Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
12 |
0.0244 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
4.6 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.256 in (6.5 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
2 µs |
5 mA |
0.0122 % |
Parallel, 4 Bits |
15 V |
15 V |
In-Line |
DIP20,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.175 in (4.45 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.062 in (26.972 mm) |
Binary, Offset Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
20 |
HVQCCN |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
12 |
0.0244 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
3.9 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Quad |
R-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.197 in (5 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
15 V |
No |
1 |
CMOS |
12 |
1 µs |
3 mA |
0.012 % |
Parallel, 8 Bits |
15 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
0.992 in (25.2 mm) |
Binary, Offset Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
2 |
CMOS |
8 |
0 ns |
2 mA |
0.1953 % |
Parallel, 8 Bits |
12 V |
12/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
0.3 in (7.62 mm) |
No |
e3 |
Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
MOS |
14 |
1.5 µs |
3 mA |
0.006 % |
Parallel, 8 Bits |
12/15,GND/-0.3 V |
-.3 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.9662 mm) |
Binary, Offset Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
MIL-STD-883 |
12 |
0.05 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP20,.3 |
Other Converters |
250 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
5 V |
No |
1 |
CMOS |
12 |
5 µs |
12 mA |
0.0366 % |
Parallel, Word |
12 V |
12/15,GND/-12/-15 V |
-12 V |
In-Line |
DIP20,.3 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
0.953 in (24.195 mm) |
Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
0.0488 % |
Parallel, Word |
5 V |
In-Line |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
1 |
Yes |
e0 |
30 s |
225 °C (437 °F) |
Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
No |
2 |
CMOS |
38535Q/M;38534H;883B |
8 |
400 ns |
2 mA |
0.2 % |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-XDIP-T20 |
No |
e0 |
Binary, Offset Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
12 |
CMOS |
8 |
4 mA |
0.5859 % |
Serial |
3 V |
3/5 V |
Small Outline |
SOP20,.4 |
Other Converters |
600 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.504 in (12.8 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
18 V |
Yes |
1 |
Bipolar |
MIL-STD-883 |
8 |
150 ns |
7.8 mA |
0.19 % |
Parallel, 8 Bits |
15 V |
±15 V |
-15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
85 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
-10 V |
0.35 in (8.89 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2.5 V |
No |
8 |
CMOS |
8 |
2 µs |
2 mA |
0.195 % |
Serial |
12 V |
12,GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-2.5 V |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
12 |
Parallel, Word |
15 V |
Chip Carrier |
600 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e4 |
0.35 in (8.89 mm) |
Binary, Offset Binary |
|||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
16 |
0.0061 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
9.1 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.256 in (6.5 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
38535Q/M;38534H;883B |
12 |
2 µs |
3 mA |
0.012 % |
Parallel, 8 Bits |
15 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
10 V |
No |
1 |
Bipolar |
12 |
1 µs |
18 mA |
0.05 % |
Parallel, Word |
15 V |
5/15,-15 V |
-15 V |
In-Line |
DIP20,.3 |
Other Converters |
250 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Offset Binary, 2's Complement Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
1 |
CMOS |
8 |
30 ns |
10 μA |
0.0977 % |
Parallel, 8 Bits |
5 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Other Converters |
30 ns |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
.4 V |
0.256 in (6.5 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic |
Yes |
1 |
BICMOS |
38535Q/M;38534H;883B |
8 |
5 µs |
6 mA |
0.39 % |
12/15, GND/-5 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-XQCC-N20 |
No |
e0 |
Binary |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
4 |
BICMOS |
MIL-STD-883 Class B |
8 |
20 µs |
13 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
In-Line |
DIP20,.3 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
12 |
2 mA |
Parallel, Word |
Chip Carrier |
600 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
0.35 in (8.89 mm) |
Binary |
||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
4 |
CMOS |
8 |
14 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
15 V |
In-Line |
DIP20,.3 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e3 |
0.992 in (25.2 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
1 |
Bipolar |
10 |
70 µs |
100 μA |
0.1758 % |
Parallel, Word |
3 V |
3/5 V |
Small Outline |
SOP20,.4 |
Other Converters |
70 µs |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
-5 V |
0.504 in (12.8 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
No Lead |
20 |
QCCN |
Square |
Ceramic |
Yes |
1 |
BICMOS |
8 |
5 µs |
6 mA |
0.2 % |
12/15, GND/-5 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Quad |
S-XQCC-N20 |
No |
e0 |
Binary |
||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
15 V |
No |
2 |
CMOS |
8 |
0 ns |
1 mA |
0.195 % |
Parallel, 8 Bits |
15 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
Binary, Offset Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
16 |
0.0061 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
9.1 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.256 in (6.5 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
12 |
2 µs |
2 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
4.095 V |
Yes |
1 |
Bipolar |
12 |
6 mA |
0.0244 % |
Parallel, Word |
