Analog Devices Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD9244BSTZ-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

4 V

65 MHz

1

CMOS

14

0.0244 %

5 V

Binary, 2's Complement Binary

3,5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

500 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD9600ABCPZ-150

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

1

Yes

2 V

150 MHz

2

CMOS

10

0.0391 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

7 ns

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

ADADC85SZ-12/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.012 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

LTC2175CUKG-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

125 MHz

1

CMOS

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2259IUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

80 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2315ITS8-12#TRMPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

3.6 V

5 MHz

1

CMOS

12

0.0366 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

30 s

260 °C (500 °F)

0.114 in (2.9 mm)

LTC2379IMS-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

1.6 MHz

1

CMOS

18

0.0008 %

2.5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Dual

412 ns

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

MAX1138EEE+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

12

Yes

2.128 V

53 kHz

1

BICMOS

10

0.0977 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP16,.25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-2.128 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

6.8 µs

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.89 mm)

MAX1325ECM+

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

4

Yes

10 V

357 kHz

1

BICMOS

14

0.0122 %

5 V

2's Complement Binary

3,5 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

2.5 µs

S-PQFP-G48

1

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7572BQ05

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary

5,-15 V

-15 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

Dual

5.2 µs

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

AD7612BSTZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1

Yes

10.1 V

750 kHz

1

CMOS

16

0.0023 %

5 V

Binary, 2's Complement Binary

5/±15 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-10.1 V

Parallel, 8 Bits, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

1.45 µs

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7701ARZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

16 kHz

1

CMOS

16

0.003 %

5 V

Binary, Offset Binary

-5 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G20

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

AD7823YRZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

3 V

133 kHz

1

8

0.1953 %

3 V

Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

4 µs

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

AD7893SQ-5

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

BICMOS

12

0.0244 %

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

6 µs

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7899SRZ-1

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

2

Yes

10 V

400 kHz

1

14

0.0122 %

5 V

2's Complement Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-10 V

Parallel, Word

-55 °C (-67 °F)

Matte Tin

Track

Dual

2.2 µs

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

AD7920AKS-REEL

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

6

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

250 kHz

1

12

0.0366 %

3 V

Binary

2.5/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP6,.08

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

3.2 µs

R-PDSO-G6

0.043 in (1.1 mm)

0.049 in (1.25 mm)

No

e0

0.079 in (2 mm)

AD9215BRUZ-65

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

2 V

65 MHz

1

CMOS

10

0.1172 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0.382 in (9.7 mm)

AD9434BCPZ-370

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

56

HVQCCN

Square

1

Yes

1.6 V

370 MHz

1

BICMOS

12

0.0225 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.6 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

2.73 ns

S-XQCC-N56

3

0.039 in (1 mm)

0.315 in (8 mm)

No

e3

40 s

260 °C (500 °F)

0.315 in (8 mm)

ICL7129ACQH+D

Analog Devices

Analog To Digital Converter, Dual-Slope

Commercial

J Bend

44

QCCJ

Square

Plastic/Epoxy

1

Yes

2 V

1

CMOS

4

9 V

Binary

9 V

Chip Carrier

LDCC44,.7SQ

Analog to Digital Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-3 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J44

3

0.18 in (4.57 mm)

0.653 in (16.585 mm)

No

e3

245 °C (473 °F)

0.653 in (16.585 mm)

LTC2144IUP-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

105 MHz

1

CMOS

14

0.0159 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2249IUH#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

14

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2255CUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

14

0.0305 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2309CF#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

2.048 V

14 kHz

1

12

0.0244 %

5 V

Binary, 2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

1.8 µs

R-PDSO-G20

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

MAX11048ETN+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

56

HVQCCN

Square

6

Yes

5.02 V

250 kHz

1

BICMOS

16

0.0031 %

5 V

Offset Binary, 2's Complement Binary

3/5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC56,.31SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Track

Quad

3 µs

S-XQCC-N56

3

0.031 in (0.8 mm)

0.315 in (8 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

MAX11619EEE+T

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

4

Yes

1.25 V

300 kHz

1

BICMOS

10

0.0977 %

3 V

Binary

3/3.3 V

Small Outline, Shrink Pitch

SSOP16,.25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.89 mm)

AD7298BCPZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

20

HVQCCN

Square

8

Yes

2.5 V

1 MHz

1

12

0.0244 %

3 V

Binary, 2's Complement Binary

3/3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Quad

1 µs

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

40 s

260 °C (500 °F)

0.157 in (4 mm)

AD7472ARUZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

24

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

1.5 MHz

1

CMOS

12

0.0488 %

3 V

Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP24,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

538 ns

R-PDSO-G24

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

260 °C (500 °F)

0.307 in (7.8 mm)

