Analog Devices Analog-to-Digital Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD9695BCPZ-1300

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2.04 V

1300 MHz

1

14

0.0305 %

950 mV

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.04 V

Serial

-40 °C (-40 °F)

Sample

Quad

S-XQCC-N64

3

0.031 in (0.8 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9695BCPZRL7-1300

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

2

Yes

2.04 V

1300 MHz

1

14

0.0305 %

950 mV

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.04 V

Serial

-40 °C (-40 °F)

Sample

Quad

S-XQCC-N64

3

0.031 in (0.8 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9697BCPZRL7-1300

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

1

Yes

2.04 V

1300 MHz

1

14

0.0305 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

105 °C (221 °F)

-2.04 V

Serial

-40 °C (-40 °F)

Sample

Quad

0.714 ns

S-XQCC-N64

0.031 in (0.8 mm)

0.354 in (9 mm)

0.354 in (9 mm)

AD976AARZ-RL

Analog Devices

Analog To Digital Converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

200 kHz

1

BICMOS

16

0.0046 %

5 V

2's Complement Binary

5 V

Small Outline

SOP28,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

4 µs

R-PDSO-G28

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

AD977AARZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

3

Yes

10 V

200 kHz

1

BICMOS

16

0.0046 %

5 V

Binary, 2's Complement Binary

5 V

Small Outline

SOP20,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Serial

-40 °C (-40 °F)

Matte Tin

Dual

4 µs

R-PDSO-G20

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

LTC1288IS8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

6.05 V

6.6 kHz

1

CMOS

12

390 μA

0.048828125 %

3 V

Offset Binary

Small Outline

SOP8,.25

0.05 in (1.27 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

100 µs

R-PDSO-G8

0.069 in (1.752 mm)

0.154 in (3.899 mm)

e3

0.193 in (4.9025 mm)

LTC1401IS8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

200 kHz

1

CMOS

12

0.0244 %

3 V

Binary

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

4.1 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9025 mm)

LTC1418IG#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.048 V

200 kHz

1

CMOS

14

0.0122 %

5 V

Binary, 2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-2.048 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

4 µs

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

0.402 in (10.2 mm)

LTC1608AIG#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

36

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

500 kHz

1

16

0.0031 %

5 V

2's Complement Binary

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-2.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Dual

1.8 µs

R-PDSO-G36

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e3

30 s

260 °C (500 °F)

0.504 in (12.8 mm)

LTC1860CS8#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

5.25 V

250 kHz

1

12

0.0244 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

3.2 µs

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.9 mm)

LTC1865HMS#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

2

Yes

5.25 V

250 kHz

1

16

0.013 %

5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

3.3 µs

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.118 in (3 mm)

LTC2151IUJ-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.5 V

210 MHz

1

CMOS

14

0.0311 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1.5 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

4.7 ns

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2192IUKG#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

52

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2 V

65 MHz

1

CMOS

16

0.0092 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Sample

Quad

R-PQCC-N52

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

0.315 in (8 mm)

LTC2202CUK#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

48

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.5 V

10 MHz

1

CMOS

16

0.0069 %

3.3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N48

1

0.031 in (0.8 mm)

0.276 in (7 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTC2208IUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

2.25 V

130 MHz

1

CMOS

16

0.0061 %

3.3 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

1.5 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

LTC2227CUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1.9 V

40 MHz

1

CMOS

12

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2249IUH

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

14

0.0244 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e0

0.197 in (5 mm)

LTC2251IUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

125 MHz

1

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2252CUH#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

12

0.0366 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N32

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2264CUJ-12#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

40

HVQCCN

Square

Plastic/Epoxy

2

Yes

2 V

40 MHz

1

CMOS

12

0.0244 %

1.8 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Matte Tin - annealed

Sample

Quad

S-PQCC-N40

1

0.031 in (0.8 mm)

0.236 in (6 mm)

No

e3

30 s

260 °C (500 °F)

0.236 in (6 mm)

