Through-Hole Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD369AD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

50 kHz

1

Hybrid

12

0.0183 %

15 V

Complementary Binary

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

15 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

PM7572EP12

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

15 V

1

CMOS

12

12 mA

0.012 %

5 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-15 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Dual

13 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.199 in (30.45 mm)

AD7878TQ

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

3 V

1

BICMOS

12

5 V

Offset 2's Complement, 2's Complement

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD16710703D

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1.25 MHz

1

12

0.07324 %

5 V

Binary

-5 V

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

800 ns

R-CDIP-T28

LTC1287CCN8

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

3.05 V

30 kHz

1

CMOS

12

0.0122 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

24 µs

R-PDIP-T8

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e0

ADADC85S-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

10

0.048 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

5962-01-426-6606

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

100 mV

1

Bipolar

8

0.47 %

Offset Binary

5,-5.2 V

In-Line

DIP28,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

1

No

LTC1098CN8#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

6.05 V

33 kHz

1

8

0.3906 %

3 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Tin/Lead

Sample

Dual

32 µs

R-PDIP-T8

1

0.3 in (7.62 mm)

No

e0

AD9688TQ

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3.3 V

200 MHz

1

Bipolar

4

85 mA

0.3906 %

5 V

Binary

5,-5.2 V

-5.2 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.7 V

Parallel, 4 Bits

-55 °C (-67 °F)

Tin Lead

Dual

5.7 ns

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7890AN-2

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

8

No

2.5 V

117 kHz

1

CMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

5.9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

LTC1272CCN-8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0244 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

8.125 µs

R-PDIP-T24

0.3 in (7.62 mm)

e3

1.28 in (32.512 mm)

AD7576AQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

8

0.3906 %

5 V

Offset Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Sample

Dual

30 µs

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD574ALD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

12

40 mA

0.0122 %

12 V

Binary

5,±12/±15 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

35 µs

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

ADC7672LN10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Dual

10.4 µs

R-PDIP-T24

0.3 in (7.62 mm)

No

1.227 in (31.165 mm)

AD674ASD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

1

No

20 V

1

38535Q/M;38534H;883B

12

0.024 %

Binary, Offset Binary

5,±12/±15 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

AD7705BN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

2

No

2.5 V

19.2 kHz

1

CMOS

16

0.003 %

3 V

Binary, Offset Binary

3/5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.79 in (20.07 mm)

AD9048TQ/833B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

100 mV

38 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.293 %

5 V

Binary, Offset 2's Complement

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.1 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

PMAD7572ALN03

Analog Devices

Analog To Digital Converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

BICMOS

12

0.012 %

Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

No

e0

AD9034AD

Analog Devices

Analog To Digital Converter, Flash Method

Other

Through-Hole

40

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1.024 V

20.48 MHz

1

CMOS

12

5 V

2's Complement Binary

5,-5.2 V

-5.2 V

In-Line

DIP40,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-1.024 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

49 ns

R-CDIP-T40

0.225 in (5.715 mm)

0.6 in (15.24 mm)

No

e0

2.095 in (53.21 mm)

5962-9561501MLA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

8

No

17 V

1

CMOS

MIL-STD-883

12

0.024 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

5.9 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

5962-01-304-5407

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

0.018 %

Offset Binary

5,-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T24

1

No

LTC1275BCN#TR

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

300 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

2.7 µs

R-PDIP-T24

1

0.3 in (7.62 mm)

No

e0

1.28 in (32.512 mm)

5962-8759105LB

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

1

BICMOS

12

12 mA

0.0244 %

5 V

Offset Binary, Complementary Offset Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC1272ACN-8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

8.125 µs

R-PDIP-T24

0.3 in (7.62 mm)

e3

1.28 in (32.512 mm)

