28 Digital-to-Analog Converters 1,923

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

5962-01-208-4901

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

500 ns

25 mA

0.018 %

±12/±15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T28

No

Binary, Offset Binary

AD9750ARU

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

10

0.0977 %

Parallel, Word

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

35 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

240 °C (464 °F)

-1 V

0.382 in (9.7 mm)

Binary

LTC1458LCSW#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.245 V

Yes

4

CMOS

12

0.1099 %

Serial

5 V

Small Outline

14 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.642 mm)

0.295 in (7.5 mm)

No

e0

1.195 V

0.704 in (17.89 mm)

Binary

AD75004KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

4

BICMOS

12

4 µs

30 mA

0.0183 %

Parallel, 8 Bits

12 V

±12 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-5 V

0.453 in (11.5062 mm)

Binary

5962-9176402MXX

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

9.9853 V

No

4

BICMOS

MIL-STD-883

12

0.0366 %

Parallel, Word

15 V

-15 V

In-Line

6 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

Yes

-9.9902 V

Binary

AD7805BRS-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

4 µs

0.293 %

Parallel, Word

3.3 V

3.3/5 V

Small Outline, Shrink Pitch

SSOP28,.3

Other Converters

1.5 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead (Sn85Pb15)

Dual

R-PDSO-G28

1

0.078 in (1.983 mm)

0.208 in (5.29 mm)

No

e0

30 s

240 °C (464 °F)

0.402 in (10.21 mm)

Offset Binary, 2's Complement Binary

5962-88663023A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

8

CMOS

38535Q/M;38534H;883B

8

7 µs

22 mA

0.2 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

Yes

e0

0.45 in (11.43 mm)

Binary

AD9742ARUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

12

0.061 %

Parallel, Word

3.3 V

3.3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

11 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.382 in (9.7 mm)

Binary, 2's Complement Binary

AD7846ACHIPS

Analog Devices

Digital to Analog converter

Industrial

No Lead

28

DIE

Rectangular

10 V

Yes

1

CMOS

16

9 µs

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

Uncased Chip

DIE OR CHIP

Other Converters

7 µs

85 °C (185 °F)

-40 °C (-40 °F)

Upper

R-XUUC-N28

No

-10 V

Binary, Offset Binary

AD7846JP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

16

9 µs

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

7 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

5

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

DAC8413BIET

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

12

12 mA

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

6 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead (Sn63Pb37)

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

DAC8412FPZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

BICMOS

12

12 mA

0.0488 %

Parallel, Word

5 V

5/±15 V

-5 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

Binary

5962-89657023C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

2

CMOS

12

2 mA

Parallel, Word

15 V

Chip Carrier

800 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary, Offset Binary

AD667BD

Analog Devices

Digital to Analog converter

Commercial Extended

Through-Hole

28

DIP

Rectangular

Ceramic

10 V

No

1

12

4 µs

0.0061 %

Parallel, Word

12 V

-12 V

In-Line

DIP28,.6

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.145 in (3.68 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.41 in (35.814 mm)

Binary, Offset Binary

LTC1657LCGN#PBF

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

2.5 V

Yes

1

16

0.0183 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

20 µs

0.025 in (0.635 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.39 in (9.9 mm)

Binary

AD7547KP-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

2 µs

2 mA

0.0122 %

Parallel, Word

12 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e0

225 °C (437 °F)

0.453 in (11.506 mm)

Binary

5962-91764043A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

9.9853 V

Yes

4

BICMOS

12

13 mA

0.0366 %

Parallel, Word

15 V

-15 V

Chip Carrier

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

-9.9902 V

0.45 in (11.43 mm)

Binary

AD9712BAN

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

183 mA

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

Binary

AD9712BBN

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

183 mA

0.0427 %

Parallel, Word

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

Binary

AD569KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

16

6 µs

13 mA

0.024 %

Parallel, Word

12 V

±12 V

-12 V

Chip Carrier

LDCC28,.5SQ

Other Converters

4 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-5 V

0.453 in (11.5062 mm)

Binary

5962-9091106M3X

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

MIL-STD-883

12

0.0427 %

Parallel, Word

5 V

-5.2 V

Chip Carrier

27 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary

ADV7127KR140

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.4 V

Yes

1

CMOS

10

0.0977 %

Parallel, Word

3.3 V

3.3/5 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0 V

0.705 in (17.9 mm)

Binary

DAC8412FT

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

12

12 mA

0.0244 %

Parallel, Word

15 V

5/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

6 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD9752AR

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

12

0.0488 %

Parallel, Word

5 V

5 V

Small Outline

SOP28,.4

Other Converters

35 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

240 °C (464 °F)