AD7478AARMZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

1

Yes

5.25 V

1 MHz

1

CMOS

8

0.1172 %

3 V

Binary

2.5/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.19

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

600 ns

S-PDSO-G8

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

AD7621ACPZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

48

HVQCCN

Square

1

Yes

2.5 V

3 MHz

1

CMOS

16

0.0061 %

2.5 V

Binary, 2's Complement Binary

2.5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC48,.27SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2.5 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N48

3

0.039 in (1 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

AD7710ANZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

2

No

2.5 V

1

CMOS

24

0.003 %

5 V

Binary, Offset Binary

±5/10 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

1.199 in (30.45 mm)

AD7715ARZ-5

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

1

CMOS

16

0.0015 %

5 V

Binary, Offset Binary

3/5,5 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.406 in (10.3 mm)

AD7719BRUZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

6

Yes

2.56 V

1

CMOS

24

0.001 %

3 V

Binary, Offset Binary

3/3.3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-2.56 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

260 °C (500 °F)

0.382 in (9.7 mm)

AD7763BSVZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

64

HLFQFP

Square

Plastic/Epoxy

1

Yes

2 V

625 kHz

1

CMOS

24

0.014 %

2.5 V

2's Complement Binary

2.5,3.3/5 V

Flatpack, Heat Sink/Slug, Low Profile, Fine Pitch

TQFP64,.47SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G64

3

0.063 in (1.6 mm)

0.394 in (10 mm)

No

e3

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD9051BRSZ

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

1.25 V

60 MHz

1

BICMOS

10

0.1465 %

5 V

Offset Binary

5 V

Small Outline, Shrink Pitch

SSOP28,.3

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

0.402 in (10.2 mm)

AD9248BCPZ-65

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

1

Yes

65 MHz

2

CMOS

14

0.0275 %

3 V

Offset Binary, 2's Complement Binary

2.5,3 V

Chip Carrier

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-XQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9629BCPZ-40

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

2 V

40 MHz

1

CMOS

12

0.0098 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

25 ns

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD9643BCPZ-250

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

1.75 V

250 MHz

1

14

0.0214 %

1.8 V

Offset Binary, 2's Complement Binary, Gray Code

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC64,.35SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

4 ns

S-XQCC-N64

0.039 in (1 mm)

0.354 in (9 mm)

No

e3

0.354 in (9 mm)

AD9697BCPZ-1300

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

1

Yes

2.04 V

1300 MHz

1

14

0.0305 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

105 °C (221 °F)

-2.04 V

Serial

-40 °C (-40 °F)

Sample

Quad

0.714 ns

S-XQCC-N64

0.031 in (0.8 mm)

0.354 in (9 mm)

0.354 in (9 mm)

AD976AARZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

200 kHz

1

BICMOS

16

0.0046 %

5 V

2's Complement Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

4 µs

R-PDSO-G28

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

ADAQ23878BBCZ

Analog Devices

Data Acquisition Device, Wireless

Ball

100

FBGA

Square

Plastic/Epoxy

1

Yes

11 V

15 MHz

1

18

52 mA

0.00078 %

5 V

2's Complement Binary

Grid Array, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

85 °C (185 °F)

-11 V

Serial

-40 °C (-40 °F)

Sample

Bottom

63 ns

S-PBGA-B100

0.093 in (2.368 mm)

0.354 in (9 mm)

0.354 in (9 mm)

LTC1403IMSE#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

1

Yes

2.5 V

2.8 MHz

1

12

0.0488 %

3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2247IUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

40 MHz

1

CMOS

14

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2292IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

40 MHz

2

CMOS

12

0.0342 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2353CLX-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

2

Yes

10.2525 V

550 kHz

1

CMOS

18

0.0023 %

5 V

Binary, 2's Complement Binary

Flatpack, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-10.2275 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

1.1 µs

S-PQFP-G48

3

0.063 in (1.6 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.276 in (7 mm)

LTC2448IUHF#TRPBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

16

Yes

2.75 V

1

24

5 V

Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Matte Tin

Quad

170 ms

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTM9008CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

65 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

e1

0.443 in (11.25 mm)

MAX1205CMH+

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

44

QFP

Square

Plastic/Epoxy

1

Yes

4.5 V

1 MHz

1

CMOS

14

5 V

Offset Binary, 2's Complement Binary, 1's Complement Binary

3.3/5,5 V

Flatpack

QFP44,.5SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

-4.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQFP-G44

3

0.094 in (2.388 mm)

0.394 in (10.0075 mm)

No

e3

0.394 in (10.0075 mm)

MAX1228BEEP+

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

12

Yes

2.048 V

300 kHz

1

BICMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline, Shrink Pitch

SSOP20,.25

Analog to Digital Converters

0.025 in (0.635 mm)

85 °C (185 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Track

Dual

R-PDSO-G20

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.341 in (8.65 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.