DIP Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5351ACPA

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

3.3 V

No

1

CMOS

13

400 μA

0.0122 %

Serial

3.3 V

3.3 V

In-Line

DIP8,.3

Other Converters

16 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.369 in (9.375 mm)

Binary

MAX520EPE

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

4

8

Serial

5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.755 in (19.175 mm)

Binary

MAX5140IPG

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

220 mA

0.37 %

Parallel, 8 Bits

-5.2 V

-5.2 V

In-Line

DIP24,.3

Other Converters

4 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-20 °C (-4 °F)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

Binary

MX7531JD

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.2 %

Parallel, Word

15 V

15 V

In-Line

DIE OR CHIP

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T18

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MAX518ACPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

2

BICMOS

8

5 mA

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

6 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

MAX536ACPE+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

4

12

25 mA

0.0122 %

Serial

15 V

12,-5 V

-5 V

In-Line

DIP16,.3

Other Converters

3 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7541SQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.024 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

MAX7533CD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

0.05 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

5962-8770001EC

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

8

1.9531 %

Parallel, 8 Bits

5 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Dual

R-CDIP-T16

No

e4

Binary, Offset Binary

MAX525BEPP+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

980 μA

0.0244 %

Serial

5 V

5 V

In-Line

DIP20,.3

Other Converters

12 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

1.03 in (26.16 mm)

Binary, Offset Binary

MAX522CPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

2

BICMOS

8

2.8 mA

0.5859 %

Serial

3.6 V

3/5 V

In-Line

DIP8,.3

Other Converters

70 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.369 in (9.375 mm)

Binary

MX7245JN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

BICMOS

12

5 µs

12 mA

0.0244 %

Parallel, Word

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

1.203 in (30.545 mm)

Binary

MAX502MJG

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

10 V

No

1

12

Parallel, Word

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.25 in (31.75 mm)

Binary

MX7541ATQ/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

MAX527CENG

Analog Devices

Digital to Analog Converter 12 bit

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

18 mA

0.0122 %

Parallel, Word

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.203 in (30.545 mm)

Binary

MAX514JI

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

12

0.0122 %

Serial

5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-GDIP-T28

0.23 in (5.842 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Binary

MAX7533TD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

0.1 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

MAX514PI

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

0.0122 %

Serial

5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.175 in (4.445 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

Binary

MX7543GTD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Serial

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary, Offset Binary

MX7521LQ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0.96 in (24.38 mm)

Binary, Offset Binary

MAX517AEPA+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

BICMOS

8

3.5 mA

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

6 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

MP7645CQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

20

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T20

e0

Binary

MAX501CPG

Analog Devices

Digital to Analog converter

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

12

Parallel, Word

In-Line

0.1 in (2.54 mm)

Tin Lead

Dual

R-PDIP-T24

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.25 in (31.75 mm)

Binary

MX7524TD-T

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

8

0.1953 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7542GKN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.755 in (19.175 mm)

Binary, Offset Binary

MAX544BCPA+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

3 V

No

1

CMOS

14

1.1 mA

0.0031 %

Serial

5 V

5 V

In-Line

DIP8,.3

Other Converters

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Offset Binary

MX7547JN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

2

CMOS

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

15 V

12/15 V

In-Line

DIP24,.3

Other Converters

800 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

Binary, Offset Binary, 2's Complement Binary

MAX510BCPE+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

5 V

No

4

8

10 mA

0.037 %

Serial

5 V

5/±5 V

-5 V

In-Line

DIP16,.3

Other Converters

6 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-5 V

0.755 in (19.175 mm)

Binary

MAX500BEPE+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

8

4.5 µs

22 mA

0.3906 %

Serial

15 V

11.4/16.5,GND/-5 V

-5 V

In-Line

DIP16,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MAX550BBCPA

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

10 μA

Serial

In-Line

4 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T8

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.369 in (9.375 mm)

Binary

MX7624EPE

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

8

2.5 mA

0.1953 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

0.755 in (19.175 mm)

Binary, Offset Binary

MAX500ACPE+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

8

4.5 µs

22 mA

0.1953 %

Serial

15 V

11.4/16.5,GND/-5 V

-5 V

In-Line

DIP16,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MAX548AEPA+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

2

8

Serial

In-Line

4 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T8

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.369 in (9.375 mm)

Binary

5962-8770002EC

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

8

1.9531 %

Parallel, 8 Bits

5 V

In-Line

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Dual

R-GDIP-T16

No

e4

Binary, Offset Binary

MAX7533AD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

0.2 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T16

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Offset Binary

MX7521LD

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

2 mA

0.05 %

Parallel, Word

15 V

In-Line

DIP18,.3

500 ns

3.937 in (100 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-GDIP-T18

1

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

0.96 in (24.38 mm)

Binary, Offset Binary

MAX542BCPD+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

2.5 V

No

1

CMOS

16

1.1 mA

0.0031 %

Serial

5 V

5 V

In-Line

DIP14,.3

Other Converters

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T14

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.75 in (19.05 mm)

Offset Binary

MAX526DCNG+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

28 mA

0.024 %

15,-5 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

e3

30 s

260 °C (500 °F)

Binary

MX7545ATQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

In-Line

DIP20,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

Binary, 2's Complement Binary

MX7541JN+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.0244 %

Parallel, Word

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T18

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0.9 in (22.86 mm)

Binary, Offset Binary

MAX5250AEPP+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

10

980 μA

0.0488 %

Serial

5 V

5 V

In-Line

DIP20,.3

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

1.03 in (26.16 mm)

Binary, Offset Binary

MAX527DCNG+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

18 mA

0.0244 %

Parallel, Word

5 V

±5 V

-5 V

In-Line

DIP24,.3

Other Converters

5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

1.203 in (30.545 mm)

Binary

MAX529EPP+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

3 V

No

8

BICMOS

8

2 µs

9 mA

0.3906 %

Serial

5 V

5,GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

1 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

1.03 in (26.16 mm)

Binary

MAX542ACPD+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

2.5 V

No

1

CMOS

16

1.1 mA

0.0015 %

Serial

5 V

5 V

In-Line

DIP14,.3

Other Converters

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin - annealed

Dual

R-PDIP-T14

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.75 in (19.05 mm)

Offset Binary

MX7538BD

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

14

1.5 µs

4 mA

0.0061 %

Parallel, Word

12/15,-0.3 V

In-Line

DIP24,.6

Other Converters

800 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Gold Over Nickel

Dual

R-CDIP-T24

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

Binary

MAX500AEPE+

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

8

4.5 µs

22 mA

0.1953 %

Serial

15 V

11.4/16.5,GND/-5 V

-5 V

In-Line

DIP16,.3

Other Converters

2.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin - annealed

Dual

R-PDIP-T16

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

0 V

0.755 in (19.175 mm)

Binary

MX7530LQ

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

10

2 mA

0.05 %

Parallel, Word

15 V

15 V

In-Line

DIP16,.3

Other Converters

500 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MAX257CENG

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

4

CMOS

12

18 mA

0.0122 %

Parallel, 8 Bits

5 V

-5 V

In-Line

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.225 in (5.72 mm)

0.3 in (7.62 mm)

No

e0

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.