28 Digital-to-Analog Converters 1,923

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MX7535BD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

-10 V

Binary, Offset Binary

MAX5188BEEI-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

8

0.3906 %

Parallel, 8 Bits

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

-.3 V

0.389 in (9.89 mm)

Binary

MX7536JN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

1

0.175 in (4.445 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Offset Binary

MX7228KP+T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

8

CMOS

8

5 µs

38 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

245 °C (473 °F)

0 V

0.453 in (11.505 mm)

Binary

MX7537TE

Maxim Integrated

Digital to Analog converter

Commercial

No Lead

28

QCCN

Rectangular

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LCC28,.45SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

R-XQCC-N28

1

0.1 in (2.54 mm)

0.451 in (11.4554 mm)

No

e0

0.451 in (11.455 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5591BEUI-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

12

6 µs

8 mA

0.0977 %

Parallel, Word

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

20 s

240 °C (464 °F)

0 V

0.382 in (9.7 mm)

Binary

MX7536JCWI-T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Small Outline

SOP28,.5

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.705 in (17.9 mm)

Offset Binary

MX7845JP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

-10 V

0.453 in (11.505 mm)

Binary

MX7535SD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

-10 V

Binary, Offset Binary

MX390JD

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

Hybrid

12

8 µs

50 mA

0.0183 %

Parallel, Word

15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T28

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

MX7536KN

Maxim Integrated

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

1

0.175 in (4.445 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Offset Binary

MX7547JP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5595EUI-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

8

4 µs

8 mA

0.1953 %

Parallel, 8 Bits

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

20 s

240 °C (464 °F)

0 V

0.382 in (9.7 mm)

Binary

MX7536KCWI

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.705 in (17.9 mm)

Offset Binary

MX390TD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

Hybrid

12

8 µs

50 mA

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

DIP28,.6

Other Converters

4 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

MX7225KP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

4

CMOS

8

4 µs

10 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

0.453 in (11.505 mm)

Binary

MAX5185BEEI

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

CMOS

10

0.1953 %

Parallel, Word

3 V

3 V

Small Outline, Shrink Pitch

SSOP28,.25

Other Converters

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

-.3 V

0.389 in (9.89 mm)

Binary

MX7535KP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

MAX5189BEEI

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

8

0.3906 %

Parallel, 8 Bits

3 V

3 V

Small Outline, Shrink Pitch

SSOP28,.25

Other Converters

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

-.3 V

0.389 in (9.89 mm)

Binary

MX7845KP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

245 °C (473 °F)

-10 V

0.453 in (11.505 mm)

Binary

MAX514AEWI+

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

1 µs

0.0244 %

Serial

5 V

Small Outline

250 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

Binary, Offset Binary, 2's Complement Binary

5962-89657033C

Maxim Integrated

Digital to Analog converter

Military

No Lead

28

QCCN

Rectangular

Ceramic, Metal-Sealed Cofired

Yes

1

CMOS

MIL-STD-883

12

0.0244 %

Parallel, Word

15 V

Chip Carrier

125 °C (257 °F)

-55 °C (-67 °F)

Quad

R-CQCC-N28

No

Binary

MAX5188BEEI+

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

8

0.3906 %

Parallel, 8 Bits

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e3

30 s

260 °C (500 °F)

-.3 V

0.389 in (9.89 mm)

Binary

MX7537KP+T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

30 s

260 °C (500 °F)

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MX7547KP+

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

245 °C (473 °F)

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

DS4426T+T&R

Maxim Integrated

Digital to Analog converter

Industrial

No Lead

28

HVQCCN

Square

4.75 V

Yes

1

7

900 μA

0.7812 %

Serial

3.6 V

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

Other Converters

0.016 in (0.4 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N28

1

0.031 in (0.8 mm)

0.157 in (4 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

MX7536SD

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Gold Over Nickel

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e4

245 °C (473 °F)

Offset Binary

MX7537KP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0122 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

245 °C (473 °F)

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MX7535AD

Maxim Integrated

Digital to Analog converter

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

1

0.232 in (5.89 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary, Offset Binary

MAX5180BEEI-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

10

0.1953 %

Parallel, Word

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

245 °C (473 °F)

