28 Digital-to-Analog Converters 1,923

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MX667KEPI

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

4 µs

12 mA

0.01 %

±12/±15 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T28

e0

Binary, Offset Binary

MX667JEWI

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

12 mA

0.02 %

±12/±15 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

No

e0

Binary, Offset Binary

MX667KEQI

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

12 mA

0.01 %

±12/±15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

MAX5185BEEI+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

10

0.1953 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9116 mm)

No

-.3 V

0.39 in (9.9 mm)

Binary

MAX5189BEEI+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

8

0.3906 %

Parallel, 8 Bits

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-.3 V

0.389 in (9.89 mm)

Binary

MX7537LP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

30 s

260 °C (500 °F)

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MX7845JP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.572 mm)

0.453 in (11.506 mm)

No

e3

245 °C (473 °F)

-10 V

0.453 in (11.506 mm)

Binary

MAX5595EUI+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

2.625 V

Yes

1

BICMOS

8

4 µs

8 mA

0.1953 %

Serial

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

2 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.382 in (9.7 mm)

Binary

MX7536KP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

0.453 in (11.505 mm)

Offset Binary

AD7535JCWI

Analog Devices

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

14

1.5 µs

4 mA

0.012 %

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

No

e0

Binary, Offset Binary

MX7538KP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

0.453 in (11.505 mm)

Binary

MX667JEQI

Analog Devices

Digital to Analog converter

Industrial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

12 mA

0.02 %

±12/±15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

MX7536KP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

0.453 in (11.505 mm)

Offset Binary

MX767JP

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

12 mA

0.02 %

±12/±15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary, Offset Binary

MX7535JEWI

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

800 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

-10 V

0.705 in (17.9 mm)

Binary, Offset Binary

MX7547LP+T

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5591BEUI+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

2.625 V

Yes

1

BICMOS

12

6 µs

8 mA

0.0977 %

Serial

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.382 in (9.7 mm)

Binary

MAX5593EUI+

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

2.625 V

Yes

1

BICMOS

10

6 µs

8 mA

0.0977 %

Serial

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

2.5 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.382 in (9.7 mm)

Binary

MX7535JP+

Analog Devices

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

MAX5591AEUI+T

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

12

6 µs

8 mA

0.0244 %

Parallel, Word

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

20 s

240 °C (464 °F)

0 V

0.382 in (9.7 mm)

Binary

TDC1112R3C

Onsemi

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1.2 V

Yes

1

Hybrid

12

35 ns

180 mA

0.096 %

Parallel, Word

-5.2 V

Chip Carrier

LDCC28,.5SQ

25 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.505 mm)

-1.2 V

0.453 in (11.505 mm)

Binary

TDC1112R3C2

Onsemi

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1.2 V

Yes

1

Hybrid

12

35 ns

180 mA

0.048 %

Parallel, Word

-5.2 V

Chip Carrier

LDCC28,.5SQ

25 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.505 mm)

-1.2 V

0.453 in (11.505 mm)

Binary

TDC1112R3C1

Onsemi

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1.2 V

Yes

1

Hybrid

12

35 ns

180 mA

0.048 %

Parallel, Word

-5.2 V

Chip Carrier

LDCC28,.5SQ

25 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.505 mm)

-1.2 V

0.453 in (11.505 mm)

Binary

TDC1112R3C3

Onsemi

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

1.2 V

Yes

1

Hybrid

12

35 ns

180 mA

0.024 %

Parallel, Word

-5.2 V

Chip Carrier

LDCC28,.5SQ

25 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.505 mm)

-1.2 V

0.453 in (11.505 mm)

