Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
454.5 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
5 V |
Flatpack |
QFP44,.57SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
105 °C (221 °F) |
-10 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Track |
Quad |
1.6 µs |
S-PQFP-G44 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e0 |
0.394 in (10 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Through-Hole |
32 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2 |
No |
10 V |
1 |
Hybrid |
MIL-STD-883 Class B |
10 |
0.0732 % |
15 V |
Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary |
5,±15 V |
-15 V |
In-Line |
DIP32,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
-10 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Dual |
2 µs |
R-CDIP-T32 |
0.275 in (6.98 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.612 in (40.945 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.9 V |
1 |
24 |
0.0015 % |
5 V |
Binary |
3/5,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-2.9 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
0.382 in (9.7 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
3 V |
1 |
CMOS |
MIL-STD-883 |
12 |
0.0244 % |
5 V |
Binary |
±5 V |
-5 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-3 V |
Serial, Parallel, Word |
-55 °C (-67 °F) |
Gold |
Track |
Quad |
9 µs |
S-CQCC-N28 |
Yes |
e4 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
No Lead |
DIE |
4 |
Yes |
2.625 V |
1 |
10 |
0.0977 % |
3 V |
2's Complement Binary |
Uncased Chip |
0 mV |
Serial |
Tin Lead |
Track |
Upper |
15 µs |
X-XUUC-N |
No |
e0 |
|||||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
44 |
QFP |
Square |
Plastic/Epoxy |
4 |
Yes |
2.5 V |
350 kHz |
1 |
BICMOS |
14 |
0.0122 % |
5 V |
2's Complement Binary |
5 V |
Flatpack |
QFP44,.57SQ,32 |
Analog to Digital Converters |
0.031 in (0.8 mm) |
105 °C (221 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
2.4 µs |
S-PQFP-G44 |
3 |
0.096 in (2.45 mm) |
0.394 in (10 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
3 V |
1 |
CMOS |
10 |
0.0977 % |
5 V |
2's Complement Binary |
5 V |
Small Outline |
SOP28,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
1 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
260 °C (500 °F) |
0.705 in (17.9 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
6.05 V |
1 MHz |
1 |
CMOS |
8 |
0.3906 % |
2.7 V |
Binary |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
1.85 µs |
R-PDSO-G8 |
1 |
0.069 in (1.752 mm) |
0.154 in (3.899 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.193 in (4.9 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
8 |
No |
2.5 V |
117 kHz |
1 |
CMOS |
12 |
0.0122 % |
5 V |
Binary |
5 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
5.9 µs |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.25 in (31.75 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
14 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4 |
Yes |
5.5 V |
1 |
CMOS |
16 |
0.002 % |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Quad |
149.9 ms |
R-PQCC-N14 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e0 |
0.157 in (4 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
1.6 V |
50 MHz |
1 |
CMOS |
14 |
0.0244 % |
5 V |
Offset Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1.6 V |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.492 in (12.5 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Flash Method |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
1 |
Yes |
7 V |
1 |
10 |
0.098 % |
5 V |
Offset Binary |
-5 V |
Chip Carrier |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-7 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Track |
Quad |
25 ns |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
3 |
Yes |
10 V |
100 kHz |
1 |
BICMOS |
16 |
0.0046 % |
5 V |
Binary, 2's Complement Binary |
Small Outline |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Dual |
8 µs |
R-PDSO-G20 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
0.504 in (12.8 mm) |
|||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
1 |
MIL-STD-883 |
12 |
0.0244 % |
5 V |
Binary |
Chip Carrier |
0.05 in (1.27 mm) |
125 °C (257 °F) |
Parallel, Word |
-55 °C (-67 °F) |
Sample |
Quad |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
0.45 in (11.43 mm) |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Industrial |
No Lead |
38 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.75 V |
1 |
24 |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-50 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
170 ns |
R-PQCC-N38 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.5 V |
20 MHz |
1 |
CMOS |
10 |
0.1953 % |
3 V |
Binary |
3/5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter |
Other |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0244 % |
5 V |
Complementary Offset Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-25 °C (-13 °F) |
Sample |
Dual |
5 µs |
R-CDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
1.29 in (32.77 mm) |
|||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
68 |
QFP |
Square |
Ceramic, Metal-Sealed Cofired |
3 |
Yes |
2 V |
10 MHz |
2 |
14 |
5 V |
Binary |
-5 V |
Flatpack |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-2 V |
Parallel, Word |
-40 °C (-40 °F) |
Track |
Quad |
S-CQFP-G68 |
0.143 in (3.622 mm) |