-1 V

0.705 in (17.9 mm)

Binary

AD7522SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

0.2 %

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T28

No

e0

Binary

AD7805BRZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

10

4 µs

0.293 %

Parallel, Word

3.3 V

3.3/5 V

Small Outline

SOP28,.4

Other Converters

1.5 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

Offset Binary, 2's Complement Binary

5962-88766013A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

1

CMOS

MIL-STD-883

12

10 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

Yes

e0

-5 V

Binary

AD9707BRUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

14

Parallel, Word

3.3 V

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

260 °C (500 °F)

-1 V

0.382 in (9.7 mm)

Binary, 2's Complement Binary

AD7522TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.0977 %

Serial, Parallel, Word

15 V

5,15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

e0

1.397 in (35.49 mm)

Binary

DAC8408BIFP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

8

0.1953 %

Parallel, 8 Bits

5 V

In-Line

190 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

Binary, Offset Binary

AD7547JPZ-REEL

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

2 µs

2 mA

0.0244 %

Parallel, Word

12 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQCC-J28

3

0.18 in (4.57 mm)

0.453 in (11.506 mm)

No

e3

260 °C (500 °F)

0.453 in (11.506 mm)

Binary

LTC1666IG#TRPBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1 V

Yes

1

BICMOS

12

0.0244 %

Parallel, Word

5 V

-5 V

Small Outline, Shrink Pitch

20 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.402 in (10.2 mm)

Binary

ADV7127KR140-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.4 V

Yes

1

CMOS

10

0.0977 %

Parallel, Word

3.3 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0 V

0.705 in (17.9 mm)

Binary

5962-91764023A

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

9.9853 V

Yes

4

BICMOS

12

13 mA

0.0366 %

Parallel, Word

15 V

-15 V

Chip Carrier

6 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

-9.9902 V

0.45 in (11.43 mm)

Binary

LTC1597BCG#TR

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

16

0.0015 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e0

-10 V

0.402 in (10.2 mm)

Binary

AD7544SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T28

No

e0

Binary

AD7846JN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

16

9 µs

0.0244 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP28,.6

Other Converters

7 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.425 in (36.203 mm)

Binary, Offset Binary

AD7845KP-REEL

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

225 °C (437 °F)

-10 V

0.453 in (11.5062 mm)

Binary, Offset Binary

AD9712BSQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

Bipolar

12

183 mA

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD9760ARUZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

1.25 V

Yes

1

CMOS

10

0.0977 %

Parallel, Word

5 V

5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

35 ns

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

-1 V

0.382 in (9.7 mm)

Binary

AD7228TE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

10 V

Yes

1

MOS

8

5 µs

22 mA

0.391 %

Parallel, 8 Bits

12/15, GND/-5 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0 V

0.45 in (11.43 mm)

Binary

AD9700SE

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

0 V

Yes

1

Bipolar

8

12 ns

155 mA

0.2 %

Parallel, 8 Bits

-5.2 V

-5.2 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-.6375 V

0.45 in (11.43 mm)

Complementary Binary

DAC8408GBC

Analog Devices

Digital to Analog converter

Other

No Lead

28

DIE

Rectangular

Yes

4

CMOS

MIL-STD-883 Class B (Modified)

8

1 mA

0.0977 %

Parallel, 8 Bits

5 V

5 V

Uncased Chip

DIE OR CHIP

Other Converters

190 ns

25 °C (77 °F)

25 °C (77 °F)

Tin Lead

Upper

R-XUUC-N28

No

e0

Binary, Offset Binary

5962-9091102M3X

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

1

MIL-STD-883

12

0.0427 %

Parallel, Word

5 V

-5.2 V

Chip Carrier

22 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary

AD7848JP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

3 V

Yes

1

MOS

12

4 µs

13 mA

0.024 %

Parallel, Word

5 V

±5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

-3 V

0.453 in (11.5062 mm)

2's Complement Binary

LTC1591-1IG#PBF

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

0.0061 %

Parallel, Word

5 V

Small Outline, Shrink Pitch

1 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

0.402 in (10.2 mm)

Binary

AD395SM

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Metal

10 V

No

4

CMOS

MIL-STD-883 Class B

12

15 µs

28 mA

0.0732 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDIP-T28

0.205 in (5.21 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.57 in (39.88 mm)

Binary

AD7522KD

Analog Devices

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

10

0.0977 %

Serial, Parallel, Word

15 V

5,15 V

In-Line

DIP28,.6

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.6 in (15.24 mm)

No

e0

1.397 in (35.49 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.