28 Digital-to-Analog Converters 1,923

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD9713BTE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

38535Q/M;38534H;883B

12

188 mA

0.0427 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

27 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

AD7245JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

12 V

12/15,GND/-12/-15 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

10 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

30 s

225 °C (437 °F)

-5 V

0.453 in (11.506 mm)

Binary

AD5342BRU-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

Yes

2

CMOS

12

10 µs

0.29 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

0.382 in (9.7 mm)

Binary

5962-89657023X

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

12

2 mA

Parallel, Word

15 V

Chip Carrier

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e0

0.45 in (11.43 mm)

Binary, Offset Binary

AD9754AR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

14

0.0183 %

Parallel, Word

5 V

5 V

Small Outline

SOP28,.4

Other Converters

35 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-1 V

0.705 in (17.9 mm)

Binary

LTC1458ISW

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

4.145 V

Yes

4

CMOS

12

0.1099 %

Serial

5 V

Small Outline

14 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.5 mm)

No

e0

4.045 V

0.704 in (17.89 mm)

Binary

LTC1597-1BIG

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0015 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-10 V

0.402 in (10.2 mm)

Binary

AD7564AR-BREEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

0.0244 %

Serial

5 V

Small Outline

3.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

0.705 in (17.9 mm)

Binary

5962-87763033C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

BICMOS

12

2 mA

Parallel, 8 Bits

Chip Carrier

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary, Offset Binary

AD7535SQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

14

2 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

Binary, Offset Binary

DAC-12M

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

Square

No

1

12

Parallel, Word

10 V

-10 V

Microelectronic Assembly

15 µs

70 °C (158 °F)

0 °C (32 °F)

Dual

S-XDMA-T28

2 in (50.8 mm)

2 in (50.8 mm)

Offset Binary

LTC1591CG#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

0.0061 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.402 in (10.2 mm)

Binary

AD9762ARUZRL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

12

0.0977 %

Parallel, Word

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

35 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.382 in (9.7 mm)

Binary

AD667KNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

Bipolar

12

4 µs

25 mA

0.0122 %

Parallel, Word

12 V

±12/±15 V

-12 V

In-Line

DIP28,.6

Other Converters

3 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

-10 V

1.445 in (36.705 mm)

Binary, Offset Binary, 2's Complement Binary

AD767JPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

Bipolar

12

4 µs

23 mA

0.0244 %

Serial

15 V

±12/±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

3 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

-10 V

0.453 in (11.506 mm)

Binary, Offset Binary, 2's Complement Binary

5962-9176404XA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

9.9853 V

No

4

BICMOS

12

13 mA

0.0366 %

Parallel, Word

15 V

-15 V

In-Line

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-9.9902 V

Binary

AD7840JPZ-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

3 V

Yes

1

BICMOS

14

4 µs

14 mA

0.0122 %

Serial, Parallel, Word

5 V

-5 V

Chip Carrier

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

260 °C (500 °F)

-3 V

0.453 in (11.5062 mm)

Binary

AD9754ARURL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

14

0.0183 %

Parallel, Word

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

35 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

-1 V

0.382 in (9.7 mm)

Binary

AD9706BRUZRL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

12

Parallel, Word

3.3 V

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

260 °C (500 °F)

-1 V

0.382 in (9.7 mm)

Binary, 2's Complement Binary

AD9712AKN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

2 V

No

1

Bipolar

12

165 mA

0.024 %

Parallel, Word

5 V

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

22 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-1.2 V

1.472 in (37.4 mm)

Binary

AD9764ARU

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

14

32 mA

0.0397 %

Parallel, Word

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

35 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

-1 V

0.382 in (9.7 mm)

Binary

AD7834ARZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

8.192 V

Yes

4

BICMOS

14

0.0122 %

Serial

15 V

5,±15 V

-15 V

Small Outline

SOP28,.4

Other Converters

10 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

-8.192 V

0.705 in (17.9 mm)