0.95 in (24.13 mm) |
No |
0.95 in (24.13 mm) |
||||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
1 |
20 |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
Serial |
0 °C (32 °F) |
Tin Lead |
Dual |
163.44 ms |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
|||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
2.75 V |
80 MHz |
1 |
CMOS |
16 |
0.0053 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
88 |
HVQCCN |
Square |
2 |
Yes |
1.58 V |
1250 MHz |
1 |
14 |
0.0397 % |
1.25 V |
Offset Binary, 2's Complement Binary |
1.25,2.5,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC88,.47SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.58 V |
Serial |
-40 °C (-40 °F) |
Sample |
Quad |
S-XQCC-N88 |
0.035 in (0.9 mm) |
0.472 in (12 mm) |
No |
0.472 in (12 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.5 V |
117 kHz |
1 |
CMOS |
12 |
0.0244 % |
5 V |
Binary |
5 V |
Small Outline |
SOP24,.4 |
Analog to Digital Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
5.9 µs |
R-PDSO-G24 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.606 in (15.4 mm) |
||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
16 |
HVSON |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
500 kHz |
1 |
CMOS |
18 |
0.0007 % |
2.5 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.018 in (0.45 mm) |
85 °C (185 °F) |
-2.5 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
1.5 µs |
R-PDSO-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Offset Binary |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
16 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1.6 MHz |
1 |
CMOS |
18 |
0.001 % |
2.5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
412 ns |
R-PDSO-G16 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.159 in (4.039 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
5 V |
1 |
CMOS |
MIL-STD-883 |
12 |
0.0122 % |
5 V |
Binary |
5,-15 V |
-15 V |
In-Line |
DIP24,.3 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
0 mV |
Parallel, 8 Bits |
-55 °C (-67 °F) |
Dual |
12.5 µs |
R-CDIP-T24 |
0.225 in (5.715 mm) |
0.3 in (7.62 mm) |
No |
e0 |
||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
2 |
Yes |
5.25 V |
250 kHz |
1 |
12 |
0.0244 % |
5 V |
Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
3.2 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
0.118 in (3 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
3 |
Yes |
10 V |
200 kHz |
1 |
16 |
0.0046 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-10 V |
Serial |
0 °C (32 °F) |
Tin Lead |
Sample |
Dual |
3 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
0.402 in (10.2 mm) |
|||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
10 V |
250 kHz |
1 |
Bipolar |
16 |
0.0031 % |
5 V |
2's Complement Binary |
Small Outline, Shrink Pitch |
0.026 in (0.65 mm) |
70 °C (158 °F) |
-10 V |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Matte Tin |
Sample |
Dual |
2.5 µs |
R-PDSO-G28 |
1 |
0.078 in (1.99 mm) |
0.209 in (5.3 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.402 in (10.2 mm) |
|||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
1 V |
125 MHz |
1 |
CMOS |
14 |
3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-500 mV |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
||||||||||||||||||
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
5 V |
300 kHz |
1 |
BICMOS |
12 |
0.0122 % |
5 V |
Binary |
-5 V |
Small Outline |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 mV |
Parallel, 8 Bits, Parallel, Word |
0 °C (32 °F) |
Tin/Lead |
Sample |
Dual |
2.7 ms |
R-PDSO-G24 |
1 |
0.104 in (2.642 mm) |
0.295 in (7.493 mm) |
No |
e0 |
0.606 in (15.395 mm) |
|||||||||||||||
Analog Devices |
Analog To Digital Converter |
Military |
Through-Hole |
32 |
DIP |
Rectangular |
Metal |
1 |
No |
1 |
Bipolar |
8 |
Offset Binary |
In-Line |
DIP32,.9 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Dual |
R-MDIP-T32 |
No |
e0 |
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|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
48 |
TSSOP |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.048 V |
1.25 MHz |
1 |
12 |
0.0244 % |
5 V |
Binary, 2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2.048 V |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Dual |
650 ns |
R-PDSO-G48 |
1 |
0.047 in (1.2 mm) |
0.24 in (6.1 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.492 in (12.5 mm) |
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Analog Devices |
Analog To Digital Converter, Flash Method |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
1 |
No |
1.024 V |
31 MHz |
1 |
Bipolar |
12 |
260 mA |
0.0732 % |
5 V |
Offset Binary |
5,-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Analog to Digital Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-1.024 V |
Parallel, Word |
-25 °C (-13 °F) |
Tin Lead |
Track |
Dual |
250 ns |
R-CDIP-T28 |
0.284 in (7.21 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.4 in (35.56 mm) |
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|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
28 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.053 V |
5 MHz |
1 |
CMOS |
12 |
0.0244 % |
3.3 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-2.044 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
R-PQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