5 V |
5 V |
Small Outline |
SOP20,.4 |
Other Converters |
16 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.504 in (12.8 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
No Lead |
20 |
HVQCCN |
Square |
Plastic/Epoxy |
4.096 V |
Yes |
4 |
CMOS |
16 |
0.0061 % |
Serial |
5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
9.1 µs |
0.02 in (0.5 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin - annealed |
Quad |
S-PQCC-N20 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
BICMOS |
8 |
20 µs |
6 mA |
0.195 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
1 |
0.173 in (4.39 mm) |
0.352 in (8.93 mm) |
No |
e0 |
225 °C (437 °F) |
0.352 in (8.93 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
8 |
0 ns |
2 mA |
0.1953 % |
Parallel, 8 Bits |
12 V |
12/15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.9662 mm) |
No |
e3 |
260 °C (500 °F) |
0.353 in (8.9662 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
4 |
CMOS |
8 |
14 mA |
0.1953 % |
Parallel, 8 Bits |
15 V |
In-Line |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.992 in (25.2 mm) |
Binary |
||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
MOS |
8 |
3 mA |
0.024 % |
Parallel, 8 Bits |
5/15 V |
Small Outline |
SOP20,.4 |
Other Converters |
1 µs |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.504 in (12.8 mm) |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Automotive |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5 V |
Yes |
1 |
CMOS |
12 |
10 μA |
0.0244 % |
Parallel, Word |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Other Converters |
30 ns |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
240 °C (464 °F) |
.4 V |
0.256 in (6.5 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
2.56 V |
No |
1 |
BICMOS |
12 |
13.5 mA |
0.0977 % |
Parallel, Word |
5 V |
5 V |
In-Line |
DIP20,.3 |
Other Converters |
3 µs |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
2 |
CMOS |
MIL-STD-883 |
8 |
Parallel, 8 Bits |
5 V |
In-Line |
180 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
Yes |
0.953 in (24.195 mm) |
Binary, Offset Binary |
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Analog Devices |
Digital to Analog converter |
Military |
No Lead |
20 |
QCCN |
Square |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
8 |
0 ns |
2 mA |
0.0488 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Chip Carrier |
LCC20,.35SQ |
Other Converters |
500 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin/Lead |
Quad |
S-CQCC-N20 |
0.1 in (2.54 mm) |
0.35 in (8.89 mm) |
No |
e0 |
0.35 in (8.89 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
12 |
0.0244 % |
Serial |
3 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
4.2 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.256 in (6.5 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
Bipolar |
8 |
3 µs |
25 mA |
0.1953 % |
Parallel, 8 Bits |
5/15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
2 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J20 |
1 |
0.173 in (4.39 mm) |
0.352 in (8.93 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.352 in (8.93 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
MIL-STD-883 |
12 |
2 mA |
0.012207 % |
Parallel, Word |
5 V |
In-Line |
DIP20(UNSPEC) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-CDIP-T20 |
No |
Binary |
|||||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
No |
2 |
CMOS |
38535Q/M;38534H;883B |
8 |
600 ns |
2 mA |
0.2 % |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
1 |
No |
Binary, Offset Binary |
||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
TSSOP |
Rectangular |
Plastic/Epoxy |
3 V |
Yes |
1 |
CMOS |
8 |
2 µs |
5 mA |
0.3906 % |
Parallel, 8 Bits |
3 V |
3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP20,.25 |
Other Converters |
1.2 µs |
0.026 in (0.65 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G20 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e3 |
260 °C (500 °F) |
0 V |
0.256 in (6.5 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Gull Wing |
20 |
HTSSOP |
Rectangular |
Plastic/Epoxy |
4.096 V |
Yes |
1 |
CMOS |
16 |
0.0061 % |
Serial |
5 V |
Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch |
7.9 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin - annealed |
Dual |
R-PDSO-G20 |
1 |
0.047 in (1.2 mm) |
0.173 in (4.4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.256 in (6.5 mm) |
Binary |
|||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
10 |
1 µs |
2 mA |
0.1 % |
Parallel, Word |
15 V |
15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.965 mm) |
No |
e0 |
225 °C (437 °F) |
0.353 in (8.965 mm) |
Binary, Offset Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
1 |
CMOS |
12 |
1 µs |
2 mA |
0.012 % |
Parallel, Word |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.953 in (24.195 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Automotive |
No Lead |
20 |
HVQCCN |
Square |
5 V |
Yes |
1 |
CMOS |
8 |
60 ns |
5 μA |
0.0977 % |
Parallel, 8 Bits |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.16SQ,20 |
Other Converters |
30 ns |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N20 |
3 |
0.039 in (1 mm) |
0.157 in (4 mm) |
No |
e0 |
240 °C (464 °F) |
.4 V |
0.157 in (4 mm) |
Binary |
||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic |
No |
1 |
BICMOS |
38535Q/M;38534H;883B |
12 |
2 µs |
3 mA |
0.012 % |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Dual |
R-XDIP-T20 |
No |
Binary |
|||||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Military |
Through-Hole |
20 |
DIP |
Rectangular |
Ceramic, Glass-Sealed |
No |
4 |
CMOS |
MIL-STD-883 |
8 |
20 µs |
13 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
-5 V |
In-Line |
DIP20,.3 |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-GDIP-T20 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.953 in (24.195 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.