PMAD7572ASQ03

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

5 V

1

BICMOS

12

0.024 %

Offset Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

5962-01-230-8392

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

15 V

1

CMOS

38535Q/M;38534H;883B

8

0.3 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

LTC1278-5CN

Analog Devices

Analog To Digital Converter, Successive Approximation

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

500 kHz

1

CMOS

12

29.5 mA

0.0244 %

5 V

2's Complement Binary

-5 V

In-Line

DIP24,.3

0.1 in (2.54 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Sample

Dual

1.85 µs

R-PDIP-T24

0.155 in (3.937 mm)

0.3 in (7.62 mm)

1.265 in (32.131 mm)

AD7714YN

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5

No

1.25 V

1

CMOS

24

0.001 %

3 V

Binary, Offset Binary

3/5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

105 °C (221 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.3 in (7.62 mm)

No

e0

1.227 in (31.165 mm)

AD7885AQ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

5 V

166 kHz

1

CMOS

16

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, 8 Bits

-40 °C (-40 °F)

Tin/Lead (Sn63Pb37)

Sample

Dual

5.3 µs

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD9002TD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

0 mV

150 MHz

1

Bipolar

MIL-STD-883 Class B

8

0.4688 %

Binary

-5.2 V

-5.2 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

5962-8965503LB

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

12 mA

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

10.4 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7823YN

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

133 kHz

1

CMOS

8

0.1953 %

3 V

Binary

3/5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

4 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

AD7701TQ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.5 V

16 kHz

1

CMOS

16

0.0015 %

5 V

Binary, Offset Binary

±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Serial

-55 °C (-67 °F)

Tin Lead

Sample

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

LTC1273BCN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

300 kHz

1

BICMOS

12

0.0244 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

2.7 ms

R-PDIP-T24

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

ADC7672CQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-25 °C (-13 °F)

Dual

5.2 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

AD7576BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

2.46 V

1

CMOS

MIL-M-38510

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-25 °C (-13 °F)

Tin Lead

Dual

20 µs

R-GDIP-T18

0.24 in (6.096 mm)

0.3 in (7.62 mm)

No

e0

ADC912AW/883C

Analog Devices

Analog To Digital Converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

1

No

10 V

1

BICMOS

38535Q/M;38534H;883B

12

0.012 %

Binary

5,-12/-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

LTC1272ACN-3#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

250 kHz

1

CMOS

12

0.0122 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Dual

3.25 µs

R-PDIP-T24

0.3 in (7.62 mm)

e3

1.28 in (32.512 mm)

AD7893AN-3

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

2.5 V

1

BICMOS

12

9 mA

0.024 %

5 V

2's Complement Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

6 µs

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

AD9042SD/QMLV

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

41 MHz

1

12

5 V

Binary

In-Line

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Dual

200 ns

R-CDIP-T28

AD774BTD/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BIMOS

12

0.0244 %

12 V

Binary

-12 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Dual

8 µs

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

No

e0

1.41 in (35.815 mm)

AD376SD/883B

Analog Devices

Analog To Digital Converter

Military

Through-Hole

32

DIP

Rectangular

Ceramic

1

No

20 V

1

Hybrid

38535Q/M;38534H;883B

16

0.006 %

Complementary Binary, Complementary Offset Binary

5,±15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T32

No

e0

AD7884AN

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

166 kHz

1

BICMOS

16

35 mA

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP40,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Dual

5.3 µs

R-PDIP-T40

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

ADADC85SZ12/883

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883

12

0.0003 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.23 in (5.84 mm)

0.9 in (22.86 mm)

No

e0

1.62 in (41.15 mm)

5962-01-156-8895

Analog Devices

Analog To Digital Converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

15 V

1

CMOS

38535Q/M;38534H;883B

8

0.2 %

5 V

Offset Binary

5 V

In-Line

DIP18,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

LTC1090ACN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

45 kHz

1

CMOS

10

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5.05 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDIP-T20

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

AD5240ZSD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.012 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

5 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

5962-9468601MXA

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

5 MHz

1

BICMOS

MIL-STD-883

12

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

No

e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.