20 Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2610IUFD#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

Yes

1

14

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

Binary

AD7549BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

2

CMOS

12

1.5 µs

5 mA

0.0122 %

Parallel, Word

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T20

0.3 in (7.62 mm)

No

e0

1 in (25.4 mm)

Binary

AD7542SE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

250 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

AD5675RARUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

16

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD7226BRSZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

8

0.1953 %

Parallel, 8 Bits

15 V

-5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

260 °C (500 °F)

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

PM7628FR

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

0 ns

1 mA

0.195 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

5962-89481022A

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

2 mA

0.0244 %

Parallel, Word

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

600 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary, Offset Binary

LTC2610CUFD#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Rectangular

Plastic/Epoxy

Yes

1

14

0.0977 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

9 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

R-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

Binary

AD7541TE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

1

CMOS

12

1 µs

2 mA

0.012 %

15 V

15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Binary, Offset Binary

AD7534SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

38535Q/M;38534H;883B

14

1.5 µs

3 mA

0.012 %

Parallel, 8 Bits

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD7302BRU

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

3 V

Yes

1

CMOS

8

2 µs

5 mA

0.3906 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

1.2 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

0 V

0.256 in (6.5 mm)

Binary

AD7118UE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

1

CMOS

38535Q/M;38534H;883B

6

2 mA

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Binary

PM7226BR

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

15 V

No

4

CMOS

8

5 µs

12 mA

0.391 %

Parallel, 8 Bits

12 V

12/15, GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

PM7524FPC

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

15 V

Yes

1

MOS

8

0 ns

1 mA

0.1 %

Parallel, 8 Bits

15 V

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

0.18 in (4.57 mm)

0.353 in (8.965 mm)

No

e0

0 V

0.353 in (8.965 mm)

Binary, Offset Binary

LTC2657IFE-L12#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

HTSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

3.9 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

DAC8229FPZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

2.5 V

No

2

CMOS

8

5 µs

6 mA

0.1953 %

Parallel, 8 Bits

15.75 V

-5 V

In-Line

2 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

0.18 in (4.57 mm)

0.3 in (7.62 mm)

No

e3

-2.5 V

0.965 in (24.51 mm)

Binary

PM7628ARC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic

Yes

2

CMOS

38535Q/M;38534H;883B

8

300 ns

2.5 mA

0.2 %

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-XQCC-N20

No

e0

Binary, Offset Binary

AD7534JPZ-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

MOS

14

3 mA

0.012 %

Parallel, 8 Bits

-.3 V

Chip Carrier

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e3

260 °C (500 °F)

0.353 in (8.9662 mm)

Binary, Offset Binary

AD558JPZ-REEL7

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

Bipolar

8

3 µs

25 mA

0.1953 %

Parallel, 8 Bits

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

2 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.173 in (4.39 mm)

0.352 in (8.93 mm)

No

e3

260 °C (500 °F)

0 V

0.352 in (8.93 mm)

Binary

AD5332BRUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

8

8 µs

450 μA

0.39 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

6 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

260 °C (500 °F)

0.256 in (6.5 mm)

Binary

AD7534KNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

MOS

14

1.5 µs

3 mA

0.006 %

Parallel, 8 Bits

12/15,GND/-0.3 V

-.3 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.992 in (25.2 mm)

Binary, Offset Binary

LTC2655CUF-H12#PBF

Analog Devices

Digital to Analog converter

Commercial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

4

CMOS

12

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2.4 µs

0.02 in (0.5 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

5962-01-253-9115

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

4

BICMOS

8

20 µs

24 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

Binary

AD7248AARZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

CMOS

12

10 µs

12 mA

0.0183 %

Parallel, 8 Bits

15 V

12/15,GND/-12/-15 V

-15 V

Small Outline

SOP20,.4

Other Converters

7 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.107 in (2.72 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.504 in (12.8 mm)

Binary

5962-89932012X

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

18 V

Yes

1

Bipolar

MIL-STD-883

8

0.19 %

Parallel, 8 Bits

15 V

-15 V

Chip Carrier

85 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

Yes

-10 V

0.35 in (8.89 mm)

Offset Binary

AD7392AN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

Bipolar

12

100 μA

0.0732 %

Parallel, Word

3 V

3/5 V

In-Line

DIP20,.3

Other Converters

70 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-5 V

1.03 in (26.16 mm)

Binary

PM7528FSZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

SOP

Rectangular

Plastic/Epoxy

15 V

Yes

2

CMOS

8

0 ns

1 mA

0.195 %

Parallel, 8 Bits

15 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G20

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

40 s

260 °C (500 °F)

