DIP Digital-to-Analog Converters 2,400+

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC8221AW/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883

12

2 mA

0.0122 %

Parallel, Word

5 V

5/15 V

In-Line

DIP24,.3

Other Converters

450 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.3 in (7.62 mm)

No

e0

Offset Binary

AD9713AKN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

2 V

No

1

Bipolar

12

170 mA

0.024 %

Parallel, Word

5 V

5,-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

27 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-1.2 V

1.472 in (37.4 mm)

Binary

DAC8413EPZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

4

BICMOS

12

12 mA

0.0244 %

Parallel, Word

5 V

5/±15 V

-5 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e3

1.472 in (37.4 mm)

Binary

AD7248ATQ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

5 V

No

1

CMOS

MIL-STD-883 Class B

12

10 µs

12 mA

0.0183 %

Parallel, 8 Bits

15 V

12/15,GND/-12/-15 V

-15 V

In-Line

DIP20,.3

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.953 in (24.195 mm)

Binary

LTC1650ACN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

4.096 V

No

1

CMOS

16

0.0122 %

Serial

5 V

-5 V

In-Line

4 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-4.096 V

Binary

LTC8143EN#PBF

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0122 %

Serial

5 V

In-Line

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

Binary, Offset Binary

AD7111KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

BICMOS

8

4 mA

Parallel, 8 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.793 in (20.13 mm)

Binary

5962-01-137-1522

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T18

No

Binary, Offset Binary

5962-01-337-6509

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

800 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

DAC8043AZ/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

12

1 µs

500 μA

0.0122 %

Serial

5 V

In-Line

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

ADDAC85MIL-CBI-V/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

No

1

Bipolar

38535Q/M;38534H;883B

12

7 µs

0.018 %

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-XDIP-T24

No

e0

Complementary Binary, Complementary Offset Binary

AD371KD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

18

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

CMOS

12

0.0244 %

Parallel, Word

15 V

-15 V

In-Line

DIP18,.3

Other Converters

25 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T18

0.21 in (5.334 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.992 in (25.197 mm)

Binary

AD7547CQ/883B

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic

No

2

CMOS

MIL-STD-883 Class B

12

1.5 µs

2 mA

0.0244 %

Parallel, Word

12 V

In-Line

DIP24,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Dual

R-GDIP-T24

0.225 in (5.715 mm)

0.295 in (7.49 mm)

1.29 in (32.77 mm)

Binary

AD1860N

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

3.12 V

No

1

BIMOS

18

15 mA

Serial

5 V

±5/±12 V

-5 V

In-Line

DIP16,.3

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-3.12 V

0.793 in (20.13 mm)

2's Complement Binary

AD7303BNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5.5 V

No

1

CMOS

8

2 µs

3.5 mA

0.3906 %

Serial

3 V

3/5 V

In-Line

DIP8,.3

Other Converters

1.2 µs

0.1 in (2.54 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0 V

0.389 in (9.88 mm)

Binary

5962-01-181-4856

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Metal

No

1

ECL

8

10 ns

360 mA

-5.2 V

-5.2 V

In-Line

DIP24,.6

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-MDIP-T24

No

Complementary Binary

5962-01-203-4877

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

10

0.05 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

DAC-86EX

Analog Devices

Digital to Analog converter

Other

Through-Hole

18

DIP

Rectangular

Ceramic, Glass-Sealed

18 V

No

1

Bipolar

8

9.3 mA

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP18,.3

Other Converters

1 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-GDIP-T18

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-5 V

Binary

5962-01-221-6728

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

10

2 mA

0.05 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T16

No

Binary, Offset Binary

PM7548BR/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

No

1

CMOS

MIL-STD-883 Class B

12

0.0122 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

Binary, Offset Binary

ADDAC72C-COB-I

Analog Devices

Digital to Analog converter

Other

Pin/Peg

24

DIP

Rectangular

Metal

10 V

No

1

Bipolar

16

3 µs

55 mA

0.003 %

Parallel, Word

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP24,.6

Other Converters

3 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-MDMA-P24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Complementary Offset Binary

LTC1596ACN#PBF

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

16

0.0015 %

Serial

5 V

In-Line

1 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T16

1

0.155 in (3.937 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

-10 V

Binary, Offset Binary

AD7542JNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 µs

2.5 mA

0.0244 %

Parallel, 4 Bits

5 V

In-Line

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

0.793 in (20.13 mm)

Binary, Offset Binary

ADV101KN80

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

40

DIP

Rectangular

Plastic/Epoxy

No

3

CMOS

8

125 mA

0.3906 %

Parallel, 8 Bits

5 V

5 V

In-Line

DIP40,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T40

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

Binary

AD7542GKN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

16

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 µs

2.5 mA

0.0122 %

Parallel, 4 Bits

5 V

5 V

In-Line

DIP16,.3

Other Converters

250 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T16

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.793 in (20.13 mm)

