28 Digital-to-Analog Converters 1,923

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD7834AN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8.192 V

No

1

CMOS

14

15 mA

Serial

15 V

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T28

1

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

40 s

260 °C (500 °F)

-8.192 V

1.472 in (37.4 mm)

Binary

LTC1597-1AIG#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0015 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-10 V

0.402 in (10.2 mm)

Binary

AD567TD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

±12/±15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary, Offset Binary

AD9764AR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

14

32 mA

0.0397 %

Parallel, Word

5 V

5 V

Small Outline

SOP28,.4

Other Converters

35 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

30 s

240 °C (464 °F)

-1 V

0.705 in (17.9 mm)

Binary

AD9740WARUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

AEC-Q100

10

36 mA

0.0732 %

Parallel, Word

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

11 ns

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

-1 V

0.382 in (9.7 mm)

Binary, 2's Complement Binary

AD7225LP

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

CMOS

MIL-STD-883

8

5 µs

10 mA

0.1953 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

-5 V

0.453 in (11.506 mm)

Binary, Offset Binary

AD5677RBCPZ-2

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.006103 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

5962-88659013A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

38535Q/M;38534H;883B

12

4 µs

25 mA

0.018 %

Parallel, Word

15 V

±12/±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e0

0.45 in (11.43 mm)

Binary

AD7805BRZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

10

4 µs

0.293 %

Parallel, Word

3.3 V

3.3/5 V

Small Outline

SOP28,.4

Other Converters

4 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

Binary, Offset Binary, 2's Complement Binary

AD7537CE

Analog Devices

Digital to Analog converter

Other

No Lead

28

QCCN

Square

Ceramic

Yes

2

BICMOS

12

1.5 µs

2 mA

0.012 %

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Quad

S-XQCC-N28

No

e0

Binary, Offset Binary

AD664SD-BIP

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

13 V

No

4

BICMOS

12

10 µs

19 mA

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-13 V

Binary

AD7544GTD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

12

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD7544TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

12

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD9708ARZRL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

0.1953 %

Parallel, 8 Bits

5 V

3/5 V

Small Outline

SOP28,.4

Other Converters

35 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

Binary

AD1852JRS

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

24

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP28,.3

Other Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

240 °C (464 °F)

0.402 in (10.2 mm)

2's Complement Binary

5962-88663023C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

8

CMOS

8

22 mA

Parallel, 8 Bits

15 V

-5 V

Chip Carrier

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary

DAC8408FSZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

4

CMOS

8

0 ns

1.5 mA

0.1953 %

Parallel, 8 Bits

5 V

5 V

Small Outline

SOP28,.4

Other Converters

190 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

3

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

260 °C (500 °F)

-10 V

0.705 in (17.9 mm)

Binary

AD9713ATJ

Analog Devices

Digital to Analog converter

Military

J Bend

28

QCCJ

Square

Ceramic, Metal-Sealed Cofired

2 V

Yes

1

Bipolar

12

170 mA

0.024 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Other Converters

27 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-J28

0.171 in (4.34 mm)

0.45 in (11.43 mm)

No

e0

-1.2 V

0.45 in (11.43 mm)

Binary

LTC2756BIG#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

18

0.0008 %

Serial

5 V

Small Outline, Shrink Pitch

2.1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

e3

30 s

260 °C (500 °F)

-10 V

0.402 in (10.2 mm)

Binary

AD9720TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

3 V

No

1

Bipolar

MIL-STD-883

10

0 ns

290 mA

0.1953 %

Parallel, Word

5 V

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

4.5 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

-1.5 V

Binary

AD669BQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

BICMOS

16

13 µs

18 mA

0.0031 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD9740ARURL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

10

0.0684 %

Parallel, Word

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

11 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

-1 V

0.382 in (9.7 mm)