Binary

IMSG176P-65

STMicroelectronics

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

15.3 ns

190 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

Binary

IMSG176P-66S

STMicroelectronics

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

25 ns

155 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

Binary

TS9370IFN30

STMicroelectronics

Digital to Analog converter

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

3

MOS

4

15 ns

95.2 mA

5 V

5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary

TS9370IP20

STMicroelectronics

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

MOS

4

20 ns

95.2 mA

5 V

5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

Binary

IMSG176P-40

STMicroelectronics

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

25 ns

155 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

Binary

TS9370CP45

STMicroelectronics

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

MOS

4

10 ns

95.2 mA

5 V

5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

Binary

TS9370IFN20

STMicroelectronics

Digital to Analog converter

Other

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

3

MOS

4

20 ns

95.2 mA

5 V

5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Quad

S-PQCC-J28

No

e0

Binary

IMSG176P-50

STMicroelectronics

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

20 ns

160 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

Binary

TS9370IP30

STMicroelectronics

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

MOS

4

15 ns

95.2 mA

5 V

5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

Binary

IMSG176P-50S

STMicroelectronics

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

25 ns

155 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

Binary

IMSG176P-40S

STMicroelectronics

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

6

25 ns

155 mA

0.78 %

5 V

5 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

No

e0

Binary

TDA1541

NXP Semiconductors

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

2

16

Serial

5 V

-5 V

In-Line

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Dual

R-PDIP-T28

0.201 in (5.1 mm)

0.6 in (15.24 mm)

No

1.398 in (35.5 mm)

Offset Binary, 2's Complement Binary

TDA1388TZ

NXP Semiconductors

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

20

Serial

5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G28

0.079 in (2 mm)

0.209 in (5.3 mm)

No

0.402 in (10.2 mm)

Binary

TDA1388M-T

NXP Semiconductors

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

1.1 V

Yes

1

CMOS

18

Serial

5 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Nickel Palladium Gold

Dual

R-PDSO-G28

0.079 in (2 mm)

0.209 in (5.3 mm)

No

e4

.9 V

0.402 in (10.2 mm)

Binary

TDA8776AK

NXP Semiconductors

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

2.5 V

Yes

1

10

145 mA

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

1.7 V

0.453 in (11.5062 mm)

Binary

TDA1548TZ-T

NXP Semiconductors

Digital to Analog converter

Commercial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

20

Serial

3 V

Small Outline, Shrink Pitch

0.026 in (0.65 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G28

0.079 in (2 mm)

0.209 in (5.3 mm)

No

0.402 in (10.2 mm)

Binary

TDA8776AKA-T

NXP Semiconductors

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

2.5 V

Yes

1

10

0.0488 %

Parallel, Word

-5.2 V

Chip Carrier

2 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead (Sn85Pb15)

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

1.7 V

0.453 in (11.5062 mm)

Binary

TDA8776K

NXP Semiconductors

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

2.5 V

Yes

1

10

0.0488 %

Parallel, Word

-5.2 V

-5.2 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

e0

1.7 V

0.453 in (11.5062 mm)

Binary

TDA8776AK/C1

NXP Semiconductors

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

2.5 V

Yes

1

10

0.0488 %

Parallel, Word

-5.2 V

Chip Carrier

2 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.5062 mm)

No

1.7 V

0.453 in (11.5062 mm)

Binary

TDA1541AN

NXP Semiconductors

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

16

50 mA

0.0163 %

Serial

5 V

-5 V

In-Line

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

1.437 in (36.51 mm)

Offset Binary, 2's Complement Binary

TDA1548TD-T

NXP Semiconductors

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

20

Serial

3 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.705 in (17.9 mm)

Binary

TDA1305T-T

NXP Semiconductors

Digital to Analog converter

Other

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

20

40 mA

Serial

5 V

Small Outline

0.05 in (1.27 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

0.705 in (17.9 mm)

Binary

TDA1546T-T

NXP Semiconductors

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.575 V

Yes

1

CMOS

20

Serial

5 V

Small Outline

0.05 in (1.27 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

1.425 V

0.705 in (17.9 mm)

Binary

TDA1546T

NXP Semiconductors

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

1.575 V

Yes

1

CMOS

20

Serial

5 V

5 V

Small Outline

SOP28,.4

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

-20 °C (-4 °F)

Dual

R-PDSO-G28

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

1.425 V

0.705 in (17.9 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.