Binary, Offset Binary

5962-01-316-1776

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

8

4 mA

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-XDIP-T16

No

Complementary Binary

DAC8043BIGP

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

0.0122 %

Serial

5 V

In-Line

250 ns

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0.389 in (9.88 mm)

Offset Binary

5962-01-376-4329

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

12

2 µs

2.5 mA

0.024 %

5 V

5 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Dual

R-XDIP-T16

No

Binary

LTC7545ABN#PBF

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

1 µs

2 mA

0.0122 %

Parallel, Word

15 V

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T20

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary, Offset Binary

DAC8426AR

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

8

14 mA

0.1953 %

Parallel, 8 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

AD561SD

Analog Devices

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

10

16 mA

0.05 %

Parallel, Word

5 V

5,-15 V

-15 V

In-Line

DIP16,.3

Other Converters

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T16

0.14 in (3.553 mm)

0.3 in (7.62 mm)

No

e0

-2 V

0.8 in (20.32 mm)

Binary

DAC8248GPZ

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

10 V

No

1

CMOS

12

1 µs

0.0122 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Matte Tin

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-10 V

1.2 in (30.48 mm)

Binary, Offset Binary

AD7520JD

Analog Devices

Digital to Analog converter

Other

Through-Hole

16

DIP

Rectangular

Ceramic

No

1

CMOS

10

2 mA

0.2 %

15 V

15 V

In-Line

DIP16,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-XDIP-T16

No

e0

Binary, Offset Binary

LTC7541ABN#PBF

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

18

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

2 mA

0.0122 %

Parallel, Word

15 V

In-Line

600 ns

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T18

1

0.15 in (3.81 mm)

0.3 in (7.62 mm)

No

e3

30 s

260 °C (500 °F)

Binary, Offset Binary

ADDAC71H-COB-V

Analog Devices

Digital to Analog converter

Other

Pin/Peg

24

DIP

Rectangular

Metal

10 V

No

1

Hybrid

16

10 µs

55 mA

0.003 %

Parallel, Word

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-MDMA-P24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Complementary Offset Binary

AD7537LN/+

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

2

BICMOS

12

1.5 µs

2 mA

0.012 %

12/15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T24

e0

Binary, Offset Binary

DAC8229AR/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

8

0.1953 %

Parallel, 8 Bits

-5 V

In-Line

2 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

PM7541ABX/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

1 µs

2 mA

0.012 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD7233BNZ

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

10 µs

10 mA

0.0122 %

Serial

12 V

±12/±15 V

-12 V

In-Line

DIP8,.3

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e3

-5 V

0.389 in (9.88 mm)

2's Complement Binary

HDD-0810MB

Analog Devices

Digital to Analog converter

Other

Through-Hole

32

DIP

Rectangular

Metal

No

1

Bipolar

38535Q/M;38534H;883B

8

In-Line

DIP32,.9

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin/Lead

Dual

R-MDIP-T32

No

e0

Binary

AD7536TQ

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

MOS

14

2 µs

4 mA

0.006 %

Parallel, Word

12/15,GND/-0.3 V

In-Line

DIP28,.6

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

1.399 in (35.54 mm)

Offset Binary

ADDAC72-COB-I

Analog Devices

Digital to Analog converter

Other

Pin/Peg

24

DIP

Rectangular

Metal

10 V

No

1

Bipolar

16

3 µs

55 mA

0.003 %

Parallel, Word

15 V

5,±15 V

-15 V

Microelectronic Assembly

DIP24,.6

Other Converters

3 µs

0.1 in (2.54 mm)

100 °C (212 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-MDMA-P24

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Complementary Offset Binary

DAC8222FP

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

15 V

No

1

CMOS

12

1 µs

2 mA

0.0244 %

Parallel, Word

5 V

5/15 V

In-Line

DIP24,.3

Other Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

0 V

1.2 in (30.48 mm)

Binary, Offset Binary

AD7233BN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

5 V

No

1

CMOS

12

10 µs

10 mA

0.0122 %

Serial

12 V

±12/±15 V

-12 V

In-Line

DIP8,.3

Other Converters

5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T8

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

-5 V

0.389 in (9.88 mm)

2's Complement Binary

AD7396AN

Analog Devices

Digital to Analog converter

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

No

1

CMOS

12

70 µs

200 μA

0.0488 %

Parallel, Word

3 V

3/5 V

In-Line

SDIP24,.3

Other Converters

70 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

Offset Binary

5962-8965703LX

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883

12

2 mA

Parallel, Word

15 V

In-Line

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

AD7521SD/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

18

DIP

Rectangular

Ceramic

No

1

CMOS

38535Q/M;38534H;883B

12

500 ns

2 mA

0.2 %

15 V

15 V

In-Line

DIP18,.3

Other Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T18

No

e0

Binary, Offset Binary

AD9712KN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

No

1

Bipolar

12

170 mA

0.043 %

-5.2 V

-5.2 V

In-Line

DIP28,.6

Other Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin/Lead

Dual

R-PDIP-T28

No

e0

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.