Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
1 |
CMOS |
8 |
2.5 mA |
0.1953 % |
5 V |
Binary, Offset Binary, Complementary Offset Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
7 µs |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
64 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
16 |
No |
10 V |
30 kHz |
1 |
Hybrid |
12 |
0.0244 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
25 µs |
R-CDIP-T64 |
0.28 in (7.11 mm) |
0.9 in (22.86 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
Hybrid |
12 |
0.0122 % |
15 V |
Binary |
5,±15 V |
-15 V |
In-Line |
DIP24,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
50 µs |
R-CDIP-T24 |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic |
No |
20 V |
1 |
12 |
0.024 % |
Offset Binary |
5,±15 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T28 |
No |
|||||||||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
Hybrid |
12 |
Binary, Offset Binary, 2's Complement, Offset 2's Complement |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T32 |
No |
e0 |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 |
12 |
0.0122 % |
15 V |
Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Dual |
24 µs |
R-CDIP-T28 |
0.226 in (5.75 mm) |
0.6 in (15.24 mm) |
No |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1.25 V |
200 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3.3/5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
4.6 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
e0 |
1.227 in (31.165 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
10 V |
1 |
CMOS |
8 |
2.5 mA |
0.1953 % |
5 V |
Binary, Offset Binary, Complementary Offset Binary |
5 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Dual |
7 µs |
R-GDIP-T18 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter Subsystem |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
CMOS |
12 |
10 mA |
0.024 % |
5 V |
2's Complement Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
10 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.199 in (30.45 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
Hybrid |
12 |
0.012 % |
12 V |
Complementary Binary, Complementary 2's Complement, Complementary Offset Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Serial, Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
5 µs |
R-CDIP-T32 |
0.225 in (5.72 mm) |
0.9 in (22.86 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
1.25 V |
200 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
3.3/5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
18 µs |
R-PDIP-T24 |
0.3 in (7.62 mm) |
No |
e0 |
240 °C (464 °F) |
1.227 in (31.165 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
3 |
No |
200 kHz |
1 |
BICMOS |
16 |
0.0038 % |
5 V |
Binary, 2's Complement Binary |
In-Line |
125 °C (257 °F) |
Serial |
-55 °C (-67 °F) |
Dual |
4 µs |
R-CDIP-T20 |
No |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1.25 MHz |
1 |
BICMOS |
12 |
68 mA |
0.0732 % |
5 V |
Binary, Offset Binary, 2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
800 ns |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2 |
No |
7.3 V |
50 kHz |
1 |
CMOS |
8 |
10 mA |
0.39 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-300 mV |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Sample |
Dual |
18.5 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
7.3 V |
1 |
CMOS |
8 |
15 mA |
5 V |
Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-300 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
2.5 µs |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
40 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1.024 V |
25 MHz |
1 |
Bipolar |
12 |
0.0488 % |
5 V |
2's Complement Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP40,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1.024 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
93.1 ns |
R-CDIP-T40 |
0.225 in (5.715 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.095 in (53.21 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary |
5 V |
In-Line |
DIP8,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
6 µs |
R-PDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.389 in (9.88 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
1 |
12 |
0.012 % |
15 V |
Binary, Offset Binary, 2's Complement Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
25 µs |
R-CDIP-T32 |
0.28 in (7.11 mm) |
0.9 in (22.86 mm) |
No |
e0 |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
Bipolar |
12 |
40 mA |
0.0122 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
35 µs |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.445 in (36.71 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
40 |
DIP |
Rectangular |
Metal |
1 |
No |
10 V |
1 |
Hybrid |
MIL-STD-883 Class B (Modified) |
14 |
0.009 % |
Offset Binary, 2's Complement Binary |
5,±15 V |
In-Line |
DIP40,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin/Lead |
Dual |
R-MDIP-T40 |
No |
e0 |
||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
200 kHz |
1 |
BIMOS |
12 |
12 V |
Binary, 2's Complement Binary |
5,±12 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
4.4 µs |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.445 in (36.7 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
15 V |
1 |
CMOS |
MIL-STD-883 |
12 |
12 mA |
0.024 % |
5 V |
Binary |
5,-12/-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-15 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
3.25 µs |
R-GDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
1.25 V |
100 kHz |
1 |
CMOS |
12 |
0.0244 % |
3.6 V |
Binary, 2's Complement Binary |
3.3/5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.25 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin/Lead (Sn63Pb37) |
Track |
Dual |
10 µs |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
500 mV |
150 MHz |
1 |
Bipolar |
8 |
175 mA |
0.195 % |
Binary |
-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-6 V |
Parallel, 8 Bits |
-25 °C (-13 °F) |
Tin Lead |
Dual |
8 ns |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.472 in (37.4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
BICMOS |
12 |
0.0122 % |
12 V |
Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Dual |
8 µs |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e3 |
1.472 in (37.4 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5 V |
200 kHz |
1 |
12 |
12 V |
Binary, 2's Complement Binary |
-12 V |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-5 V |
Parallel, Word |
0 °C (32 °F) |
Sample |
Dual |
R-PDIP-T28 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
1.445 in (36.7 mm) |
|||||||||||||||||||||
Analog Devices |
Digital To Analog Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic |
16 |
No |
10 V |
MIL-STD-883 Class B (Modified) |
12 |
0.012 % |
Binary, Offset Binary |
5,±15 V |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T32 |
No |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5.05 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
13 µs |
R-PDIP-T20 |
1 |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic |
1 |
No |
10 V |
1 |
CMOS |
38535Q/M;38534H;883B |
8 |
0.2 % |
5 V |
Binary |
5 V |
In-Line |
DIP18,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-XDIP-T18 |
No |
e0 |
|||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
5.05 V |
50 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
2's Complement Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-5.05 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
13 µs |
R-PDIP-T20 |
1 |
0.155 in (3.937 mm) |
0.3 in (7.62 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
48 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 |
Hybrid |
16 |
200 mA |
15 V |
Binary |
-15 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T48 |
0.233 in (5.92 mm) |
1 in (25.4 mm) |
No |
e0 |
2.475 in (62.865 mm) |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
100 mV |
125 MHz |
1 |
Bipolar |
MIL-STD-883 |
8 |
0.1953 % |
Binary |
-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
No |
e0 |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
5.25 V |
285 kHz |
1 |
CMOS |
14 |
0.0061 % |
5 V |
Binary, 2's Complement Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Track |
Dual |
3.25 µs |
R-PDIP-T24 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e3 |
1.165 in (29.59 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic |
No |
2 V |
1 |
Bipolar |
38535Q/M;38534H;883B |
6 |
1.56 % |
Offset Binary |
5,-5.2 V |
In-Line |
DIP16,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T16 |
No |
|||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
3 V |
200 kHz |
1 |
CMOS |
8 |
0.1953 % |
3 V |
Binary |
3/5 V |
In-Line |
DIP16,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
4.5 µs |
R-PDIP-T16 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.793 in (20.13 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
41 MHz |
1 |
12 |
5 V |
2's Complement Binary |
In-Line |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
No |
e0 |
|||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
48 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
10 V |
500 kHz |
1 |
Hybrid |
16 |
15 V |
Complementary 2's Complement, Complementary Offset Binary |
±5,±15 V |
-15 V |
In-Line |
DIP48,1.0 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T48 |
0.233 in (5.91 mm) |
0.6 in (15.24 mm) |
No |
e0 |
2.475 in (62.865 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
8 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
10 V |
1 |
BIMOS |
12 |
10 mA |
0.024 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
5.5 µs |
R-PDIP-T8 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.389 in (9.88 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
18 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
1 |
CMOS |
MIL-STD-883 |
8 |
0.293 % |
5 V |
Binary, Offset Binary |
In-Line |
125 °C (257 °F) |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
6 µs |
R-GDIP-T18 |
No |
e0 |
||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
46 |
DIP |
Rectangular |
0 |
No |
1.024 V |
10 MHz |
1 |
Hybrid |
12 |
0.0549 % |
5 V |
Offset Binary |
-5 V |
In-Line |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1.024 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-XDIP-T46 |
0.231 in (5.87 mm) |
1.45 in (36.83 mm) |
No |
e0 |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2.5 V |
16 kHz |
1 |
CMOS |
20 |
0.0015 % |
5 V |
Binary, Offset Binary |
±5 V |
-5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Dual |
R-PDIP-T20 |
0.18 in (4.57 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.965 in (24.51 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0244 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Dual |
5.2 µs |
R-GDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1.1 MHz |
1 |
BICMOS |
12 |
35 mA |
0.0488 % |
5 V |
Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-5 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
100 ns |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic |
No |
5 V |
1 |
BICMOS |
12 |
0.024 % |
Offset Binary |
5,-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Dual |
R-XDIP-T24 |
No |
||||||||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
8 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
5 V |
179 kHz |
1 |
CMOS |
12 |
11 mA |
0.024 % |
5 V |
Offset Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T8 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
|||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
3 |
No |
10 V |
200 kHz |
1 |
BICMOS |
16 |
0.0046 % |
5 V |
Binary, 2's Complement Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
4 µs |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.992 in (25.2 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
1 |
No |
100 mV |
38 MHz |
1 |
Bipolar |
8 |
0.3906 % |
5 V |
Binary, Offset 2's Complement |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-2.1 V |
Parallel, 8 Bits |
0 °C (32 °F) |
Tin Lead |
Dual |
29 ns |
R-GDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
12 |
0.0122 % |
12 V |
Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary |
5,±12/±15 V |
-12 V |
In-Line |
DIP32,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
6 µs |
R-CDIP-T32 |
0.275 in (6.98 mm) |
0.6 in (15.24 mm) |
No |
e0 |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.