LTC2284IUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

105 MHz

1

CMOS

14

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2294CUP#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

80 MHz

1

CMOS

12

0.0342 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-500 mV

Parallel, Word

0 °C (32 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

LTC2311IMSE-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

16

HTSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.054 V

5 MHz

1

CMOS

16

0.0122 %

3.3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-2.042 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTC2323IUFD-16#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Automotive

No Lead

28

HVQCCN

Rectangular

Plastic/Epoxy

2

Yes

2.053 V

5 MHz

1

CMOS

16

0.0183 %

3.3 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

125 °C (257 °F)

-2.044 V

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Quad

R-PQCC-N28

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

0.197 in (5 mm)

LTC2364IMS-18#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

250 kHz

1

CMOS

18

0.001 %

2.5 V

Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

3 µs

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTC2376CMS-20#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

5.1 V

250 kHz

1

CMOS

20

0.0002 %

2.5 V

2's Complement Binary

Small Outline, Thin Profile, Shrink Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

-2.5 V

Serial

0 °C (32 °F)

Matte Tin

Sample

Dual

3 µs

R-PDSO-G16

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTC2460IMS#PBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

12

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.25 V

60 Hz

1

16

0.0153 %

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin - annealed

Dual

23 ms

R-PDSO-G12

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTC2471CMS#TRPBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

Gull Wing

12

TSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.253 V

1

CMOS

16

0.0183 %

Binary

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin - annealed

Dual

4.8 ms

R-PDSO-G12

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e3

30 s

260 °C (500 °F)

0.159 in (4.039 mm)

LTC2499CUHF#TRPBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

38

HVQCCN

Rectangular

Plastic/Epoxy

16

Yes

5.5 V

1

24

5 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Matte Tin

Quad

163.5 ms

R-PQCC-N38

1

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.276 in (7 mm)

LTM9011CY-14#PBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Ball

140

FBGA

Rectangular

Plastic/Epoxy

8

Yes

2 V

125 MHz

1

14

0.025 %

1.8 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

R-PBGA-B140

0.113 in (2.87 mm)

0.354 in (9 mm)

No

e1

0.443 in (11.25 mm)

AD7715AR-5

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

1

Yes

2.5 V

1

CMOS

16

0.0015 %

5 V

Binary, Offset Binary

3/5,5 V

Small Outline

SOP16,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-2.5 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G16

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

30 s

240 °C (464 °F)

0.406 in (10.3 mm)

AD7731BR

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

6

Yes

1.28 V

1

24

0.0015 %

5 V

Binary, Offset Binary

3/5,5 V

Small Outline

SOP24,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-1.28 V

Serial

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G24

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.606 in (15.4 mm)

AD7405BRIZ

Analog Devices

Analog To Digital Converter, Delta-Sigma

Automotive

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

1

Yes

320 mV

1

16

0.0183 %

5 V

Binary

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-320 mV

Serial

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

3

0.104 in (2.64 mm)

0.295 in (7.5 mm)

e3

0.502 in (12.75 mm)

5962R8851401VPA

Analog Devices

100k Rad(Si)

LTC2312ITS8-12#WTRMPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.056 V

500 kHz

1

CMOS

AEC-Q100

12

4.3 mA

0.0366 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

TSSOP8,.1

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

260 °C (500 °F)

0.114 in (2.9 mm)

LTC2312ITS8-14#WTRMPBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

VSSOP

Rectangular

Plastic/Epoxy

1

Yes

2.056 V

500 kHz

1

CMOS

AEC-Q100

14

4.3 mA

0.024 %

3 V

Binary

Small Outline, Very Thin Profile, Shrink Pitch

TSSOP8,.1

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

R-PDSO-G8

1

0.039 in (1 mm)

0.064 in (1.625 mm)

e3

260 °C (500 °F)

0.114 in (2.9 mm)

