221 °F)

-1.54 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.06 in (1.53 mm)

0.472 in (12 mm)

0.472 in (12 mm)

AD9699WBBPZ-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

196

HLFBGA

Square

Plastic/Epoxy

1

Yes

1.54 V

3000 MHz

1

AEC-Q100

14

408.5 mA

0.11047 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug, Low Profile, Fine Pitch

BGA196,14X14,32

0.031 in (0.8 mm)

105 °C (221 °F)

-1.54 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.06 in (1.53 mm)

0.472 in (12 mm)

0.472 in (12 mm)

AD4696BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

32

VFBGA

Square

Plastic/Epoxy

16

Yes

5.75 V

1 MHz

1

16

0.003814697 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

AD4695BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

32

VFBGA

Square

Plastic/Epoxy

16

Yes

5.75 V

500 kHz

1

16

0.003814697 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

MAX19777AZA+

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Ball

8

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.3 V

3 MHz

1

CMOS

12

0.0488 %

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.014 in (0.35 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Sample

Bottom

R-PBGA-B8

1

0.015 in (0.37 mm)

0.034 in (0.857 mm)

e2

30 s

260 °C (500 °F)

0.056 in (1.432 mm)

MAX11615EWE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

8

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

Analog to Digital Converters

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Track

Bottom

7.5 µs

R-PBGA-B16

1

0.027 in (0.69 mm)

0.079 in (1.995 mm)

No

e2

30 s

260 °C (500 °F)

0.084 in (2.145 mm)

MAX11259AWX+

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

Ball

36

VFBGA

Square

Plastic/Epoxy

6

Yes

3.6 V

16 kHz

1

CMOS

24

6.2 mA

0.0015 %

3.6 V

Offset Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.116 in (2.957 mm)

e2

30 s

260 °C (500 °F)

0.116 in (2.957 mm)

MAX11615EWE+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

8

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Track

Bottom

7.5 µs

R-PBGA-B16

1

0.027 in (0.69 mm)

0.079 in (1.995 mm)

e2

30 s

260 °C (500 °F)

0.084 in (2.145 mm)

MAX11647EWC+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

2.128 V

1 MHz

1

BICMOS

10

0.0977 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

6.8 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11645EWC+T

Analog Devices

Digital To Analog Converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

1

Yes

1.064 V

94.4 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.064 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

7.5 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11647EWC+T

Analog Devices

Digital To Analog Converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

1

Yes

1.064 V

94.4 kHz

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.064 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

6.8 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX19777AZA+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Ball

8

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.3 V

3 MHz

1

CMOS

12

0.0488 %

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.014 in (0.35 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Sample

Bottom

R-PBGA-B8

1

0.015 in (0.37 mm)

0.034 in (0.857 mm)

e2

30 s

260 °C (500 °F)

0.056 in (1.432 mm)

MAX11617EWE+T

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

12

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Track

Bottom

7.5 µs

R-PBGA-B16

1

0.027 in (0.69 mm)

0.079 in (1.995 mm)

e2

30 s

260 °C (500 °F)

0.084 in (2.145 mm)

MAX11259AWX+T

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

Ball

36

VFBGA

Square

Plastic/Epoxy

6

Yes

3.6 V

16 kHz

1

CMOS

24

6.2 mA

0 %

3.6 V

2's Complement Binary

0 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.116 in (2.957 mm)

e2

30 s

260 °C (500 °F)

0.116 in (2.957 mm)

MAX11645EWC+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

1.064 V

94.4 kHz

1

BICMOS

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

7.5 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.074 in (1.885 mm)

No

e1

30 s

260 °C (500 °F)

0.087 in (2.215 mm)

MAX11617EWE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

12

Yes

1.8 V

1

BICMOS

12

0.0244 %

3 V

2's Complement Binary

3/3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

Analog to Digital Converters

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper Nickel

Track

Bottom

7.5 µs

R-PBGA-B16

1

0.027 in (0.69 mm)

0.079 in (1.995 mm)

No

e2

30 s

260 °C (500 °F)

0.084 in (2.145 mm)

AD4697BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

36

VFBGA

Square

Plastic/Epoxy

8

Yes

2.6 V

500 kHz

1

16

0.003815 %

5 V

Binary, 2’s Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-2.4 V

Serial, Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

TDA8754EL/21

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

210 MHz

1

8

0.5078 %

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/14

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

140 MHz

1

8

0.5078 %

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/14/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

140 MHz

1

8

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

-10 °C (14 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/11

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

110 MHz

1

8

0.5078 %

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/25

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

250 MHz

1

8

0.5078 %

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/17

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

170 MHz

1

8

0.5078 %

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/27

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

270 MHz

1

8

0.5078 %

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/21/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

210 MHz

1

8

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

-10 °C (14 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/17/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

170 MHz

1

8

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

-10 °C (14 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/11/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

110 MHz

1

8

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

-10 °C (14 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

TDA8754EL/27/C1

NXP Semiconductors

Analog To Digital Converter, Proprietary Method

Commercial

Ball

208

LBGA

Square

Plastic/Epoxy

3

Yes

1 V

270 MHz

1

8

3.3 V

Binary

3.3 V

Grid Array, Low Profile

BGA208,16X16,40

Analog to Digital Converters

0.039 in (1 mm)

70 °C (158 °F)

500 mV

Parallel, 8 Bits

-10 °C (14 °F)

Track

Bottom

S-PBGA-B208

0.065 in (1.65 mm)

0.669 in (17 mm)

No

0.669 in (17 mm)

MAX19527EXE+

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Ball

144

TFBGA

Square

Plastic/Epoxy

8

Yes

1.5 V

50 MHz

1

12

0.042 %

1.8 V

Offset Binary, 2's Complement Binary

1.8 V

Grid Array, Thin Profile, Fine Pitch

BGA144,12X12,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Track

Bottom

20 ns

S-PBGA-B144

0.047 in (1.2 mm)

0.394 in (10 mm)

No

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX11100EWC+

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

200 kHz

1

BICMOS

16

0.0031 %

5 V

Binary

5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA12,3X4,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

240 µs

R-PBGA-B12

1

0.027 in (0.69 mm)

0.061 in (1.55 mm)

No

e1

30 s

260 °C (500 °F)

0.084 in (2.135 mm)

MAX19527EXE+T

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Ball

144

TFBGA

Square

Plastic/Epoxy

8

Yes

1.5 V

50 MHz

1

12

0.042 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.5 V

Serial

-40 °C (-40 °F)

Track

Bottom

20 ns

S-PBGA-B144

0.047 in (1.2 mm)

0.394 in (10 mm)

0.394 in (10 mm)

MAX104CHC-TD

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Ball

192

LBGA

Square

Plastic/Epoxy

1

Yes

525 mV

1000 MHz

1

Bipolar

8

0.1953 %

5 V

Offset Binary

3,±5 V

-5 V

Grid Array, Low Profile

BGA192,16X16,50

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

475 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Bottom

S-PBGA-B192

3

0.066 in (1.67 mm)

0.984 in (25 mm)

No

e0

0.984 in (25 mm)

MAX108CHC-B50105

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Ball

192

LBGA

Square

Plastic/Epoxy

1

Yes

525 mV

1500 MHz

1

Bipolar

8

0.1953 %

5 V

Offset Binary

-5 V

Grid Array, Low Profile

0.05 in (1.27 mm)

70 °C (158 °F)

-525 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B192

0.066 in (1.67 mm)

0.984 in (25 mm)

0.984 in (25 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.