0 V

0.504 in (12.8 mm)

Binary, Offset Binary

DAC8426AR/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

38535Q/M;38534H;883B

8

14 mA

0.1953 %

Parallel, 8 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

LTC7545AKG

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

12

0.0122 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.078 in (1.99 mm)

0.208 in (5.29 mm)

No

e0

0 V

0.283 in (7.2 mm)

Binary, Offset Binary

5962-01-334-7580

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

BICMOS

14

1.5 µs

3 mA

0.012 %

12/15,GND/-0.3 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T20

No

Binary, Offset Binary

AD7849CN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

BICMOS

16

7 µs

0.0122 %

Serial

15 V

5,±12/±15 V

-15 V

In-Line

DIP20,.3

Other Converters

7 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-10 V

0.992 in (25.2 mm)

Binary, Offset Binary, 2's Complement Binary

AD557JPZ-REEL7

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2.56 V

Yes

1

Bipolar

8

2 µs

25 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e3

260 °C (500 °F)

0 V

0.353 in (8.9662 mm)

Binary

AD7849ANZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

BICMOS

14

5 mA

0.0183 %

Serial

15 V

5,±15 V

-15 V

In-Line

DIP20,.3

Other Converters

7 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-10 V

0.992 in (25.2 mm)

Binary, Offset Binary, 2's Complement Binary

PM7542BRC/883

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

15 V

Yes

2

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.024 %

Parallel, 4 Bits

5 V

5 V

Chip Carrier

LCC20,.35SQ

Other Converters

250 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0 V

0.35 in (8.89 mm)

Binary, Offset Binary

DAC312BIER

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

12

18 mA

0.05 %

Parallel, Word

15 V

-15 V

In-Line

250 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD557JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2.56 V

Yes

1

Bipolar

8

2 µs

25 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.565 mm)

0.353 in (8.966 mm)

No

e0

225 °C (437 °F)

0 V

0.353 in (8.966 mm)

Complementary Offset Binary

LTC2657BCFE-L16#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

20

HTSSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

CMOS

16

0.0061 %

Serial

3 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

9.1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

PM-7224HPC

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

BICMOS

8

5 µs

6 mA

0.39 %

12/15, GND/-5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J20

No

e0

Binary

AD7542KP

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

250 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

0.353 in (8.9662 mm)

Binary, Offset Binary

5962-8770203RX

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

0.0488 %

Parallel, Word

5 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

Yes

e0

Binary

AD7548JPZ-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

MOS

8

3 mA

0.024 %

Parallel, 8 Bits

5/15 V

Chip Carrier

LDCC20,.4SQ

Other Converters

1 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e3

260 °C (500 °F)

0.353 in (8.9662 mm)

Binary, Offset Binary

DAC8220BIER

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

2

CMOS

8

0.1953 %

Parallel, 8 Bits

11.4 V

-5 V

In-Line

2 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

2.5 V

Offset Binary

AD7524SE

Analog Devices

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

8

0 ns

2 mA

0.1953 %

Parallel, 8 Bits

5 V

5/15 V

Chip Carrier

LCC20,.35SQ

Other Converters

500 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N20

0.1 in (2.54 mm)

0.35 in (8.89 mm)

No

e0

0.35 in (8.89 mm)

Binary

LTC2655BIUF-H16#PBF

Analog Devices

Digital to Analog converter

Industrial

No Lead

20

HVQCCN

Square

Plastic/Epoxy

4.096 V

Yes

4

CMOS

16

0.0061 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

9.1 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-PQCC-N20

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD557JPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

20

QCCJ

Square

Plastic/Epoxy

2.56 V

Yes

1

Bipolar

8

2 µs

25 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J20

1

0.18 in (4.565 mm)

0.353 in (8.966 mm)

No

e3

260 °C (500 °F)

0 V

0.353 in (8.966 mm)

Complementary Offset Binary

AD7801BRU-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

8

2 µs

1.75 mA

0.3906 %

Parallel, 8 Bits

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP20,.25

Other Converters

1.2 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G20

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

0 V

0.256 in (6.5 mm)

Binary

AD7543KP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

20

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

12

2 µs

2.5 mA

0.012 %

Serial

5 V

5 V

Chip Carrier

LDCC20,.4SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J20

1

0.18 in (4.57 mm)

0.353 in (8.9662 mm)

No

e0

225 °C (437 °F)

0.353 in (8.9662 mm)

Binary

5962-01-246-2941

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic

No

4

BICMOS

38535Q/M;38534H;883B

8

20 µs

13 mA

0.39 %

12/15, GND/-5 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T20

No

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.