Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
Digital to Analog converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0061 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Gold Over Nickel |
Dual |
R-CDIP-T28 |
1 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e4 |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
.8 V |
Yes |
1 |
8 |
0.3906 % |
Parallel, 8 Bits |
3 V |
Small Outline, Shrink Pitch |
25 ns |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
-.3 V |
0.389 in (9.89 mm) |
Binary |
|||||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
1 |
0.175 in (4.445 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.45 in (36.83 mm) |
Offset Binary |
||||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
8 |
CMOS |
8 |
5 µs |
38 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e3 |
245 °C (473 °F) |
0 V |
0.453 in (11.505 mm) |
Binary |
|||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
No Lead |
28 |
QCCN |
Rectangular |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LCC28,.45SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
R-XQCC-N28 |
1 |
0.1 in (2.54 mm) |
0.451 in (11.4554 mm) |
No |
e0 |
0.451 in (11.455 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.25 V |
Yes |
1 |
BICMOS |
12 |
6 µs |
8 mA |
0.0977 % |
Parallel, Word |
3 V |
2/5,3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Other Converters |
3 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0 V |
0.382 in (9.7 mm) |
Binary |
|||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
Small Outline |
SOP28,.5 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.705 in (17.9 mm) |
Offset Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
BICMOS |
12 |
5 µs |
10 mA |
0.0244 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
-10 V |
0.453 in (11.505 mm) |
Binary |
||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold Over Nickel |
Dual |
R-CDIP-T28 |
1 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e4 |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
4 |
Hybrid |
12 |
8 µs |
50 mA |
0.0183 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
4 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0061 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
1 |
0.175 in (4.445 mm) |
0.6 in (15.24 mm) |
No |
e0 |
1.45 in (36.83 mm) |
Offset Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.25 V |
Yes |
1 |
BICMOS |
8 |
4 µs |
8 mA |
0.1953 % |
Parallel, 8 Bits |
3 V |
2/5,3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Other Converters |
3 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin/Lead |
Dual |
R-PDSO-G28 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
0 V |
0.382 in (9.7 mm) |
Binary |
|||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0061 % |
Parallel, Word |
12/15,GND/-0.3 V |
Small Outline |
SOP28,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.705 in (17.9 mm) |
Offset Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
4 |
Hybrid |
12 |
8 µs |
50 mA |
0.0122 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
4 µs |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
4 |
CMOS |
8 |
4 µs |
10 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
.8 V |
Yes |
1 |
CMOS |
10 |
0.1953 % |
Parallel, Word |
3 V |
3 V |
Small Outline, Shrink Pitch |
SSOP28,.25 |
Other Converters |
25 ns |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
245 °C (473 °F) |
-.3 V |
0.389 in (9.89 mm) |
Binary |
||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0061 % |
Parallel, Word |
12/15,GND/-0.3 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
-10 V |
0.453 in (11.505 mm) |
Binary, Offset Binary |
||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
.8 V |
Yes |
1 |
8 |
0.3906 % |
Parallel, 8 Bits |
3 V |
3 V |
Small Outline, Shrink Pitch |
SSOP28,.25 |
Other Converters |
25 ns |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.068 in (1.73 mm) |
0.154 in (3.9 mm) |
No |
e0 |
245 °C (473 °F) |
-.3 V |
0.389 in (9.89 mm) |
Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
BICMOS |
12 |
5 µs |
10 mA |
0.0183 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
245 °C (473 °F) |
-10 V |
0.453 in (11.505 mm) |
Binary |
|||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
4 |
CMOS |
12 |
1 µs |
0.0244 % |
Serial |
5 V |
Small Outline |
250 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
0.705 in (17.9 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
No Lead |
28 |
QCCN |
Rectangular |
Ceramic, Metal-Sealed Cofired |
Yes |
1 |
CMOS |
MIL-STD-883 |
12 |
0.0244 % |
Parallel, Word |
15 V |
Chip Carrier |
125 °C (257 °F) |
-55 °C (-67 °F) |
Quad |
R-CQCC-N28 |
No |
Binary |
|||||||||||||||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
.8 V |
Yes |
1 |
8 |
0.3906 % |
Parallel, 8 Bits |
3 V |
Small Outline, Shrink Pitch |
25 ns |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
-.3 V |
0.389 in (9.89 mm) |
Binary |
||||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.453 in (11.505 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e3 |
245 °C (473 °F) |
0.453 in (11.505 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
No Lead |
28 |
HVQCCN |
Square |
4.75 V |
Yes |
1 |
7 |
900 μA |
0.7812 % |
Serial |
3.6 V |
3/5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC28,.16SQ,16 |
Other Converters |
0.016 in (0.4 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N28 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0 V |