e3 |
260 °C (500 °F) |
0.197 in (5 mm) |
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|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
24 |
TSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
2.5 V |
400 kHz |
1 |
CMOS |
12 |
0.0366 % |
3 V |
Binary |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP24,.25 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
880 ns |
R-PDSO-G24 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0.307 in (7.8 mm) |
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Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Commercial |
No Lead |
38 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
8 |
Yes |
2.75 V |
1 |
24 |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-50 mV |
Serial |
0 °C (32 °F) |
Tin Lead |
Quad |
170 ms |
R-PQCC-N38 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.276 in (7 mm) |
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Analog Devices |
Analog To Digital Converter, Proprietary Method |
Commercial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
105 MHz |
1 |
CMOS |
12 |
0.0317 % |
3.3 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-1 V |
Parallel, Word |
0 °C (32 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N48 |
1 |
0.031 in (0.8 mm) |
0.276 in (7 mm) |
No |
e0 |
0.276 in (7 mm) |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.8 V |
500 kHz |
1 |
CMOS |
14 |
0.0061 % |
5 V |
Binary |
2.5/5.5,5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin/Lead |
Track |
Dual |
1.6 µs |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
0.118 in (3 mm) |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
2 |
Yes |
2.5 V |
400 kHz |
1 |
CMOS |
14 |
0.0122 % |
5 V |
2's Complement Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-2.5 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
2.2 µs |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e0 |
240 °C (464 °F) |
0.402 in (10.2 mm) |
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|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
1 |
Yes |
1.75 V |
170 MHz |
1 |
CMOS |
14 |
0.0079 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC32,.2SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.75 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
5.8 ns |
S-XQCC-N32 |
3 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
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|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
2 |
Yes |
2 V |
105 MHz |
1 |
CMOS |
14 |
0.0305 % |
1.8 V |
Offset Binary, 2's Complement Binary, Gray Code |
1.8,3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC64,.35SQ,20 |
Analog to Digital Converters |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Sample |
Quad |
9 ns |
S-XQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
No |
e3 |
0.354 in (9 mm) |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
3 V |
1 MHz |
1 |
CMOS |
12 |
0.0366 % |
3 V |
Binary |
2.5/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Analog to Digital Converters |
0.037 in (0.95 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Track |
Dual |
1.33 µs |
R-PDSO-G6 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
e0 |
0.114 in (2.9 mm) |
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Analog Devices |
Analog To Digital Converter, Successive Approximation |
Military |
No Lead |
28 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
1 |
Yes |
5 V |
1 |
CMOS |
MIL-STD-883 Class B |
12 |
0.0244 % |
5 V |
Binary |
5,-15 V |
-15 V |
Chip Carrier |
LCC28,.45SQ |
Analog to Digital Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
0 mV |
Parallel, Word |
-55 °C (-67 °F) |
Tin Lead |
Sample |
Quad |
5.2 µs |
S-CQCC-N28 |
0.1 in (2.54 mm) |
0.45 in (11.43 mm) |
No |
e0 |
0.45 in (11.43 mm) |
|||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
1 |
Yes |
60 MHz |
1 |
BICMOS |
10 |
0.1465 % |
5 V |
Offset Binary |
5 V |
Small Outline, Shrink Pitch |
SSOP28,.3 |
Analog to Digital Converters |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Parallel, Word |
-40 °C (-40 °F) |
Matte Tin |
Track |
Dual |
R-PDSO-G28 |
1 |
0.079 in (2 mm) |
0.209 in (5.3 mm) |
No |
e3 |
260 °C (500 °F) |
0.402 in (10.2 mm) |
||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
6 |
Yes |
1.25 V |
1.5 MHz |
1 |
14 |
0.0183 % |
3 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1.25 V |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N32 |
1 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
No |
e0 |
0.197 in (5 mm) |
||||||||||||||||||
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Commercial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
4.101 V |
400 kHz |
1 |
CMOS |
18 |
0.0015 % |
5 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
70 °C (158 °F) |
-4.091 V |
Serial |
0 °C (32 °F) |
Matte Tin |
Sample |
Quad |
2.08 µs |
S-PQCC-N32 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e3 |
0.197 in (5 mm) |
|||||||||||||||||
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
1 |
Yes |
1 V |
210 MHz |
1 |
CMOS |
10 |
0.0781 % |
2.5 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-1 V |
Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Sample |
Quad |
S-PQCC-N64 |
1 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
No |
e0 |
0.354 in (9 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.