Binary

AD390JD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

8 µs

100 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.4 in (35.56 mm)

Offset Binary

AD567JD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

500 ns

25 mA

0.0244 %

Parallel, Word

15 V

±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

400 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-1.5 V

1.399 in (35.54 mm)

Binary

AD75004KPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

4

BICMOS

12

4 µs

30 mA

0.0183 %

Parallel, 8 Bits

12 V

±12 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

260 °C (500 °F)

-5 V

0.453 in (11.5062 mm)

Binary

AD664JNZ-BIP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

13 V

No

4

BICMOS

12

10 µs

19 mA

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

-13 V

1.472 in (37.4 mm)

Binary

DAC8412BTC/883

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BICMOS

38535Q/M;38534H;883B

12

12 mA

0.0366 %

Parallel, Word

15 V

5/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

AD568SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

38535Q/M;38534H;883B

12

32 mA

0.018 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

50 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

5962-8871902MXA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

13 V

No

4

BICMOS

MIL-STD-883

12

19 mA

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

-13 V

Binary

AD667/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

12

0.0244 %

Parallel, Word

12 V

-12 V

Chip Carrier

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

-10 V

0.45 in (11.43 mm)

Binary, Offset Binary

LTC1458LCSW#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

4.145 V

Yes

4

CMOS

12

0.1099 %

Serial

3 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

4.045 V

0.705 in (17.9 mm)

Binary

AD7527GUD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

10

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD9713BSQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

38535Q/M;38534H;883B

12

188 mA

0.0488 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

LTC1458LIG#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

4.145 V

Yes

4

CMOS

12

0.1099 %

Serial

3 V

Small Outline, Shrink Pitch

14 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

4.045 V

0.402 in (10.2 mm)

Binary

LTC1591IG

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

0.0061 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-10 V

0.402 in (10.2 mm)

Binary

AD7225TE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

4

BICMOS

8

5 µs

12 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-5 V

0.45 in (11.43 mm)

Binary

AD7535TQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12 V

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary, Offset Binary

AD394TM

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Metal

10 V

No

4

CMOS

MIL-STD-883 Class B

12

15 µs

28 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-T28

0.205 in (5.21 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.57 in (39.88 mm)

Binary

5962-8865901XA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

Bipolar

38535Q/M;38534H;883B

12

4 µs

25 mA

0.018 %

Parallel, Word

15 V

±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

e0

Binary

AD7536KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

MOS

14

2 µs

4 mA

0.006 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.3 in (7.62 mm)

No

e0

1.472 in (37.4 mm)

Offset Binary

AD394TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

11 V

No

4

CMOS

12

15 µs

28 mA

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead (Sn63Pb37)

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-11 V

Offset Binary

AD7522UD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.0977 %

Serial, Parallel, Word

15 V

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

e0

1.397 in (35.49 mm)

Binary

5962-8850901XC

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

Hybrid

38535Q/M;38534H;883B

12

8 µs

120 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD669ANZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

BICMOS

16

13 µs

18 mA

0.0061 %

Parallel, Word

15 V

-15 V

In-Line

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

-10 V

1.472 in (37.4 mm)

Binary

AD7547LPZ-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

2 µs

0.0122 %

Parallel, Word

12 V

Chip Carrier

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

0.453 in (11.506 mm)

Binary

AD7245AAP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

12

10 µs

12 mA

0.0183 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

7 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-5 V

0.453 in (11.5062 mm)

Binary

AD667JPZ

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

Bipolar

12

4 µs

25 mA

0.0183 %

Parallel, Word

12 V

±12/±15 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

3 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.178 in (4.51 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

-10 V

0.453 in (11.506 mm)

Binary, Offset Binary, 2's Complement Binary

AD7228LPZ

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

8

BICMOS

8

5 µs

0.195 %

Parallel, 8 Bits

15 V

-5 V

Chip Carrier

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e3

260 °C (500 °F)

0 V

0.453 in (11.5062 mm)

Binary, Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.