0.157 in (4 mm) |
Binary |
||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Military |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Gold Over Nickel |
Dual |
R-CDIP-T28 |
1 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e4 |
245 °C (473 °F) |
Offset Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
245 °C (473 °F) |
0.453 in (11.505 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Other |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
In-Line |
DIP28,.6 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
85 °C (185 °F) |
-25 °C (-13 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
1 |
0.232 in (5.89 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Binary, Offset Binary |
|||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
.8 V |
Yes |
1 |
10 |
0.1953 % |
Parallel, Word |
3 V |
Small Outline, Shrink Pitch |
25 ns |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.068 in (1.73 mm) |
0.154 in (3.9 mm) |
No |
e0 |
245 °C (473 °F) |
-.3 V |
0.389 in (9.89 mm) |
Binary |
||||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.25 V |
Yes |
1 |
BICMOS |
10 |
6 µs |
0.0977 % |
Parallel, Word |
3 V |
2/5,3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Other Converters |
3 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.382 in (9.7 mm) |
Binary |
|||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
Offset Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
.8 V |
Yes |
1 |
8 |
0.3906 % |
Parallel, 8 Bits |
3 V |
3 V |
Small Outline, Shrink Pitch |
SSOP28,.25 |
Other Converters |
25 ns |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
-.3 V |
0.389 in (9.89 mm) |
Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
BICMOS |
12 |
5 µs |
10 mA |
0.0244 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
-10 V |
0.453 in (11.505 mm) |
Binary |
|||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.25 V |
Yes |
1 |
BICMOS |
12 |
6 µs |
0.0244 % |
Parallel, Word |
3 V |
2/5,3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Other Converters |
3 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.382 in (9.7 mm) |
Binary |
|||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
4 |
CMOS |
12 |
1 µs |
2 mA |
0.0244 % |
Serial |
5 V |
5 V |
Small Outline |
SOP28,.4 |
Other Converters |
250 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.705 in (17.9 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
4 |
CMOS |
12 |
1 µs |
0.024 % |
Serial |
5 V |
Small Outline |
250 ns |
0.05 in (1.27 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
30 s |
260 °C (500 °F) |
0.705 in (17.9 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
SSOP |
Rectangular |
Plastic/Epoxy |
.8 V |
Yes |
1 |
8 |
0.3906 % |
Parallel, 8 Bits |
3 V |
Small Outline, Shrink Pitch |
25 ns |
0.025 in (0.635 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.068 in (1.73 mm) |
0.154 in (3.9 mm) |
No |
e0 |
-.3 V |
0.389 in (9.89 mm) |
Binary |
|||||||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
4 |
CMOS |
12 |
1 µs |
2 mA |
0.024 % |
Serial |
5 V |
5 V |
Small Outline |
SOP28,.4 |
Other Converters |
250 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
0.705 in (17.9 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 V |
Yes |
1 |
BICMOS |
12 |
5 µs |
12 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15,GND/-12/-15 V |
-15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
-5 V |
0.453 in (11.505 mm) |
Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
Small Outline |
SOP28,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
-10 V |
0.705 in (17.9 mm) |
Binary, Offset Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0061 % |
Parallel, Word |
12/15,GND/-0.3 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e3 |
245 °C (473 °F) |
-10 V |
0.453 in (11.505 mm) |
Binary, Offset Binary |
||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
8 |
CMOS |
8 |
5 µs |
38 mA |
0.3906 % |
Parallel, 8 Bits |
15 V |
12/15, GND/-5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e3 |
245 °C (473 °F) |
0 V |
0.453 in (11.505 mm) |
Binary |
|||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
Small Outline |
SOP28,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDSO-G28 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e3 |
-10 V |
0.705 in (17.9 mm) |
Binary, Offset Binary |
|||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
BICMOS |
12 |
5 µs |
10 mA |
0.0183 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
-10 V |
0.453 in (11.505 mm) |
Binary |
||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
245 °C (473 °F) |
0.453 in (11.505 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||
Maxim Integrated |
Digital to Analog converter |
Industrial |
Gull Wing |
28 |
TSSOP |
Rectangular |
Plastic/Epoxy |
5.25 V |
Yes |
1 |
BICMOS |
12 |
6 µs |
0.0977 % |
Parallel, Word |
3 V |
2/5,3/5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP28,.25 |
Other Converters |
3 µs |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G28 |
1 |
0.043 in (1.1 mm) |
0.173 in (4.4 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.382 in (9.7 mm) |
Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
1 |
CMOS |
14 |
1.5 µs |
4 mA |
0.0122 % |
Parallel, Word |
12/15,GND/-0.3 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e3 |
245 °C (473 °F) |
0.453 in (11.505 mm) |
Offset Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.