Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
5.25 V |
250 kHz |
1 |
10 |
0.0488 % |
3 V |
Binary |
2.5/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
2.8 µs |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
250 kHz |
1 |
12 |
0.0366 % |
3 V |
Binary |
2.5/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP6,.08 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
3.2 µs |
R-PDSO-G6 |
1 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
No |
e4 |
260 °C (500 °F) |
0.079 in (2 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
6 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.25 V |
250 kHz |
1 |
12 |
0.0366 % |
3 V |
Binary |
2.5/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP6,.08 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
3.2 µs |
R-PDSO-G6 |
1 |
0.043 in (1.1 mm) |
0.049 in (1.25 mm) |
No |
e4 |
260 °C (500 °F) |
0.079 in (2 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
20 |
HVQCCN |
Square |
8 |
Yes |
2.9 V |
250 kHz |
1 |
CMOS |
14 |
0.0061 % |
5 V |
Binary, 2's Complement Binary |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.16SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-250 mV |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Quad |
3.2 µs |
S-XQCC-N20 |
3 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
10 |
HVSON |
Square |
1 |
Yes |
5.1 V |
1 MHz |
1 |
16 |
0.0038 % |
2.5 V |
Binary |
2.5,2.5/5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
710 ns |
S-XDSO-N10 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1.33 MHz |
1 |
16 |
0.0015 % |
2.5 V |
Binary |
2.5 V |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.11,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
500 ns |
S-PDSO-N10 |
0.033 in (0.85 mm) |
0.118 in (3 mm) |
No |
e3 |
0.118 in (3 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
100 kHz |
1 |
16 |
0.00191 % |
2.5 V |
Binary |
2.5,2.5/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
9.5 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
5.5 V |
188 kHz |
1 |
12 |
0.0244 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e4 |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.5 V |
188 kHz |
1 |
10 |
0.0488 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.197 in (5 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.5 V |
188 kHz |
1 |
10 |
0.0488 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP16,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.197 in (5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
8 |
LSSOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.5 V |
1 |
10 |
0.0391 % |
3.3 V |
Binary |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSSOP8,.1 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Dual |
R-PDSO-G8 |
1 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
e4 |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
188 kHz |
1 |
12 |
0.0244 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
0.256 in (6.5 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
12 V |
1 |
16 |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-12.3 V |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1 V |
10 MHz |
1 |
BICMOS |
MIL-STD-883 Class B |
12 |
5 V |
2's Complement Binary |
±5 V |
-5 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-1 V |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
40 MHz |
1 |
BICMOS |
8 |
0.7812 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.283 in (7.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
80 MHz |
1 |
BICMOS |
8 |
0.7812 % |
5 V |
Offset Binary |
3/5,5 V |
Small Outline, Shrink Pitch |
SSOP20,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.283 in (7.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Ball |
192 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.4 V |
10250 MHz |
1 |
12 |
0.1807 % |
1 V |
Offset Binary, 2's Complement Binary, Gray Code |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
115 °C (239 °F) |
-1.4 V |
Parallel, Word |
-20 °C (-4 °F) |
Bottom |
0.4 ns |
S-PBGA-B192 |
0.067 in (1.71 mm) |
0.472 in (12 mm) |
0.472 in (12 mm) |
|||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
10 |
0.1855 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
10 |
0.2441 % |
3 V |
Offset Binary, 2's Complement Binary |
3 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
12 |
0.022 % |
3 V |
Offset Binary, 2's Complement Binary |
2.5,3 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
500 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.382 in (9.7 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
1 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Pipelined |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
20 MHz |
1 |
14 |
52.8 mA |
0.010681 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
333.33333 ns |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
65 MHz |
1 |
CMOS |
16 |
0.00992 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Sample |
Quad |
333.3 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
20 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
512 mV |
100 MHz |
1 |
CMOS |
8 |
0.8789 % |
3 V |
Offset Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-512 mV |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
R-PDSO-G20 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.283 in (7.2 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
72 |
HVQCCN |
Square |
1 |
Yes |
2.5 V |
200 MHz |
1 |
BICMOS |
16 |
0.0145 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC72,.39SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Quad |
5 ns |
S-XQCC-N72 |
3 |
0.035 in (0.9 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
44 |
