Ball Analog-to-Digital Converters 351

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD10401AB

Analog Devices

Analog To Digital Converter

Other

Ball

625

BGA

Square

Plastic/Epoxy

1

Yes

2

14

2's Complement Binary

3.3,5 V

Grid Array

BGA625,25X25,40

Analog to Digital Converters

0.039 in (1 mm)

85 °C (185 °F)

0 °C (32 °F)

Bottom

S-PBGA-B625

No

AD5590BBC

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

80

LFBGA

Square

Plastic/Epoxy

16

Yes

5 V

1 MHz

1

12

0.0244 %

5 V

Binary, 2's Complement Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Track

Bottom

800 ns

S-PBGA-B80

3

0.059 in (1.5 mm)

0.394 in (10 mm)

No

240 °C (464 °F)

0.394 in (10 mm)

AD9208BBPZRL-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

4

Yes

1.7 V

3000 MHz

1

14

0.1282 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.7 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.06 in (1.53 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD7889-1ACBZ-500R7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.059 in (1.505 mm)

No

30 s

260 °C (500 °F)

0.079 in (2.005 mm)

LTM2893CY#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Ball

36

BGA

Rectangular

Plastic/Epoxy

8

Yes

100 MHz

1

5 V

Binary

Grid Array

0.039 in (1 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Bottom

R-PBGA-B36

3

0.089 in (2.26 mm)

0.246 in (6.25 mm)

30 s

260 °C (500 °F)

0.591 in (15 mm)

AD7889-1ACBZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.059 in (1.505 mm)

No

30 s

260 °C (500 °F)

0.079 in (2.005 mm)

AD7879ACBZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.063 in (1.61 mm)

No

e3

0.079 in (2.01 mm)

AD7889ACBZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.059 in (1.505 mm)

No

30 s

260 °C (500 °F)

0.079 in (2.005 mm)

AD7889-1ACBZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Track

Bottom

R-PBGA-B12

0.026 in (0.65 mm)

0.059 in (1.505 mm)

0.079 in (2.005 mm)

AD9699BBPZ-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

196

HLFBGA

Square

Plastic/Epoxy

1

Yes

1.54 V

3000 MHz

1

14

408.5 mA

0.11047 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug, Low Profile, Fine Pitch

BGA196,14X14,32

0.031 in (0.8 mm)

105 °C (221 °F)

-1.54 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.06 in (1.53 mm)

0.472 in (12 mm)

0.472 in (12 mm)

AD9625BBPZ-2.0

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.1 V

2048 MHz

1

12

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.1 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

LTM9011IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

3

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.443 in (11.25 mm)

LTM9008IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

AD7879ACBZ-500R7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.063 in (1.61 mm)

No

e3

0.079 in (2.01 mm)

LTM2893CY-1#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

36

BGA

Rectangular

Plastic/Epoxy

8

Yes

100 MHz

1

5 V

Binary

Grid Array

0.039 in (1 mm)

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Bottom

R-PBGA-B36

3

0.089 in (2.26 mm)

0.246 in (6.25 mm)

30 s

260 °C (500 °F)

0.591 in (15 mm)

AD9083BBCZ-RL7

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

16

Yes

2 V

2000 MHz

1

16

471 mA

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Low Profile, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

115 °C (239 °F)

-2 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9699BBPZRL-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

196

HLFBGA

Square

Plastic/Epoxy

1

Yes

1.54 V

3000 MHz

1

14

408.5 mA

0.11047 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug, Low Profile, Fine Pitch

BGA196,14X14,32

0.031 in (0.8 mm)

105 °C (221 °F)

-1.54 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.06 in (1.53 mm)

0.472 in (12 mm)

0.472 in (12 mm)

LTM9010IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

105 MHz

1

14

0.0198 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

3

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.443 in (11.25 mm)

LTM9006IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

25 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

LTM9009CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

80 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

3

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.443 in (11.25 mm)

AD9625BBPZRL-2.6

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1 V

2600 MHz

1

12

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

BGA196,14X14,32

0.031 in (0.8 mm)

85 °C (185 °F)

-1 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD10226AB

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

385

BGA

Square

Plastic/Epoxy

1

Yes

1.84 V

125 MHz

2

12

0.0317 %

5 V

Offset Binary, 2's Complement Binary

3.3,5 V

Grid Array

BGA385,25X25,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Track

Bottom

S-PBGA-B385

3

0.075 in (1.9 mm)

1.378 in (35 mm)

No

225 °C (437 °F)

1.378 in (35 mm)

LTM9010CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

105 MHz

1

14

0.0198 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

0.443 in (11.25 mm)

AD9625BBPRL-2.6

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.1 V

2.6 MHz

1

12

0.0562 %

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.1 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

20 s

240 °C (464 °F)

0.472 in (12 mm)

AD15252BBC

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

64

LFBGA

Square

1

Yes

296 mV

65 MHz

2

12

3.3 V

Offset Binary, 2's Complement Binary

2.5,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA64,8X8,20

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Bottom

S-XBGA-B64

0.067 in (1.7 mm)

0.315 in (8 mm)

No

e0

0.315 in (8 mm)

LTM2893HY#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Ball

36

BGA

Rectangular

Plastic/Epoxy

8

Yes

100 MHz

1

5 V

Binary

Grid Array

0.039 in (1 mm)

125 °C (257 °F)

Serial

-40 °C (-40 °F)

Bottom

R-PBGA-B36

3

0.089 in (2.26 mm)

0.246 in (6.25 mm)

30 s

260 °C (500 °F)

0.591 in (15 mm)

LTM9009IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

80 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

0.443 in (11.25 mm)