-.3 V

0.389 in (9.89 mm)

Binary

MAX5593EUI

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

10

6 µs

0.0977 %

Parallel, Word

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

245 °C (473 °F)

0 V

0.382 in (9.7 mm)

Binary

MX7536JP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

0.453 in (11.505 mm)

Offset Binary

MAX5188BEEI

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

8

0.3906 %

Parallel, 8 Bits

3 V

3 V

Small Outline, Shrink Pitch

SSOP28,.25

Other Converters

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e0

-.3 V

0.389 in (9.89 mm)

Binary

MX7845JP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0244 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

-10 V

0.453 in (11.505 mm)

Binary

MAX5591AEUI

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

12

6 µs

0.0244 %

Parallel, Word

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

245 °C (473 °F)

0 V

0.382 in (9.7 mm)

Binary

MAX514BEWI-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

1 µs

2 mA

0.0244 %

Serial

5 V

5 V

Small Outline

SOP28,.4

Other Converters

250 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e0

0.705 in (17.9 mm)

Binary, Offset Binary, 2's Complement Binary

MAX514BEWI+T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

1 µs

0.024 %

Serial

5 V

Small Outline

250 ns

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

30 s

260 °C (500 °F)

0.705 in (17.9 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5189BEEI-T

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

SSOP

Rectangular

Plastic/Epoxy

.8 V

Yes

1

8

0.3906 %

Parallel, 8 Bits

3 V

Small Outline, Shrink Pitch

25 ns

0.025 in (0.635 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.068 in (1.73 mm)

0.154 in (3.9 mm)

No

e0

-.3 V

0.389 in (9.89 mm)

Binary

MAX514BCWI+T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

Yes

4

CMOS

12

1 µs

2 mA

0.024 %

Serial

5 V

5 V

Small Outline

SOP28,.4

Other Converters

250 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

0.705 in (17.9 mm)

Binary, Offset Binary, 2's Complement Binary

MX7245JP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

-5 V

0.453 in (11.505 mm)

Binary

MX7535JCWI+

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

-10 V

0.705 in (17.9 mm)

Binary, Offset Binary

MX7535KP+

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

245 °C (473 °F)

-10 V

0.453 in (11.505 mm)

Binary, Offset Binary

MX7228KP+

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

8

CMOS

8

5 µs

38 mA

0.3906 %

Parallel, 8 Bits

15 V

12/15, GND/-5 V

-5 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

245 °C (473 °F)

0 V

0.453 in (11.505 mm)

Binary

MX7535JCWI+T

Maxim Integrated

Digital to Analog converter

Commercial

Gull Wing

28

SOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Small Outline

SOP28,.4

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDSO-G28

1

0.104 in (2.65 mm)

0.295 in (7.5 mm)

No

e3

-10 V

0.705 in (17.9 mm)

Binary, Offset Binary

MX7845KP-T

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

10 V

Yes

1

BICMOS

12

5 µs

10 mA

0.0183 %

Parallel, Word

15 V

±15 V

-15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

2.5 µs

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

-10 V

0.453 in (11.505 mm)

Binary

MX7537JP

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

2

CMOS

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e0

245 °C (473 °F)

0.453 in (11.505 mm)

Binary, Offset Binary, 2's Complement Binary

MAX5591BEUI

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

28

TSSOP

Rectangular

Plastic/Epoxy

5.25 V

Yes

1

BICMOS

12

6 µs

0.0977 %

Parallel, Word

3 V

2/5,3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP28,.25

Other Converters

3 µs

0.026 in (0.65 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G28

1

0.043 in (1.1 mm)

0.173 in (4.4 mm)

No

e0

245 °C (473 °F)

0 V

0.382 in (9.7 mm)

Binary

MX7536JP+

Maxim Integrated

Digital to Analog converter

Commercial

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

CMOS

14

1.5 µs

4 mA

0.0122 %

Parallel, Word

12/15,GND/-0.3 V

Chip Carrier

LDCC28,.5SQ

Other Converters

800 ns

0.05 in (1.27 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Quad

S-PQCC-J28

1

0.18 in (4.57 mm)

0.453 in (11.505 mm)

No

e3

245 °C (473 °F)

0.453 in (11.505 mm)

Offset Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.