TQFP |
Square |
Plastic/Epoxy |
1 |
Yes |
2.1 V |
250 kHz |
1 |
8 |
0.3516 % |
3.3 V |
Offset Binary, 2's Complement Binary |
3.3 V |
Flatpack, Thin Profile |
TQFP44,.47SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
1.6 V |
Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
S-PQFP-G44 |
3 |
0.047 in (1.2 mm) |
0.394 in (10 mm) |
No |
e3 |
260 °C (500 °F) |
0.394 in (10 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
80 MHz |
1 |
CMOS |
10 |
0.0439 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
12.5 ns |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.014 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
9.52 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
2 V |
40 MHz |
1 |
CMOS |
14 |
0.0079 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
25 ns |
S-XQCC-N32 |
3 |
0.039 in (1 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.7 V |
105 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.7 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2.7 V |
80 MHz |
1 |
CMOS |
16 |
0.0092 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.7 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
50 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
1.58 V |
1250 MHz |
1 |
14 |
0.0366 % |
1.25 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.58 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
3 |
No |
10 V |
200 kHz |
1 |
BICMOS |
16 |
0.0046 % |
5 V |
Binary, 2's Complement Binary |
5 V |
In-Line |
DIP20,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
4 µs |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.992 in (25.2 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
3 |
No |
10 V |
200 kHz |
1 |
BICMOS |
16 |
0.0031 % |
5 V |
Binary, 2's Complement Binary |
In-Line |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
4 µs |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.992 in (25.2 mm) |
|||||||||||||||||
|
Analog Devices |
Data Acquisition Device, Wireless |
3 |
30 s |
260 °C (500 °F) |
|||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
3 |
Yes |
500 mV |
1 |
24 |
3.3 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-500 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.504 in (12.8 mm) |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Automotive |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
320 V |
21 MHz |
1 |
CMOS |
16 |
10 mA |
0.0061 % |
5 V |
Binary |
Small Outline |
SOP8,.4 |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-320 V |
Serial |
-40 °C (-40 °F) |
Dual |
R-PDSO-G8 |
3 |
0.104 in (2.65 mm) |
0.23 in (5.85 mm) |
30 s |
260 °C (500 °F) |
0.295 in (7.5 mm) |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
320 mV |
1 |
CMOS |
16 |
0.0076 % |
3 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
105 °C (221 °F) |
-320 mV |
Serial |
-40 °C (-40 °F) |
Dual |
R-PDSO-G8 |
3 |
0.104 in (2.65 mm) |
0.23 in (5.85 mm) |
30 s |
260 °C (500 °F) |
0.295 in (7.5 mm) |
|||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
450 MHz |
1 |
CMOS |
8 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial, Parallel, 8 Bits |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
2.2 µs |
S-PQCC-N48 |
2A |
0.039 in (1 mm) |
0.276 in (7 mm) |
e3 |
0.276 in (7 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Dual-Slope |
Commercial |
Through-Hole |
40 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
2 V |
1 |
CMOS |
4 |
9 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-3 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin - annealed |
Dual |
R-PDIP-T40 |
1 |
0.2 in (5.08 mm) |
0.6 in (15.24 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
2.05 in (52.075 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
4.05 V |
33 kHz |
1 |
CMOS |
8 |
0.3906 % |
2.65 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
32 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9025 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
1 |
No |
15 V |
250 kHz |
1 |
BICMOS |
12 |
0.0244 % |
5 V |
Binary |
In-Line |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-300 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
3 ms |
R-PDIP-T24 |
1 |
0.15 in (3.81 mm) |
0.3 in (7.62 mm) |
No |
e3 |
||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
300 kHz |
1 |
BICMOS |
12 |
0.0122 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
2.7 ms |
R-PDSO-G24 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.606 in (15.395 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
46.5 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G20 |
1 |
0.116 in (2.95 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.524 in (13.3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
46.5 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G20 |
1 |
0.116 in (2.95 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.524 in (13.3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
46.5 kHz |
1 |
CMOS |
12 |
0.0183 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G20 |
1 |
0.116 in (2.95 mm) |
0.295 in (7.493 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.524 in (13.3 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
16 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.048 V |
2.2 MHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
-5 V |
Small Outline, Shrink Pitch |
0.025 in (0.635 mm) |
70 °C (158 °F) |
-2.048 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9116 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
1.25 V |
2.8 MHz |
1 |
CMOS |
12 |
0.0488 % |
3 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.25 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
357 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.