Binary, 2's Complement Binary

AD7237JP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

BICMOS

12

10 µs

15 mA

0.024 %

12/15,GND/-12/-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

AD9720TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

Bipolar

38535Q/M;38534H;883B

10

290 mA

0.1465 %

Parallel, Word

5 V

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

DAC8408G

Analog Devices

Digital to Analog converter

No Lead

28

DIE

Rectangular

10 V

Yes

4

CMOS

8

0 ns

0.195 %

Parallel, 8 Bits

5 V

Uncased Chip

190 ns

Upper

R-XUUC-N28

No

-10 V

Binary, Offset Binary

AD7535TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

38535Q/M;38534H;883B

14

1.5 µs

4 mA

0.006 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

AD1859JRS

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

18

30 mA

Serial

5 V

5 V

Small Outline, Shrink Pitch

SSOP28,.25

Other Converters

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

240 °C (464 °F)

0.402 in (10.2 mm)

2's Complement Binary

AD667JNZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

Bipolar

12

4 µs

25 mA

0.0183 %

Parallel, Word

12 V

±12/±15 V

-12 V

In-Line

DIP28,.6

Other Converters

3 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e3

-10 V

1.445 in (36.705 mm)

Binary, Offset Binary, 2's Complement Binary

AD7845TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

BICMOS

38535Q/M;38534H;883B

12

5 µs

10 mA

0.024 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-10 V

0.45 in (11.43 mm)

Binary

AD5677RBCPZ-2-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.006103 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

DAC8412FPC-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

BICMOS

12

12 mA

0.0488 %

Parallel, Word

5 V

5/±15 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

10 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

0.453 in (11.506 mm)

Binary

AD9721KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

3 V

Yes

1

Bipolar

10

0 ns

0.098 %

Parallel, Word

5 V

-5.2 V

Chip Carrier

5 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

-1.2 V

0.453 in (11.5062 mm)

Binary

AD5546CRUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

10 μA

0.0015 %

Parallel, Word

3 V

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

500 ns

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.382 in (9.7 mm)

Binary

AD7228LP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

8

BICMOS

8

5 µs

20 mA

0.195 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

0 V

0.453 in (11.5062 mm)

Binary, Offset Binary

AD7522SQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

10

0.1953 %

Serial, Parallel, Word

15 V

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

1.49 in (37.85 mm)

Binary

LTC1666IG#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1 V

Yes

1

BICMOS

12

0.0244 %

Parallel, Word

5 V

-5 V

Small Outline, Shrink Pitch

20 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-1 V

0.402 in (10.2 mm)

Binary

5962-9091108M3A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

MIL-STD-883

12

188 mA

0.0305 %

Parallel, Word

5 V

-5.2 V

Chip Carrier

27 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary

AD569KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

BICMOS

16

6 µs

13 mA

0.024 %

Parallel, Word

12 V

±12 V

-12 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-5 V

1.472 in (37.4 mm)

Binary

5962-9306201MXA

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

MIL-STD-883

10

290 mA

0.1465 %

Parallel, Word

5 V

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

10 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

5962-9091105MXX

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

MIL-STD-883

12

0.0427 %

Parallel, Word

5 V

-5.2 V

In-Line

27 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

Binary

LTC1597-1BCG#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0015 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-10 V

0.402 in (10.2 mm)

Binary

AD7527GCD/883B

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD5674RBCPZ-1-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.0244 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

3

0.039 in (1 mm)

0.157 in (4 mm)

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

LTC1667IG#TR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1 V

Yes

1

BICMOS

14

0.0122 %

Parallel, Word

5 V

-5 V

Small Outline, Shrink Pitch

20 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-1 V

0.402 in (10.2 mm)

Binary

AD7564BNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

BICMOS

12

10 μA

0.0122 %

Serial

5 V

5 V

In-Line

DIP28,.6

Other Converters

550 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

Binary

AD664JN-BIP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

13 V

No

4

BICMOS

12

10 µs

19 mA

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-13 V

1.472 in (37.4 mm)

Binary

5962-87763013X

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

BICMOS

38535Q/M;38534H;883B

12

1.5 µs

2 mA

0.024 %

Parallel, 8 Bits

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary, Offset Binary

DAC8413FPC

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

BICMOS

12

12 mA

0.0488 %

Parallel, Word

5 V

5/±15 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

10 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

0.453 in (11.506 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.