20 Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7545LP

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

0.353 in (8.9662 mm)

Binary

AD7945ARSZ-BREEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

Yes

1

12

0.0244 %

Parallel, Word

3.3 V

Small Outline, Shrink Pitch

5 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

40 s

260 °C (500 °F)

0.283 in (7.2 mm)

Binary, Offset Binary

AD5433YCP-REEL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

CMOS

10

70 ns

5 μA

0.0488 %

Parallel, Word

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16SQ,20

Other Converters

30 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-XQCC-N20

3

0.039 in (1 mm)

0.157 in (4 mm)

No

e0

240 °C (464 °F)

.4 V

0.157 in (4 mm)

Binary

PM7226FR

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

4

CMOS

8

5 µs

12 mA

0.391 %

Parallel, 8 Bits

12 V

12/15, GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

AD7302BRUZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

8

2 µs

5 mA

0.3906 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

1.2 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD558JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2.56 V

Yes

1

Bipolar

8

3 µs

25 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.966 mm)

No

e0

225 °C (437 °F)

0 V

0.353 in (8.966 mm)

Complementary Offset Binary

LTC2657CFE-H12#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

HTSSOP

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

12

0.0244 %

Serial

5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

3.9 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

PM7226ARCMDA

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

4

BICMOS

38535Q/M;38534H;883B

8

12/15, GND/-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Binary

AD7548TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

BICMOS

38535Q/M;38534H;883B

12

2 µs

3 mA

0.012 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T20

No

e0

Binary

DAC-8426SR

Analog Devices

Digital to Analog converter

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

Parallel, 8 Bits

15 V

In-Line

0.1 in (2.54 mm)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7248AAR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

12

10 µs

12 mA

0.0183 %

Parallel, 8 Bits

15 V

12/15,GND/-12/-15 V

-15 V

Small Outline

SOP20,.4

Other Converters

7 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.107 in (2.72 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-5 V

0.504 in (12.8 mm)

Binary

LTC2600IUFD#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

4 mA

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16X.2,20

10 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD7548KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

3 mA

1.1719 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.064 in (27.035 mm)

Offset Binary

DAC8800BIFP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

8

CMOS

8

2 mA

Serial

12 V

-5 V

In-Line

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

Binary

LTC2657CUFD-L12#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

3.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD7248AAPZ

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

12

10 µs

12 mA

0.0183 %

Parallel, 8 Bits

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

7 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e3

260 °C (500 °F)

-5 V

0.353 in (8.9662 mm)

Binary

AD7112CN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

2 mA

Parallel, 8 Bits

5 V

5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

Binary

PM7528FPZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 V

No

2

CMOS

8

0 ns

1 mA

0.195 %

Parallel, 8 Bits

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

1

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0 V

0.992 in (25.2 mm)

Binary, Offset Binary

AD7226BQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

CMOS

8

20 µs

13 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

1.06 in (26.92 mm)

Binary, Offset Binary

AD7528SE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

8

0 ns

2 mA

0.3906 %

Parallel, 8 Bits

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

DAC312BIHP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

12

18 mA

0.05 %

Parallel, Word

15 V

-15 V

In-Line

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

Binary

5962-01-289-2117

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

2

CMOS

38535Q/M;38534H;883B

8

600 ns

2 mA

0.2 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

1

No

Binary, Offset Binary

DAC8229BIER

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

8

6 mA

0.1953 %

Parallel, 8 Bits

-5 V

In-Line

2 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7549SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

1.5 µs

5 mA

0.0244 %

Parallel, 4 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.175 in (4.45 mm)

0.3 in (7.62 mm)

No

e0

1.062 in (26.972 mm)

Binary, Offset Binary

AD7248AARZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

12

10 µs

12 mA

0.0183 %

Parallel, 8 Bits

15 V

12/15,GND/-12/-15 V

-15 V

Small Outline

SOP20,.4

Other Converters

7 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.107 in (2.72 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.504 in (12.8 mm)

Binary

AD7524LP

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

0 ns

2 mA

0.0488 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

500 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

0.353 in (8.9662 mm)

Binary

AD7248JP

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

12 V

12/15,GND/-12/-15 V

-12 V

Chip Carrier

LDCC20,.4SQ

Other Converters

10 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

-5 V

0.353 in (8.9662 mm)

Binary

AD7533KP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

10

1 µs

2 mA

0.1 %

Parallel, Word

15 V

15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

225 °C (437 °F)

0.353 in (8.965 mm)

Binary, Offset Binary

AD7524KPZ-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

8

0 ns

2 mA

0.0977 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

500 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e3

30 s

260 °C (500 °F)

0.353 in (8.9662 mm)

Binary

AD662SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

2.56 V

No

1

BICMOS

12

13.5 mA

0.0977 %

Parallel, Word

5 V

5 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

Binary

AD7545ALNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

0.3 in (7.62 mm)

No

e3

Binary, 2's Complement Binary

AD7945ARS-BREEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

5 µs

0.0122 %

Parallel, Word

3.3 V

3.3/5 V

Small Outline, Shrink Pitch

SSOP20,.3

Other Converters

5 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

240 °C (464 °F)

0.283 in (7.2 mm)

Binary, Offset Binary

AD7548BQ/+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

BICMOS

12

3 mA

0.012 %

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-XDIP-T20

e0

Binary

AD7628BQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

8

0 ns

2.5 mA

0.1953 %

Parallel, 8 Bits

12 V

12/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.953 in (24.195 mm)

Binary

LTC2656BCUFD-H16#TRPBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

7.9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

LTC2654BIUF-H16#TRPBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

1

CMOS

16

0.0061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

7.9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD7524TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

8

0 ns

2 mA

0.0977 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

100 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

PM7545GPZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

15 V

No

1

CMOS

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0 V

0.992 in (25.2 mm)

Binary, 2's Complement Binary

AD7533SE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

10

1 µs

2 mA

0.2 %

Parallel, Word

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

AD7801BRZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

2 µs

1.75 mA

0.3906 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline

SOP20,.4

Other Converters

1.2 µs

0.05 in (1.27 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.504 in (12.8 mm)

Binary

AD7549SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883 Class B

12

1.5 µs

5 mA

0.0244 %

Parallel, 4 Bits

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

PM7628BIFP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

8

0.1953 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.992 in (25.2 mm)

Binary, Offset Binary

DAC8426GBC

Analog Devices

Digital to Analog converter

Other

No Lead

20

DIE

Rectangular

Yes

1

CMOS

MIL-STD-883 Class B (Modified)

8

14 mA

0.391 %

Parallel, 8 Bits

15 V

15 V

Uncased Chip

DIE OR CHIP

Other Converters

3 µs

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N20

No

e0

Binary

AD5341BRU-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

10 µs

250 μA

0.29 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

SSOP20,.25

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

0.256 in (6.5 mm)

Binary

AD7111UE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

38535Q/M;38534H;883B

8

4 mA

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

5962-87702062A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Glass-Sealed

Yes

1

CMOS

MIL-STD-883

12

2 mA

0.012207 %

Parallel, Word

5 V

Chip Carrier

LCC20(UNSPEC)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

No

Binary

PM7545BRC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

Parallel, Word

15 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0 V

0.35 in (8.89 mm)

Binary, 2's Complement Binary

AD7226TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

4

BICMOS

8

20 µs

13 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC20,.35SQ

Other Converters

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

-5 V

0.35 in (8.89 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.