Analog Devices Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

LTC1407ACMSE#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

2.5 V

3 MHz

1

14

0.0244 %

3 V

Binary

Small Outline

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC1407IMSE-1#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

2

Yes

1.25 V

3 MHz

1

CMOS

12

0.0488 %

3 V

2's Complement Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

660 ns

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC1408CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

6

Yes

2.5 V

600 kHz

1

14

0.0183 %

3 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC1598CG#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

24

SSOP

Rectangular

Plastic/Epoxy

8

Yes

5.55 V

1.4 kHz

1

CMOS

12

0.0732 %

5 V

Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-50 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

R-PDSO-G24

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.323 in (8.2 mm)

LTC1605IG#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

100 kHz

1

16

0.0046 %

5 V

2's Complement Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

8 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

LTC1608ACG#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

500 kHz

1

16

0.0031 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-2.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Dual

1.8 µs

R-PDSO-G36

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

LTC1609ACSW

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

3

Yes

10 V

200 kHz

1

16

0.0031 %

5 V

Binary, 2's Complement Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-10 V

Serial

0 °C (32 °F)

Tin Lead

Sample

Dual

3 µs

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.504 in (12.8 mm)

LTC1609IG#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

3

Yes

10 V

200 kHz

1

16

0.0046 %

5 V

Binary, 2's Complement Binary

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

3 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

0.402 in (10.2 mm)

LTC1861IS8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

2

Yes

5.25 V

250 kHz

1

12

0.0244 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

3.2 µs

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

LTC1863LIGN

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

8

Yes

1.25 V

175 kHz

1

12

0.0244 %

2.7 V

Binary, 2's Complement Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Tin/Lead

Dual

3.7 µs

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.899 mm)

No

e0

0.193 in (4.89 mm)

LTC2107CUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.4 V

210 MHz

1

CMOS

16

0.0069 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.4 V

Serial, Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

0.276 in (7 mm)

LTC2145IUP-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

125 MHz

1

CMOS

14

0.0159 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2157CUP-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1.5 V

250 MHz

1

CMOS

12

0.0562 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1.5 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2160IUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

25 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N48

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

LTC2165CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.25 V

125 MHz

1

CMOS

16

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

700 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N48

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

LTC2165CUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.25 V

125 MHz

1

CMOS

16

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

700 mV

Parallel, Word

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N48

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.276 in (7 mm)

LTC2171IUKG-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2171IUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2 V

40 MHz

1

CMOS

14

0.0168 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2194CUKG#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

1.25 V

105 MHz

1

CMOS

16

0.0114 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

700 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

1 µs

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2203IUK

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.5 V

25 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC2203IUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.5 V

25 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2205CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

65 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2205IUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

65 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2205IUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

65 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2207IUK

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

105 MHz

1

CMOS

16

0.0061 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1.5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC2207IUK#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

105 MHz

1

CMOS

16

0.0061 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1.5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e0

0.276 in (7 mm)

LTC2207IUK#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

105 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2209CUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

160 MHz

1

CMOS

16

0.0084 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2240IUP-12

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

170 MHz

1

CMOS

12

0.0513 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2240IUP-12#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

170 MHz

1

CMOS

12

0.0513 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2240IUP-12#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

170 MHz

1

CMOS

12

0.0513 %

2.5 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

3

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2252CUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

12

0.0366 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2256IUJ-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

25 MHz

1

CMOS

14

0.0153 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2257IUJ-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

40 MHz

1

CMOS

14

0.0153 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2262IUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

150 MHz

1

CMOS

14

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2262IUJ-14#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

150 MHz

1

CMOS

14

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.016 in (0.4 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2271CUKG#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.1 V

20 MHz

1

CMOS

16

0.004 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2.1 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2311HMSE-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

16

HTSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.054 V

5 MHz

1

CMOS

16

0.0122 %

3.3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

125 °C (257 °F)

-2.042 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G16

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

0.159 in (4.039 mm)

LTC2321IUFD-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

28

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.053 V

2 MHz

1

CMOS

16

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.044 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N28

1

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2324CUKG-12#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

4.115 V

2 MHz

1

CMOS

12

0.0244 %

5 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

4.078 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Quad

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

260 °C (500 °F)

0.315 in (8 mm)

LTC2325CUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

14

44.5 mA

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC52,.27X.31,20

0.02 in (0.5 mm)

70 °C (158 °F)

-2.034 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Quad

200 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2325IUKG-14#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

4

Yes

2.064 V

5 MHz

1

CMOS

14

44.5 mA

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC52,.27X.31,20

0.02 in (0.5 mm)

85 °C (185 °F)

-2.034 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

200 ns

R-PQCC-N52

1

0.031 in (0.8 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.315 in (8 mm)

LTC2326IMS-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

10.2525 V

250 kHz

1

CMOS

16

0.0023 %

5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-10.2275 V

Serial

-40 °C (-40 °F)

Matte Tin

Dual

3 µs

R-PDSO-G16

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

0.159 in (4.039 mm)

LTC2333ILX-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

8

Yes

10.2525 V

800 kHz

1

CMOS

18

9.1 mA

0.001144409 %

15 V

Binary, 2's Complement Binary

Flatpack, Low Profile, Fine Pitch

QFP48,.28SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-10.2275 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

550 ns

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2338IMS-18#TRPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

20.505 V

1 MHz

1

CMOS

18

0.0015 %

5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-20.455 V

Serial

-40 °C (-40 °F)

Matte Tin

Dual

527 ns

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTC2351HUH-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

6

Yes

1.25 V

1.5 MHz

1

12

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2351IUH-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

6

Yes

1.25 V

1.5 MHz

1

12

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2355IMSE-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

1

Yes

2.5 V

3.5 MHz

1

CMOS

14

0.0244 %

3.3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

285 ns

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.