5962-8961603VX

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

1

8

0.1172 %

5 V

Binary

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Dual

15 µs

R-GDIP-T18

No

LTC1403CMSE#TR

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

10

HTSSOP

Square

Plastic/Epoxy

1

Yes

2.5 V

2.8 MHz

1

12

7 mA

0.0488 %

3 V

Binary

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP10,.19,20

0.02 in (0.5 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

No

e0

0.118 in (3 mm)

LTC1096LIS8

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

1

Yes

4.05 V

33 kHz

1

CMOS

8

0.3906 %

2.65 V

Binary

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Tin/Lead

Sample

Dual

32 µs

R-PDSO-G8

1

0.069 in (1.752 mm)

0.154 in (3.9 mm)

No

e0

0.193 in (4.9025 mm)

AD7876BRZ-REEL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

24

SOP

Rectangular

Plastic/Epoxy

1

Yes

10 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

Small Outline

SOP24,.4

Analog to Digital Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, 8 Bits, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Dual

9 µs

R-PDSO-G24

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

0.606 in (15.4 mm)

LTC2284IUP#TRPBF

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

2

Yes

1 V

105 MHz

1

CMOS

14

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-500 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e3

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD7451BRT-REEL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

8

LSSOP

Rectangular

Plastic/Epoxy

1

Yes

1.25 V

1 MHz

1

12

0.0244 %

3 V

Binary

3/5 V

Small Outline, Low Profile, Shrink Pitch

TSSOP8,.1

Analog to Digital Converters

0.026 in (0.65 mm)

85 °C (185 °F)

-1.25 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

16 µs

R-PDSO-G8

1

0.057 in (1.45 mm)

0.063 in (1.6 mm)

No

e0

240 °C (464 °F)

0.114 in (2.9 mm)

LTC2280CUP

Analog Devices

Analog To Digital Converter, Proprietary Method

Commercial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

2

CMOS

10

0.0586 %

3 V

Offset Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

-1 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Quad

S-PQCC-N64

1

0.031 in (0.8 mm)

0.354 in (9 mm)

No

e0

0.354 in (9 mm)

AD9038SZ/883

Analog Devices

Analog To Digital Converter, Flash Method

Military

Gull Wing

68

QFP

Square

Ceramic, Metal-Sealed Cofired

1

Yes

500 mV

325 MHz

1

Bipolar

8

495 mA

0.39 %

Offset Binary, 2's Complement Binary

-5.2 V

Flatpack

0.05 in (1.27 mm)

125 °C (257 °F)

-6 V

Parallel, 8 Bits

-55 °C (-67 °F)

Quad

3.3 ns

S-CQFP-G68

0.118 in (2.997 mm)

0.95 in (24.13 mm)

No

0.95 in (24.13 mm)

AD7843ARQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

4

Yes

3.6 V

1

12

380 μA

0.0488 %

Binary

Small Outline, Shrink Pitch

TSSOP16,.24

0.025 in (0.635 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

R-PDSO-G16

0.069 in (1.7526 mm)

0.154 in (3.9116 mm)

e0

0.193 in (4.9 mm)

AD7843ARUZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

3.6 V

1

12

380 μA

0.0488 %

Binary

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

0.026 in (0.65 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Matte Tin

Track

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.175 in (4.44 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

LTC2415-1IGN#TRPBF

Analog Devices

Analog To Digital Converter, Delta-Sigma

Industrial

Gull Wing

16

SSOP

Rectangular

Plastic/Epoxy

1

Yes

2.75 V

1

24

3.3 V

Binary

Small Outline, Shrink Pitch

0.025 in (0.635 mm)

85 °C (185 °F)

-2.75 V

Serial

-40 °C (-40 °F)

Matte Tin

Dual

74.3 ms

R-PDSO-G16

1

0.068 in (1.727 mm)

0.154 in (3.899 mm)

No

e3

30 s

260 °C (500 °F)

0.193 in (4.8895 mm)

LTC1094CN#PBF

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

5.05 V

1

10

0.0488 %

5 V

Binary

-5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Matte Tin

Sample

Dual

20 µs

R-PDIP-T20

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.