AD9289XBC

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

64

LFBGA

Square

Plastic/Epoxy

4

Yes

2 V

65 MHz

1

CMOS

8

0.2344 %

3 V

Offset Binary, 2's Complement Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

15 ns

S-PBGA-B64

0.067 in (1.7 mm)

0.315 in (8 mm)

0.315 in (8 mm)

AD7879-1ACBZ-500R7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.063 in (1.61 mm)

No

e3

0.079 in (2.01 mm)

AD7879-1ACBZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.063 in (1.61 mm)

No

e3

0.079 in (2.01 mm)

ADAS1126

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

Square

Plastic/Epoxy

32

Yes

19.7 kHz

1

24

0.025 %

Binary

Serial

Sample

Bottom

S-PBGA-B

LTM2893IY#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

36

BGA

Rectangular

Plastic/Epoxy

8

Yes

100 MHz

1

5 V

Binary

Grid Array

0.039 in (1 mm)

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Bottom

R-PBGA-B36

3

0.089 in (2.26 mm)

0.246 in (6.25 mm)

30 s

260 °C (500 °F)

0.591 in (15 mm)

AD9209BBPZ-4G

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

324

HFBGA

Square

Plastic/Epoxy

4

Yes

1.4 V

4000 MHz

1

12

0.12207 %

2 V

Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-1.4 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B324

0.068 in (1.72 mm)

0.591 in (15 mm)

0.591 in (15 mm)

AD9289BBCZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

64

LFBGA

Square

Plastic/Epoxy

4

Yes

2 V

65 MHz

1

CMOS

8

0.2344 %

3 V

Binary, 2's Complement Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

1 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B64

3

0.067 in (1.7 mm)

0.315 in (8 mm)

No

e1

260 °C (500 °F)

0.315 in (8 mm)

AD9652BBCZRL7-310

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2

Yes

2.5 V

310 MHz

1

16

3.3 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

12.5 ns

S-PBGA-B144

3

0.055 in (1.4 mm)

0.394 in (10 mm)

e1

260 °C (500 °F)

0.394 in (10 mm)

ADAQ4001BBCZ

Analog Devices

Data Acquisition Device

Ball

49

FBGA

Square

Plastic/Epoxy

1

Yes

12.705 V

2 MHz

1

16

0.00119 %

1.8 V

2’s Complement Hexadecimal

Grid Array, Fine Pitch

BGA49,7X7,20

0.02 in (0.5 mm)

125 °C (257 °F)

-5.28 V

Serial

-40 °C (-40 °F)

Bottom

320 ns

S-PBGA-B49

3

0.096 in (2.432 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD9689BBPZRL-2600

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

2

Yes

2 V

2600 MHz

1

14

0.0793 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.062 in (1.57 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

ADAS1124JBCZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

324

FBGA

Square

Plastic/Epoxy

256

Yes

226 kHz

1

24

1.8 V

Binary, Offset Binary

Grid Array, Fine Pitch

BGA324,.9X9,20

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Sample

Bottom

2.857 µs

S-PBGA-B324

0.074 in (1.89 mm)

0.591 in (15 mm)

0.591 in (15 mm)

AD10235AB

Analog Devices

Analog To Digital Converter

Industrial

Ball

729

BGA

Square

Plastic/Epoxy

1

Yes

766 mV

2

12

0.036 %

3.3 V

Offset Binary, 2's Complement Binary

3.3 V

Grid Array

BGA729,27X27,50

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B729

No

LTM9012IY-AB#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

221

FBGA

Rectangular

Plastic/Epoxy

4

Yes

200 mV

125 MHz

1

14

0.0305 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-200 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B221

0.117 in (2.97 mm)

0.443 in (11.25 mm)

e1

0.591 in (15 mm)

LTM2893IY-1#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Ball

36

BGA

Rectangular

Plastic/Epoxy

8

Yes

100 MHz

1

5 V

Binary

Grid Array

0.039 in (1 mm)

125 °C (257 °F)

Serial

-40 °C (-40 °F)

Bottom

R-PBGA-B36

3

0.089 in (2.26 mm)

0.246 in (6.25 mm)

30 s

260 °C (500 °F)

0.591 in (15 mm)

AD7889ACBZ-500R7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

2

Yes

3.6 V

105 kHz

1

12

0.0732 %

2.6 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.059 in (1.505 mm)

No

30 s

260 °C (500 °F)

0.079 in (2.005 mm)

ADAS1128

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

BGA

Square

Plastic/Epoxy

1

Yes

19.7 kHz

1

24

Binary

Grid Array

Serial

Sample

Bottom

S-PBGA-B

No

AD9625BBPRL-2.5

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.2 V

2.5 MHz

1

12

0.0513 %

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

20 s

240 °C (464 °F)

0.472 in (12 mm)

LTM9007IY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

40 MHz

1

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

AD9689BBCZ-2500

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

BGA

Square

Plastic/Epoxy

2

Yes

2500 MHz

1

14

975 mV

Binary

Grid Array

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Sample

Bottom

0.4 ns

S-PBGA-B196

AD9625BBPZRL-2.0

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

1

Yes

1.1 V

2048 MHz

1

12

1.3 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.1 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.067 in (1.7 mm)

0.472 in (12 mm)

e1

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD9213-10G

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

192

HBGA

Square

Plastic/Epoxy

1

Yes

1.4 V

10250 MHz

1

12

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

115 °C (239 °F)

-1.4 V

Serial

-10 °C (14 °F)

Bottom

0.975 ns

S-PBGA-B192

0.067 in (1.71 mm)

0.472 in (12 mm)

0.472 in (12 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.